To continue advancing Moore's Law, TSMC Chairman and President C.C. Wei personally confirmed that FOPLP (Fan-Out Panel-Level Packaging) is in full swing. According to a report from Commercial Times, TSMC has established an R&D team and production line, currently still in the initial stages. ...

With the surge in new applications like AI, advanced packaging remains a hot topic, particularly with FOPLP (Fan-Out Panel Level Packaging) technology gaining renewed attention. According to sources cited by a report from MoneyDJ, leading semiconductor foundry TSMC has officially formed a team, curr...

Taiwanese panel company Innolux have said to be involving in collaborating with leading global memory manufacturers. According to a report from the Economic Daily News, plans are underway to repurpose its 4th Plant in Tainan (5.5-generation LCD panel plant) for AI-related semiconductor applicatio...

From May 14th to 16th, the international display industry's leading event, SID Display Week 2024, was held in San Jose, USA. Major panel manufacturers such as BOE, TCL CSOT, Tianma, Visionox, Innolux, AUO, Samsung Display, and LG Display showcased a variety of new technological products. TrendForce ...

China's top panel makers, including BOE, TCL CSOT, HKC, and CEC-CHOT, are cutting production to support TV panel prices. Speculations indicate a capacity utilization drop below 60% in the first quarter, benefiting Taiwanese panel companies like Innolux and AUO. Despite these efforts, industry source...