On April 15th, during the Member Representatives Symposium of the World Internet Conference, Jiang Tao, Vice President of Intel, and Mark Murphy, Executive Vice President and CFO of Micron, expressed their respective views on the theme “Interconnection, Mutual Benefit, and Common Prosperity — Building a Community of Shared Future in Cyberspace”, and discussed future development of international organizations and industry hot topics with other member representatives.

• Micron to Continuously Cultivate the Chinese Market and Jointly Shape the Future of the Global Semiconductor Industry

Having been rooted in China for over 20 years, Micron has established close cooperation with its customers.

On March 27, 2024, Micron announced that its new packaging and testing plant in Xi’an had officially broken ground, further strengthening the company’s unwavering commitment to operations, customers, and communities in China. Micron also announced at the groundbreaking ceremony that it will establish its first sustainable Center of Excellence (CoE) for packaging and testing in Xi’an.

In June 2023, Micron announced an additional investment of CNY 4.3 billion in Xi’an, inclusive of the construction of this new plant, introduction of new production lines, and the production of a wider range of product solutions, including but not limited to mobile DRAM, NAND, and SSD, with an aim to expand the existing DRAM packaging and testing capabilities in Xi’an.

Mark Murphy expressed that Micron is deeply rooted in China and has been committed to achieving multi-level development in China for a long time. Micron’s investments in China is a testament of its confidence in the Chinese market, strong semiconductor ecosystem, and high-quality talent. Down the road, it will continue to provide support for its customers and for the innovation in the broader semiconductor ecosystem in China.

• Intel: China Has many Conditions to Attract Global Enterprises

Currently, AI technology enjoys burgeoning growth, empowering various industries.

Intel’s VP Jiang Tao pointed out that China boast a vast market, resilient supply chain, numerous innovative application scenarios, and rich multi-level, high-quality talent resources, which are attractive to all global companies.

He expects that international organizations at the World Internet Conference can play a leading role in promoting AI technology and applications, consolidating industry consensus, and promoting full exchange among government, industry, academia, and relevant professionals in the latest developments and future trends of AI industry.

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• [News] Following in NVIDIA’s Footsteps? Intel Reportedly Plans to Launch Chinese Version of AI Chips
• [News] Micron’s Financial Report Reveals High Demand for HBM in 2025, Capacity Nears Full Allocation

(Photo credit: Intel)

The US government announced on April 15th that it will provide up to USD 6.4 billion in subsidies to South Korean semiconductor giant Samsung Electronics for expanding advanced chip production capacity at its Texas plant.

The US government previously approved subsidies of up to USD 8.5 billion for US chip giant Intel and USD 6.6 billion for TSMC to alleviate future semiconductor supply constraints. Semiconductors are currently considered the lifeblood of the global economy.

The Department of Commerce stated in a release, “…the U.S. Department of Commerce and Samsung Electronics (Samsung) have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $6.4 billion in direct funding under the CHIPS and Science Act.”

The statement also mentioned that Samsung Electronics is expected to “invest more than $40 billion dollars in the region in the coming years, and the proposed investment would support the creation of over 20,000 jobs.”

US officials told reporters that this subsidy from the “Chips and Science Act” would assist Samsung Electronics in expanding chip production for use in aerospace, defense, and automotive industries, enhancing US national security.

Lael Brainard, the Director of the White House National Economic Council, emphasized that the resurgence of advanced chip manufacturing in the United States signifies a significant milestone for the domestic semiconductor industry.

US Commerce Secretary Gina Raimondo indicated that this subsidy would support two chip production facilities, one R&D fab, and one advanced packaging facility. She mentioned that this subsidy would also help Samsung expand its semiconductor facility in Austin, Texas.

Raimondo further stated, “…this proposed funding advances America’s leadership in semiconductor manufacturing on the world stage.”

Previously, the U.S. government announced that Intel would receive USD 8.5 billion in federal subsidies and USD 11 billion in loans. Intel is planning to invest USD 100 billion across four states in the U.S. for building and expanding fabs, and is also seeking an additional USD 25 billion in tax credits.

On the other hand, US administration is set to provide USD 6.6 billion in aid to TSMC, which plans to build a third chip plant in Arizona with a total investment of USD 65 billion.

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• [News] The US Administration Rumored to Announce USD 7 Billion Grant for Samsung to Boost Chip Capacity
• [News] TSMC Receives USD 6.6 Billion for Chipmaking from the US Government, Commits to Constructing Third Fab

The US Department of Commerce has added leading Chinese solution provider Sitonholy, who primarily sells processors from Intel and NVIDIA, to its Entity List. This inclusion on the Entity List undoubtedly impacts Sitonholy but also has significant implications for American companies like Intel and NVIDIA.

According to reports from the South China Morning Post and Reuters, Sitonholy sells hardware based on Intel and NVIDIA technologies and also provides cloud services. As a result, US companies engaging in business with Sitonholy require export licenses from the Department of Commerce, but these license applications are presumed to be denied during the review process.

This development is a significant blow to Sitonholy and American companies alike. Kevin Kurland, a US export enforcement official, stated during a hearing of the US Senate subcommittee that the US government has placed four Chinese companies on an export blacklist for assisting the Chinese military in obtaining AI chips. The four Chinese companies are Linkzol Technology, Xi’an Like Innovative Information Technology, Beijing Anwise Technology, and Sitonholy.

A Chinese Foreign Ministry spokesperson criticized the United States for unfairly targeting Chinese companies through export controls and demanded that the US stop politicizing trade and technology issues.

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• [News] US Government Considers Adding ChangXin Memory Technologies to Entity List, Imposing Further Sanctions on Chinese Firms
• [News] Bypassing U.S. Restrictions? CXMT Showcases GAA Technology for 3nm Chips
• DRAM Industry Sees Nearly 30% Revenue Growth in 4Q23 Due to Rising Prices and Volume, Says TrendForce

(Photo credit: iStock)

According to a report from Nikkei News, under the decisive leadership of late Chairman Lee Kun-hee, South Korean company Samsung Electronics had continuously grown and expanded. However, as per the same report, with current leadership showing reluctance to take risks, Samsung has fallen behind competitors like Apple and TSMC.

Under the leadership of late Chairman Lee Kun-hee, Samsung consistently adjusted its product portfolio and reorganized its businesses, becoming a global leader in areas such as TVs, chips, displays, and mobile phones during the 2000s. However, in the decade, Samsung’s revenue and operating profit have remained largely flat, highlighting internal structural issues and a lack of reform.

Reportedly, a Samsung researcher proposed a plan to enhance chip production yield but was told by the supervisor that the proposal cannot be approved without prior examples.

The researcher explained that the reason pursuing this idea specifically is because there were no precedents to follow. Additionally, despite receiving top compensation at Samsung, the same researcher has claimed to be unable to pursue its desired work in recent years.

Most senior managers at Samsung are hired on an annual basis, and those who fail to produce results quickly will not be renewed. In this cutthroat environment, managers urge subordinates to deliver results quickly, leaving engineers with little time to dedicate to research and development projects.

A South Korean engineer who transitioned from Samsung to SK Hynix expressed that compared to Samsung’s elite culture that does not tolerate failure, SK Hynix’s corporate culture encourages employees on the front lines to face new challenges. They emphasized that SK Hynix can’t compete with Samsung without actively adopting new ideas.

Reportedly, this organizational culture at SK Hynix has yielded results in the high-bandwidth memory (HBM) market, with close ties to NVIDIA, surpassing Samsung’s advantages. Samsung has held the top spot in the global DRAM market for over 30 years but faced setbacks due to misjudging the prospects of AI.

Per TrendForce’s data, the three major HBM manufacturers held market shares are as follows: In 2023, SK Hynix and Samsung each held around 47.5%, while Micron’s share was roughly 5%. Still, forecasts indicate that SK Hynix’s market share in 2024 will increase to 52.5%, while Samsung’s will decrease to 42.4%.

Samsung’s declining competitiveness extends beyond memory. The company’s smartphone shipments led globally for over a decade but were surpassed by Apple last year. The reduction in Samsung’s smartphone shipments has also affected the sales of Samsung products used in phones, such as chips and displays.

On the other hand, Samsung set a goal in 2019 to become a global leader in system chips by 2030, but it has consistently lagged behind TSMC. Additionally, with the U.S. government seeking to bring chip manufacturing back to American soil, Intel is also entering the foundry business, putting Samsung under pressure from both TSMC and Intel.

According to TrendForce’s previous report on the fourth quarter of 2023, global semiconductor foundry revenue rankings showed that Intel Foundry Services (IFS), which ranked ninth globally in the third quarter of 2023, was pushed out of the top ten by PSMC and Nexchip due to factors such as the transition between old and new CPU generations and lackluster inventory momentum. At the same time, the top three semiconductor foundries globally were TSMC, Samsung, and GlobalFoundries.

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• [News] Samsung Reportedly Commits to Advanced Packaging, Targets Over USD100 Million in Related Revenue This Year
• [News] Samsung Reportedly Establishes New HBM Team, Looking to Improve AI Chip Yield

(Photo credit: Samsung)

Amid escalating tensions in the US-China tech war, rumors cited in reports from The Wall Street Journal and CNBC suggest that China has instructed major local telecom companies to gradually replace foreign chips by 2027, with Intel and AMD as the primary targets.

Sources cited in the same reports reveal that China’s Ministry of Industry and Information Technology (MIIT) has instructed several major local telecom operators to phase out foreign chips used in core telecommunications infrastructure by 2027. This move is expected to impact both Intel and AMD. Regarding this matter, CNBC reports that Intel declined to comment on the report, AMD didn’t respond to a request for comment, either.

It has been reported that Chinese authorities have ordered state-owned telecom operators to inspect their networks for extensive use of non-Chinese manufactured chips and to replace them before the deadline.

In the past, China has attempted to reduce its reliance on foreign chips but has faced obstacles due to a lack of high-quality locally produced chips. However, telecom operators now have more local alternatives for procurement, suggesting that the quality of Chinese-made chips may have become more stable and reliable.

Sources cited in the same reports indicate that this move will have the most significant impact on Intel and AMD, as most of the core processors used in Chinese and global networking equipment come from these two tech giants. However, the exact extent of the impact is still unknown.

On the other hand, a previous report from the Financial Times also indicated that, to refrain from using PCs and servers equipped with microprocessors from Intel and AMD, China implemented new regulations in December of last year requiring government agencies at the county level and above.

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• [News] Escalating US China Tech War! China Reportedly Tightens Grip on Intel and AMD, Impacting TSMC
• [News] US Considers Sanctioning Huawei-Linked Chinese Chip Network, Huawei-Related Enterprises Blacklisted

(Photo credit: iStock)