Advanced packaging remains a hot topic, with multiple projects worldwide making significant progress. TSMC Establishes First Advanced Packaging Zone According to reports from Taiwanese media, TSMC has acquired 30 hectares of land in the Southern Taiwan Science Park to establish its first "Advanced...

Nvidia CEO Jensen Huang announced on the 11th the company's intention to deepen collaboration with high-tech companies in Vietnam, with a focus on fostering local expertise in AI and digital infrastructure development. Huang revealed plans to establish a chip center in Vietnam, as reported by Reuter...

According to TrendForce research, driven by strong demand for 5G mobile phones, base stations, automobiles, and HPCs, the global output value of packaging and testing (including foundry and IDM) reached US$82.139 billion in 2021, or 25.83% YoY. This upward momentum is forecast to continue in 2022, t...

The stay-at-home economy generated by the COVID-19 pandemic has galvanized a rising demand for IT products this year, with a corresponding increase in DDI demand as well, according to TrendForce’s latest investigations. More specifically, large-sized DDI demand is expected to increase by as much ...