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    In-Depth Analyses

    2023-10-30

    Exploring the Significance of 3D-SOC and 3D-IC in Cutting-Edge 3D Advanced Packaging

    Semiconductors

    As semiconductor manufacturing processes evolve more gradually, 3D packaging emerges as an effective means of prolonging Moore's Law and enhancing the computational prowess of ICs. Within the realm of 3D stacking technology, the Interuniversity Microelectronics Centre (imec) based in Belgium categor...

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