As TSMC and other major chip manufacturers compete for AI business opportunities, chip production capacity is unable to keep up with demand. Industry sources cited in a report from NIKKEI claimed that the slow expansion of high-end chip production capacity is due to different packaging and testing...

As semiconductor process technology nears known physical limits, the spotlight among major industry players is shifting towards the development of advanced packaging. Concurrently, the rise of applications like artificial intelligence and AIGC has propelled the concept of advanced packaging into a n...