According to sources cited by Reuters,  TSMC is reportedly considering plans to establish a production line for its CoWoS technology in Japan. However, TSMC has yet to make any further decisions, and they have declined to comment on the matter. CoWoS is an advanced packaging technology that stac...

Samsung, as per a report from the global media outlet wccftech, has decided to enter the next generation of packaging technology by commencing R&D works for the adoption of "Glass Substrate" by 2026. The report further indicates that Samsung's preparation to enter the glass substrate indus...

Intel has reportedly retained the export licenses that would have prohibited them from selling laptop processor (CPU) chips to the Chinese telecommunications giant Huawei. This signifies that Intel has temporarily preserved its business of providing chips worth hundreds of millions of dollars to Hu...

Recently, IC design company Marvell announced an expansion of its long-term partnership with TSMC to include 2-nanometer technology. They will collaborate on developing the industry's first 2-nanometer semiconductor production platform optimized for accelerating infrastructure. Currently, the...

In June 2023, leading processor manufacturer Intel reached an agreement with the German federal government, announcing the signing of an amended investment memorandum. The plan involves investing over EUR 30 billion to construct two new fabs in Magdeburg. The German federal government has agreed to ...