Intel


2024-05-10

[News] Samsung Reportedly Targets Q4 Trial Production of SiP Glass Substrate, Competing with Intel in the Advanced Packaging Market

Samsung Electronics is ramping up its entry into the semiconductor glass substrate market by advancing its equipment procurement and installation to September, with trial production slated to begin in the fourth quarter, one quarter earlier than originally planned. According to a report from South K...

2024-05-09

[COMPUTEX 2024] The Rise of Generative AI Sparks Innovation across Industries, with Taiwan-based Companies Leading as Essential Partners in the Global Supply Chain

“The Dawn of Generative AI Has Come!” This new chapter in the course of human technological evolution was first introduced by NVIDIA’s founder, Jensen Huang. Qualcomm’s CEO, Cristiano Amon, also shares this optimism regarding generative AI. Amon believes this technology is rapidly evolving a...

2024-05-09

[News] Gearing up for Backside Power Delivery: Heated Tech War Between TSMC, Intel, and Samsung

As Moore's Law progresses, transistors are becoming smaller and denser, with more layers stacked on top of each other. This may require passing through 10 to 20 layers of stacking to provide power and data signals to the transistors below, leading to increasingly complex networks of interconnects an...

2024-05-08

[News] Intel Reportedly Collaborates with 14 Japanese Companies to Develop Semiconductor Backend Process Technology

According to a report from Nikkei News, US chip giant Intel will join forces with 14 Japanese companies to develop automation technology for "backend" semiconductor processes such as packaging. The aim is said to achieve automation by 2028, highlighting efforts by both the US and Japan to collaborat...

2024-04-30

[News] Intel’s Advanced Packaging Capacity Tightens, Affecting its AI PC Processor Supply in Q2

Per a report from TechNews, during Intel's earnings call last week, CEO Pat Gelsinger stated that the supply of Core Ultra processors in the second quarter is limited due to insufficient wafer-level assembly capacity. Gelsinger mentioned in the meeting that with the increasing demand for AI PCs ...

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