According to a report from Nikkei News, US chip giant Intel will join forces with 14 Japanese companies to develop automation technology for "backend" semiconductor processes such as packaging. The aim is said to achieve automation by 2028, highlighting efforts by both the US and Japan to collaborat...

Per a report from TechNews, during Intel's earnings call last week, CEO Pat Gelsinger stated that the supply of Core Ultra processors in the second quarter is limited due to insufficient wafer-level assembly capacity. Gelsinger mentioned in the meeting that with the increasing demand for AI PCs ...

TSMC unveiled its angstrom-class A16 advanced process during the Company’s 2024 North America Technology Symposium on April 25, set to be mass-produced in 2026. Not only is this earlier than competitors like Intel's 14A and Samsung's SF14, both slated for 2027 production, but TSMC also emphasized ...

Henri Richard, head of Rapidus Design Solutions, the US subsidiary of Japan's semiconductor foundry startup Rapidus, and former Chief Marketing Officer at processor giant AMD, indicates that Rapidus aims to position itself as a filler of market gaps during the interview with global media The Regis...

U.S. Commerce Secretary Gina Raimondo recently stated that chips used by the Chinese company Huawei in their earlier Mate 60 Pro smartphone are not as advanced as those produced in the United States. According to a report from Reuters, Huawei has been under trade restrictions since 2019, surpris...