hybrid bonding


2024-12-17

[News] UMC Reportedly Wins Qualcomm Advanced Packaging Deal, Breaking TSMC’s Monopoly

United Microelectronics Corporation (UMC) is making significant strides in the advanced packaging sector, breaking new ground in a market traditionally dominated by TSMC. According to a report by Economic Daily News, UMC has secured a major advanced packaging order from Qualcomm for high-performance...

2024-07-15

[News] Equipment Manufacturers’ Global Race for Hybrid Bonding Opportunities

Global semiconductor giants are concentrating their R&D efforts on advanced packaging technologies to drive performance enhancements. According to a report from Commercial Times, as packaging technology progresses from 2.5D to 3D, chip stacking technologies have become a showcase for the competi...

2024-06-12

[News] Samsung Considers Hybrid Bonding a Must for 16-stack HBM

According to the latest report by TheElec, though Samsung has been using thermal compression (TC) bonding until its 12-stack HBM, the company now confirms its belief that hybrid bonding is necessary for manufacturing 16-stack HBM. Regarding its future HBM roadmap, Samsung reportedly plans to prod...

2024-06-04

[News] Fueled by AI Demand, TSMC Targets its System-on-Wafer Manufactured with CoWoS to Enter Mass Production in 2027

At TSMC’s 2024 Technology Symposium in late May, Kevin Zhang, TSMC Senior Vice President of Business Development, has shared the company’s latest development on advanced packaging. This article recaps the highlights in the forum, featuring TSMC's breakthroughs regarding advanced packaging. ...

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