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Google has accelerate its pace on the Pixel series, as the tech giant launched Google Pixel 9 on August 13th, which is two months ahead of its schedule.
Though the Tensor G4 processor in the model is manufactured with Samsung’s 4nm, according to a report citing sources by Commercial Times, Google is said to be switching to TSMC’s 3nm process with its next-generation Tensor G5, coupling with the foundry giant’s InFO-POP packaging.
Google’s Pixel 8 is said to be the first AI-centric smartphone, featuring a range of AI functionalities. Yet, Commercial Times’ report has indicated that, after years of close collaboration, Google will part ways with Samsung and have TSMC produce the Tensor G5 chip.
The chip is also said to adopt TSMC’s advanced InFO-POP packaging. Google’s move, according to the report, demonstrates its ambition to expand its leadership in software to hardware, as it eyes for the opportunities of edge AI.
Industry sources cited by the report further point out that in the fourth quarter, both Qualcomm and MediaTek will launch flagship-level chips, while Apple’s A18 will also be produced using TSMC’s N3 process.
All these developments have hinted at tech giants’ ambition on the massive potential of the edge AI market. Now, Google would be the latest competitor to join the race.
Meanwhile, though Pixel’s market share is relatively low, the Android ecosystem, with its 70% market share in smartphones and billions of users, offers significant potential. Google is said to be following a path similar to Apple’s, achieving complete integration of hardware and software to maximize this potential.
Google’s self-developed chip extends beyond mobile devices, with its TPU (Tensor Processing Unit) now in their seventh generation. Additionally, Google’s Arm-based CPUs are being developed in partnership with TSMC.
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(Photo credit: Google)