Grappling with a series of operational challenges, Intel has been weighing options to stem losses, with cost reduction being one of its major focus. Under this scenario, the decisions the semiconductor giant has made include slashing 15% of its workforce and the cancellation of its 20A process, which can help avoiding the significant capital expenditures needed to scale the node to full production.

In addition to the aforementioned moves, rumors have been circulating regarding the progress of Intel’s global expansion, hinting that the projects at Germany and Penang might be put on hold. Moreover, though granted with USD 8.5 billion in grants and USD 11 billion in loans under the Chips and Science Act, the company has not yet received any money from the U.S. authority, raising concerns on the feasibility of its ongoing Arizona and Ohio projects.

Here is a roundup of Intel’s major expansion projects which have been reportedly delayed, scaling down, or put on hold recently, as cost considerations may be the primary reason.

Accompanied by construction crews on Oct. 12, 2023, Intel CEO Pat Gelsinger toured the company’s two new fabrication plants being built in Chandler, Arizona. (Credit: Intel)

US: Ohio Delayed for 2 Years, with Mass Production Expected in 2027-28

Intel plans to invest USD 100 billion over the next five years in new fabs and expansions across Arizona, New Mexico, Ohio, and Oregon, creating 10,000 manufacturing jobs and 20,000 construction jobs.

However, according to a previous report by The Register, the construction of Intel’s two fabs in Arizona has progressed more slowly than anticipated. Rising costs for materials and labor, combined with a surge in investments in the state, have resulted in a shortage of workers.

Citing Nikkei, the report notes that the cost of constructing a plant in Arizona is now four to five times higher than in other regions, such as Asia, and several times more than the initial budget Intel had anticipated.

The semiconductor giant’s Fab 52 and Fab 62 in Arizona are previously scheduled to be completed in 2024. However, The Register notes that the schedule may be delayed a bit, as the fabs are likely to begin operations later this year or in early 2025, targeting to manufacture chips using Intel’s next-generation Angstrom-era process technology, including the 18A node.

The 20 billion project in Ohio, on the other hand, may be facing larger obstacles as Intel has delayed the plan due to market downturns and delays in U.S. subsidies.

With an initial plan to begin chip manufacturing in Ohio in 2025, the company has now postponed the pipeline, aiming to complete the two fabs in 2026–2027, with operations expected to commence around 2027–2028.

EMEA: Hard-hit Area as Investments on Hold in Israel, France and Italy

The situation is not too optimistic in Europe, neither. According to a report from global media outlet Volksstimme, the construction of Intel’s Fab 29.1 and Fab 29.2 near Magdeburg, Germany, which may totaling 30 billion euros, has been postponed due to pending approval of EU subsidies and the need to remove and reuse black soil. The date of commencement has been pushed from summer 2024 to May 2025.

It is reported that Intel’s fabs in Germany were originally scheduled to start operations by late 2027 and were expected to employ advanced manufacturing processes, potentially Intel 14A (1.4nm) and Intel 10A (1nm) nodes. However, Intel now estimates that it will take four to five years to build these plants, and production is expected to commence between 2029 and 2030.

In addition, earlier in June, the struggling semiconductor giant also put a halt to the expansion of a major factory project in Israel, which was set to invest an additional USD 15 billion in a new chip plant, according to The Times of Israel.

In December, Intel had announced plans to increase its investment in the chip manufacturing plant in Kiryat Gat, from USD 10 billion to USD 25 billion, in order to secure a USD 3.2 billion grant from the Israeli government. However, it has now suspended the plan, suggesting that “managing large-scale projects, especially in our industry, often involves adapting to changing timelines,” the report states.

It is also worth noting that Intel tends to scale down on its production in the EMEA area, as in June, the company announced the sale of a 49% stake in its plant in Leixlip, Ireland, to Apollo Global Management for USD 11 billion, securing more external funding for usage.

Another report by POLITICO in July also notes that the U.S. semiconductor giant has discreetly suspended several investment plans in Europe after incurring significant losses, dealing a setback to Europe’s push to produce more microchips.

In 2022, Intel announced an initial investment of over €33 billion for R&D and Manufacturing in EU, targeting countries including France, Germany, Ireland, Italy, Poland and Spain. However, the report suggests that the promised investments for France and Italy, valued at billions of euros and potentially creating thousands of jobs, will be put on hold for now.

Asia: New Packaging Project in Malaysia Suspended

The latest of Intel’s moves on halting its global expansion would probably be the cancellation of its new chip packaging and testing project in Penang as part of cost-cutting efforts, while the operations of existing facilities will remain unaffected.

The U.S. chip giant had announced three years ago that it would invest approximately USD 7 billion to build new chip packaging and testing facilities in Malaysia, looking to make the site its largest overseas packaging and testing base. Per a report by Malaysia media outlet The Star, Intel employs around 14,000 people in Malaysia, meaning over 2,000 local employees may face the risk of job loss.

Would the series of emergency measures taken by the struggling giant stem the bleeding? Or would these moves more like a cornered beast fighting out of its way? The only thing for sure now may be that Intel would have a pretty different look after the upcoming board meeting in mid-September.

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• [News] Qualcomm Rumored to Consider Acquiring Parts of Intel’s Chip Design Business, with a Focus on PC Segment
• [News] Amidst Rumors of Germany Plant Delay, Intel’s Penang Project Also Reportedly on Hold

Intel has outsourced the production of its Lunar Lake processors to TSMC. According to a report from Commercial Times, due to recent setbacks in Intel’s wafer foundry business, the company has decided to outsource all sub-3nm process manufacturing to TSMC.

The company is also said to be implementing a global 15% workforce reduction plan in an effort to reverse its decline. However, industry sources also reveal that the layoffs are primarily targeting the foundry business, while Intel’s Taiwan branch remains unaffected to maintain production partnerships with local chip manufacturers.

Intel remains committed to its wafer foundry business, as it reportedly released the 18A process design kit (PDK) to IC manufacturers in July.

However, recent reports indicate that Broadcom has expressed concerns about the feasibility of Intel’s 18A process, concluding that it is not suitable for mass production. A Broadcom spokesperson cited by the report has indicated that it is currently evaluating Intel Foundry Services’ products and services, though no final assessment has been reached yet.

Industry sources cited by Commercial Times further note that Broadcom has been collaborating with TSMC for many years, particularly in advanced processes below 7nm, positioning itself as a key player and securing a spot among TSMC’s top ten customers.

Looking at Intel’s latest quarterly report, its foundry business posted a loss of USD 2.8 billion, with an operating profit margin of -65.5%. The company acknowledged that the ongoing expansion of its Intel 4 and Intel 3 facilities in Ireland, along with increased R&D and startup costs for advancing its technology development, will impact profitability.

This has thus underscored the significant challenges Intel faced in achieving both technological breakthroughs and mass production in the semiconductor industry.

Intel is cutting costs and driving efficiency while actively pursuing transformation. The company aims to save USD 10 billion by 2025, even halted dividend payments—a move not seen in 30 years.

Additionally, its global expansion efforts have slowed. As per a recent report from Malaysian media outlet The Star, citing informed sources, it’s reported that Intel will temporarily halt its new chip packaging and testing project in Penang as part of cost-cutting efforts.

Read more

• [News] Amidst Rumors of Germany Plant Delay, Intel’s Penang Project Also Reportedly on Hold
• [News] Intel’s 18A Reportedly Runs into Trouble with Broadcom, while 20A Plan on Arrow Lake Cancelled

(Photo credit: Intel)

Amid crisis and various rumors, Intel might be finding a buyer for parts of its chip business? Citing sources familiar with the matter, the latest report by Reuters suggests that U.S. chip giant Qualcomm, which is known for its Snapdragon processors used in smartphones, has investigated the possibility of acquiring parts of Intel’s design business to enhance its product portfolio.

Ahead of Intel’s board meeting next week, in which a proposal from CEO Pat Gelsinger and other executives regarding operational cuts will be reviewed, Qualcomm is said to be mulling on acquiring various segments of Intel. However, the potential target is not its FPGA unit Altera.

Instead, Qualcomm is particularly interested in Intel’s PC business, according to Reuters, though the mobile chipmaker is evaluating all of the company’s design units. The report indicates that acquiring other segments of Intel, such as the server division, would be less practical for Qualcomm.

Qualcomm, valued at USD 184 billion and known for its smartphone chips with Apple as a key customer, has been developing plans to acquire parts of Intel for several months, Reuters suggests. However, sources indicate that Qualcomm’s interest and plans are not yet finalized and could still be subject to change.

It is worth noting that earlier this week, Intel introduced Lunar Lake, which will power more than 80 new laptop designs across more than 20 original equipment manufacturers. With its boost, Intel targets to ship more than 40 million AI PC processors this year.

Almost in the meantime, on September 4^th, Qualcomm launched its latest AI PC chip, the Snapdragon X Plus 8-core processor, with the intention to counter Intel and AMD.

Qualcomm declined to comment. Intel, on the other hand, stated that there have been no discussions with Qualcomm regarding a potential acquisition, emphasizing that Intel remains “deeply committed to our PC business,” according to Reuters.

On the other hand, getting stuck in its current situation, Intel is said to be pushing U.S. officials to expedite the release of funding, another report by Bloomberg notes. Earlier in April, Intel and Biden administration announced up to USD 8.5 billion in direct funding under the CHIPS Act.

The Silicon Valley company is slated to receive USD 8.5 billion in grants and USD 11 billion in loans under the 2022 Chips and Science Act, but this funding is contingent on meeting key milestones and undergoing extensive due diligence, according to Bloomberg. Therefore, like other potential beneficiaries, Intel has not yet received any money.

More importantly, the report indicates that if Intel lowers the scale of the investment in the U.S., its subsidy package would very likely change as well. Intel CFO David Zinsner reportedly acknowledged that it is unlikely that Intel will receive subsidies before year-end.

Read more

• [News] Intel’s 18A Reportedly Runs into Trouble with Broadcom, while 20A Plan on Arrow Lake Cancelled
• [News] Amidst Rumors of Germany Plant Delay, Intel’s Penang Project Also Reportedly on Hold

(Photo credit: Qualcomm)

According to Reuters citing sources, Intel, facing a critical survival crisis, has temporarily halted its new chip packaging and testing project in Penang.

Malaysian media outlet The Star, citing informed sources, reported that Intel will temporarily halt its new chip packaging and testing project in Penang as part of cost-cutting efforts. However, the operations of existing facilities will remain unaffected.

The U.S. chip giant had announced three years ago that it would invest approximately USD 7 billion to build new chip packaging and testing facilities in Malaysia, looking to make it its largest overseas packaging and testing base.

Facing what is described as the most challenging period in its 56-year history, Intel is making drastic survival moves, including suspending dividend payments and laying off 15% of its global workforce to significantly reduce expenses.

Per The Star, Intel employs around 14,000 people in Malaysia, meaning over 2,000 local employees may face the risk of job loss.

Three weeks ago, Penang Chief Minister Chow Kon Yeow stated that Intel would continue its expansion plans in Penang, though he admitted that Intel’s USD 10 billion cost-cutting initiative would inevitably impact its operations in the region.

The Star cited sources, pointing out that Intel has been reassessing its investment projects in Malaysia. While construction at its new facility in Penang is still ongoing, the number of workers has been reduced.

Read more

• [News] Intel’s 18A Reportedly Runs into Trouble with Broadcom, while 20A Plan on Arrow Lake Cancelled
• [News] Intel Reportedly Considering Foundry Spin-Off or Merger to Mitigate Losses

(Photo credit: Intel)

Amid the rising of emerging applications in the AI market, the booming demands for high-performance computing (HPC), high-bandwidth memory (HBM), CoWoS advanced packaging, and high-performance storage, have energized the wafer foundry industry.

Given the broader applicability of 12-inch wafer in advanced process chips, the global expansion of 12-inch wafer production has accelerated in recent years. Leading companies like TSMC, Intel, UMC, Vanguard International Semiconductor (VIS), SMIC, and Huahong have successively released production capacity.

• VIS’ Singapore 12-Inch Fab Got Approved

On September 4, VIS and NXP jointly announced the approval of their Singapore-based 12-inch wafer fab joint venture by regulatory authorities in Taiwan, Singapore, and other regions.

The joint venture, named VisionPower Semiconductor Manufacturing Company (VSMC), will begin construction of its first 12-inch (300mm) wafer fab in the second half of this year.

VIS estimates that trial production will begin in 2027, with profitability expected by 2029. TSMC will provide technological support, and the market holds a favorable long-term outlook for the company’s operations.

Upon its mass production, both companies may consider building a second fab. Currently, VIS operates five 8-inch fabs located in Taiwan and Singapore. Three of the 8-inch fabs are in Hsinchu, and one in Taoyuan. The average monthly capacity of its 8-inch fabs in 2023 was about 279,000 wafers.

• TSMC Expands Production Worldwide

On August 20, TSMC held a groundbreaking ceremony for its new German fab, ESMC, which is set to begin construction by the end of the year and aims to start production by the end of 2027.

The project involves an investment of over EUR 10 billion and is expected to have a monthly capacity of 40,000 12-inch wafers, utilizing TSMC’s 28/22nm planar CMOS and 16/12nm FinFET process technologies.

In early September, Taiwan’s Ministry of Economic Affairs announced that TSMC plans to build a third fab in Japan to produce advanced semiconductors, with construction expected after 2030.

TSMC’s first fab in Kumamoto, Japan, officially opened on February 24, 2023, and will begin mass production in Q4 this year using 28/22nm and 16/12nm process technologies, with a monthly capacity of 55,000 wafers.

The second fab in Kumamoto is planned, with construction expected to start by the end of this year and operations to begin by the end of 2027, targeting 6/7nm nodes.

Additionally, TSMC’s 2nm fabs in Hsinchu (Fab 20) and Kaohsiung (Fab 22) in Taiwan are scheduled to start mass production next year.

In the U.S., TSMC’s first fab in Arizona is scheduled to begin producing chips using 4nm technology in the first half of 2025. The second fab will produce both 3nm and 2nm chips using next-generation nanosheet transistors, with production starting in 2025.

Plans for a third fab are also underway, with production of chips using 2nm or more advanced processes expected to begin in 2028.

• UMC’s Fab 12i in Singapore has Set Equipment in Place

On May 21, UMC held a ceremony for the settlement of equipment at its expanded Fab 12i in Singapore with the arrival of the first equipment.

UMC has operated 12-inch fabs in Singapore for over 20 years, and in February 2022, it announced the plan to invest USD 5 billion to expand Fab 12i, adding a new 12-inch fab with a monthly capacity of 30,000 wafers, focusing on 22/28nm processes. Mass production is expected by early 2026.

• Toshiba’s 12-Inch Wafer Fab Completed

On May 23, Toshiba Electronic Devices & Memory Corporation announced the completion of its new 300mm power semiconductor manufacturing fab, with a total investment of JPY 100 billion and plans to begin production in March 2025.

The fab will be built in two phases, with the first phase starting production within the 2024 fiscal year. Once fully operational, Toshiba’s power semiconductor capacity will be 2.5 times that of 2021. Equipment installation is underway, with mass production expected in the second half of FY2024.

• Powerchip Begins Construction of Two New 12-Inch Fabs

On March 13, Powerchip held a groundbreaking ceremony for a 12-inch wafer fab in partnership with India’s Tata Group, located in Dholera, Gujarat, with a total investment of INR 910 billion rupees (about USD 11 billion).

The fab will have a monthly capacity of 50,000 wafers and will produce chips using 28nm, 40nm, 55nm, 90nm, and 110nm nodes.

In early May, Powerchip also announced plans for a new 12-inch fab to expand advanced packaging capacity to support growing demand for AI devices. Powerchip’s chairman stated that the company will provide interposers, one of the three components in CoWoS packaging technology.

• Texas Instruments Built Three New 12-Inch Fabs

Texas Instruments is currently expanding its 300mm capacity to meet future demand for analog and embedded processing chips. TI plans to invest USD 30 billion in building up to four interconnected fabs (SM1, SM2, SM3, SM4) in the coming decades.

According to its 2022 roadmap, TI will build six 300mm fabs by 2030, with RFAB2 in Richardson, Texas, and LFAB (acquired from Micron) already starting production in 2022 and 2023, respectively. Two of the Sherman fabs were completed in 2023, with two more planned for 2026-2030.

In addition to the plan mentioned above, TI also announced the plan for a second 300mm fab in Lehi, Utah in February 2023, adjacent to its existing 12-inch fab, with production estimated to begin in 2026, focusing on producing analog and embedded processing chips. These fabs will be combined into one once the construction is completed.

On August 16, Texas Instruments announced that it received USD 1.6 billion in funding from the U.S. CHIPS Act. This funding will be used to build a cleanroom for the SM1 fab and complete the pilot production line, construct a cleanroom for LFAB2 to begin initial production, and build the shell for the SM2 fab.

• Intel Focuses on U.S. Projects in Arizona and Ohio

Intel has disclosed chip expansion plans in multiple regions, including Arizona, New Mexico, Ohio, Oregon, Ireland, Israel, Magdeburg, Malaysia, and Poland. However, due to market challenges and poor financial results, some of Intel’s expansion plans have been delayed.

Currently, Intel is advancing the construction of large semiconductor manufacturing plants in Arizona and Ohio for the production of cutting-edge semiconductors, as well as working on equipment development and advanced packaging projects at smaller facilities in Oregon and New Mexico.

• GlobalFoundries Revved up Investment in the U.S. and Portugal

On February 19, the U.S. government announced a USD 1.5 billion subsidy for GlobalFoundries. According to a preliminary agreement with the U.S. Department of Commerce, GlobalFoundries will establish a new semiconductor manufacturing facility in Malta, New York, and expand its existing Fab 8 plant in the same location.

The facility will leverage manufacturing technology already implemented in GlobalFoundries’ plants in Germany and Singapore to produce automotive chips, effectively introducing mature-node technology into Fab 8.

In February of this year, GlobalFoundries also announced a partnership with Amkor Technology to build a large packaging facility in Portugal.

It plans to transfer the 12-inch wafer-level packaging production line from its Dresden plant to Amkor’s facility in Porto, Portugal, aiming to establish Europe’s first large-scale backend facility. GlobalFoundries will retain ownership of the tools, processes, and IP transferred to Porto.

• China’s 12-Inch Wafer Production Lines Entered New Stages

In China, companies like SMIC, Huahong, CR Micro (Shenzhen), and Zensemi (Guangzhou) are making new progresses in 12-inch wafer production.

SMIC expects its monthly 12-inch wafer capacity to increase by 60,000 by the end of the year.

Huahong is speeding up the construction of its new 12-inch fab in Wuxi, with the first lithography machine installed on August 22, aiming for production in 1Q24.

CR Micro’s 12-inch fab in Shenzhen has entered the stage of equipment installation and debugging, with production expected to start in late 2024.

Zensemi’s 12-inch wafer manufacturing production line has went into production.

Read more

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(Photo credit: TSMC)