Loongson Technology Corp Ltd, unveiled its latest domestic CPU, Loongson 3A6000, on November 28th in Beijing, China. Notably, this CPU is entirely based on Chinese in-house design, free from reliance on any foreign licensed technology. During the product launch, Weiwu Hu, the chairman of Loongson, announced that next phase will utilize mature processes to achieve performance comparable to Intel’s advanced process, reported by CTEE.

Loongson 3A6000 adopts a China domestic instruction set architecture(ISA), showcasing China’s capability to self-develop a new generation CPU, as reported by CCTV News. This CPU can run various cross-platform applications, catering to the needs of diverse large and complex desktop scenarios.

The release of the Loongson 3A6000 signifies a pivotal milestone, highlighting China’s achievement in self sufficiency and product performance, bringing it on par with international mainstream products.

According to Mydrivers.com, test results indicate that the overall performance of the Loongson 3A6000 processor is comparable to Intel’s 10^th Gen Core quad-core processor launched in 2020. Notably, the Loongson 3A6000 is built on the self-developed ISA “LoongArch,” showcasing complete independence from foreign licensing, from top-level structure to ISA and application binary interface (ABI) standards.

In terms of core performance, the Loongson 3A6000 boasts a main frequency of 2.5GHz, supports 128-bit vector extension (Loongson SIMD eXtension, LSX), and 256-bit advanced vector extension (Loongson Advanced SIMD eXtension, LASX). It also supports simultaneous multi-threading technology (SMT2), featuring a total of 8 logical cores on the entire chip.

Hu highlighted that the 3A6000 has charted a path based on mature processes, optimizing performance through design. This achievement marks comparable performance with Intel and AMD under relatively weaker process conditions. The next step involves continuing to use mature processes to achieve performance levels on par with Intel’s advanced technology.

Regarding the upcoming Loongson 3B6000, Hu mentioned during the third-quarter earnings briefing that Loongson is strategically focused on enhancing efficiency, aiming to reach or approach the performance level of Apple’s CPU for each GHz.
(Image: Jiwei)

Equipment is playing an indispensable role during the wafer manufacturing process. In response to market needs, the global EUV lithography supplier, ASML, has recently taken significant steps.

ASML’s Bold Move: Annual Investment of EUR 100 Million in Berlin Plant

As reported by the German media “Handelsblatt,” the Netherlands-based company ASML plans to invest EUR 100 million (USD 109 million) in 2023, with a similar annual investment in the subsequent years. This investment aims to enhance the production and development capabilities of ASML’s manufacturing plant located in Berlin, Germany.

Reports indicate that ASML’s Berlin plant primarily produced core components of EUV equipment, including wafer clamps, wafer tables, reticle chucks and mirror blocks. ASML acquired this facility, known as “Berliner Glas,” in 2020.

Foundries Actively Pursue EUV equipment

The EUV equipment plays a crucial role in manufacturing, utilizing specific wavelength light for radiation to precisely imprint images on wafers. Currently, the EUV equipment market is highly concentrated, with only a few global companies mastering this technology. Among them, Dutch company ASML stands out as the world’s largest and most advanced EUV company. Additionally, companies like Nikon, Canon, and Shanghai Micro Electronics Equipment (SMEE) are strategically positioning themselves in the EUV sector.

EUV technology, used for exposing semiconductor process, is indispensable due to its high cost, complex processes, and limited supply. ASML is the sole global supplier of EUV. For advanced processes below 7nm, EUV serves as an essential device. Developed over more than 20 years, EUV technology has become the cornerstone of advanced processes, enabling the continuation of Moore’s Law for at least another decade.

As a crucial EUV equipment supplier, ASML is working on a new generation of NA-EUV equipment, where “NA” represents numerical aperture. A higher NA value means a higher achievable resolution, allowing for more transistors on the chip. It is expected that by the year-end, ASML will unveil the world’s first high-NA EUV and deliver it to Intel.

Currently, both TSMC and Samsung utilize EUV equipment for manufacturing, covering TSMC’s 7nm, 5nm, and 3nm processes and Samsung’s EUV Line (7nm, 5nm, and 4nm) located in Hwaseong, Korea, along with the 3nm GAA process.

TSMC’s 2nm process will continue to leverage EUV technology. In a previous announcement in September, TSMC disclosed the acquisition of Intel’s subsidiary IMS for up to US 432.8 million, focusing on the research and production of electron beam lithography machines. Industry experts believe that TSMC’s move ensures the technical development of critical equipment and meets the supply demand for the commercialization of 2nm.

Following 2nm chips. Samsung plans to achieve mass production of 2nm processes in the mobile field by 2025, expanding to HPC and automotive electronics in 2026 and 2027, respectively. According to the report in September, Samsung is gearing up to secure the yield of the next-generation EUV equipment, High-NA, with the prototype expected to launch later this year and official supply next year.

After announcing its return to the foundry business, Intel revealed in October that it has commenced mass production of Intel 4 process nodes using EUV technology. Currently, both Intel 7 and Intel 4 have achieved mass production, and Intel 3 is progressing according to plan, with the goal of completion by the end of 2023.

(Image: ASML)

Intel’s upcoming Lunar Lake platform has entrusted TSMC with the 3nm process of its CPU. This marks TSMC’s debut as the exclusive producer for Intel’s mainstream laptop CPU, including the previously negotiated Lunar Lake GPU and high-speed I/O (PCH) chip collaborations. This move positions TSMC to handle all major chip orders for Intel’s crucial platform next year, reported by UDN News.

Regarding this news, TSMC refrained from commenting on single customer business or market speculations on November 21st. Intel has not issued any statements either.

Recent leaks of Lunar Lake platform internal design details from Intel have generated discussions on various foreign tech websites and among tech experts on X (formerly known as Twitter). According to the leaked information, TSMC will be responsible for producing three key chips for Intel’s Lunar Lake—CPU, GPU, and NPU—all manufactured using the 3nm process. Orders for high-speed I/O chips are expected to leverage TSMC’s 5nm production, with mass production set to kick off in the first half of next year, aligning with the anticipated resurgence of the PC market in the latter half of the year.

While TSMC previously manufactured CPUs for Intel’s Atom platform over a decade ago, it’s crucial to note that the Atom platform was categorized as a series of ultra-low-voltage processors, not Intel’s mainstream laptop platform. In recent years, Intel has gradually outsourced internal chips, beyond CPUs, for mainstream platforms to TSMC, including the GPU and high-speed I/O chips in the earlier Meteor Lake platform—all manufactured using TSMC’s 5nm node.

Breaking from its tradition of in-house production of mainstream platform CPUs, Intel’s decision to outsource to TSMC hints at potential future collaborations. This move opens doors to new opportunities for TSMC to handle the production of Intel’s mainstream laptop platforms.

It’s worth noting that the Intel Lunar Lake platform is scheduled for mass production at TSMC in the first half of next year, with a launch planned for the latter half of the year, targeting mainstream laptop platforms. Unlike the previous two generations of Intel laptop platforms, Lunar Lake integrates CPU, GPU, and NPU into a system-on-chip (SoC). This SoC is then combined with a high-speed I/O chip, utilizing Intel’s Foveros advanced packaging. Finally, the DRAM LPDDR5x is integrated with the two advanced packaged chips on the same IC substrate.

(Image: TSMC)

In the dynamic wave of generative AI, AI PCs emerge as a focal point in the industry’s development. Technological upgrades across the industry chain and the distinctive features of on-device AI, such as security, low latency, and high reliability, drive their rapid evolution. AI PCs are poised to become a mainstream category within the PC market, converging with the PC replacement trend, reported by Jiwei.

On-Device AI, driven by technologies like lightweighting language large models (LLMs), signifies the next stage in AI development. PC makers aim to propel innovative upgrades in AI PC products by seamlessly integrating resources both upstream and downstream. The pivotal upgrade lies in the chip, with challenges in hardware-software coordination, data storage, and application development being inevitable. Nevertheless, AI PCs are on track to evolve at an unprecedented pace, transforming into a “hybrid” encompassing terminals, edge computing, and cloud technology.

Is AI PC Industry Savior?

In the face of consecutive quarters of global PC shipment decline, signs of a gradual easing in the downward trend are emerging. The industry cautiously anticipates a potential recovery, considering challenges such as structural demand cooling and supply imbalances.

Traditionally viewed as a mature industry grappling with long-term growth challenges, the PC industry is witnessing a shift due to the evolution of generative AI technology and the extension of the cloud to the edge. This combination of AI technology with terminal devices like PCs is seen as a trendsetter, with the ascent of AI PCs considered an “industry savior” that could open new avenues for growth in the PC market.

Yuanqing Yang, Chairman and CEO of Lenovo, elaborates on the stimulation of iterative computation and upgrades in AI-enabled terminals by AIGC. Recognizing the desire to enjoy the benefits of AIGC while safeguarding privacy, personal devices or home servers are deemed the safest. Lenovo is poised to invest approximately 7 billion RMB in the AI field over the next three years.

Analysis from Orient Securities, also known as DFZQ, reveals that the surge in consumer demand from the second half of 2020 to 2021 is expected to trigger a substantial PC replacement cycle from the second half of 2024 to 2025, initiating a new wave of PC upgrades.

Undoubtedly, AI PCs are set to usher in a transformative wave and accelerate development against the backdrop of the PC replacement trend. Guotai Junan Securities said that AI PCs feature processors with enhanced computing capabilities and incorporating multi-modal algorithms. This integration is anticipated to fundamentally reshape the PC experience, positioning AI PCs as a hybrid terminals, edge computing, and cloud technology to meet the new demands of generative AI workloads.

PC Ecosystem Players Strategically Positioning for Dominance

The AI PC field is experiencing vibrant development, with major PC ecosystem companies actively entering the scene. Companies such as Lenovo, Intel, Qualcomm, and Microsoft have introduced corresponding innovative initiatives. Lenovo showcased the industry’s first AI PC at the 2023 TechConnect World Innovation, Intel launched the AI PC Acceleration Program at its Innovation 2023, and Qualcomm introduced the Snapdragon X Elite processor specifically designed for AI at the Snapdragon Summit. Meanwhile, Microsoft is accelerating the optimization of office software, integrating Bing and ChatGPT into the Windows.

While current promotions of AI PC products may exceed actual user experiences, terminals displayed by Lenovo, Intel’s AI PC acceleration program, and the collaboration ecosystem deeply integrated with numerous independent software vendors (ISVs) indicate that the upgrade of on-device AI offers incomparable advantages compared to the cloud. This includes integrating the work habits of individual users, providing a personalized and differentiated user experience.

Ablikim Ablimiti, Vice President of Lenovo, highlighted five core features of AI PCs: possessing personal large models, natural language interaction, intelligent hybrid computing, open ecosystems, and ensuring real privacy and security. He stated that the encounter of AI large models with PCs is naturally harmonious, and terminal makers are leading this innovation by integrating upstream and downstream resources to provide a complete intelligent service for AI PCs.

In terms of chips, Intel Core Ultra is considered a significant processor architecture change in 40 years. It adopts the advanced Meteor Lake architecture, fully integrating chipset functions into the processor, incorporating NPU into the PC processor for the first time, and also integrating the dazzling series core graphics card. This signifies a significant milestone in the practical commercial application of AI PCs.

TrendForce: AI PC Demand to Expand from High-End Enterprises           

TrendForce believes that due to the high costs of upgrading both software and hardware associated with AI PCs, early development will be focused on high-end business users and content creators. This group has a strong demand for leveraging AI processing capabilities to improve productivity efficiency and can also benefit immediately from related applications, making them the primary users of the first generation. The emergence of AI PCs is not expected to necessarily stimulate additional PC purchase demand. Instead, most upgrades to AI PC devices will occur naturally as part of the business equipment replacement cycle projected for 2024.

(Image: Qualcomm)

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NVIDIA and Intel are adapting to the latest U.S. chip export restrictions by introducing downgraded AI chips specifically tailored for the Chinese market, UDN News said.

According to insider from the China Star Market, a Chinese media, NVIDIA has developed three downgraded AI chip models for the Chinese market. Intel also plans to release downgraded Gaudi 2 chip with an aim to US restriction.

NVIDIA’s latest downgraded AI chips, including HGX H20, L20 PCle, and L2 PCle, are anticipated to be unveiled after November 16th. Chinese companies are likely to receive samples in the coming days. These three chips, derived from the modification of NVIDIA H100, will align their performance with parameters below the new U.S. regulations. Ongoing communication with NVIDIA suggests mass production is slated for the year-end, said by industry sources.

Besides, Yicai also confirms from multiple NVIDIA supply chain sources. The three AI chip products are designed for cloud training, cloud inference, and edge inference, with specific launch times pending confirmation. Sampling is projected between November and December this year, followed by mass production from December this year to January next year.

On the Intel front, there are rumors of a response plan. As reported by The Paper, Intel is planning to release an improved version of its Gaudi 2 chip. Although the rumor exists, specific details are yet to be disclosed.

Since the U.S. government introduced chip export control to China last year, NVIDIA initially designed downgraded AI chips A800 and H800 for Chinese companies. However, new regulations in October this year by the U.S. Department of Commerce brought A800, H800, L40S, and other chips under control. Failure to secure export permission may necessitate order cancellations for NVIDIA.

(Image: Nvidia)