According to the news from Chinatimes, Asus, a prominent technology company, has announced on the 30th of this month the release of AI servers equipped with NVIDIA’s L40S GPUs. These servers are now available for order. The L40S GPU was introduced by NVIDIA in August to address the shortage of H100 and A100 GPUs. Remarkably, Asus has swiftly responded to this situation by unveiling AI server products within a span of less than two weeks, showcasing their optimism in the imminent surge of AI applications and their eagerness to seize the opportunity.

Solid AI Capabilities of Asus Group

Apart from being among the first manufacturers to introduce the NVIDIA OVX server system, Asus has leveraged resources from its subsidiaries, such as TaiSmart and Asus Cloud, to establish a formidable AI infrastructure. This not only involves in-house innovation like the Large Language Model (LLM) technology but also extends to providing AI computing power and enterprise-level generative AI applications. These strengths position Asus as one of the few all-encompassing providers of generative AI solutions.

Projected Surge in Server Business

Regarding server business performance, Asus envisions a yearly compounded growth rate of at least 40% until 2027, with a goal of achieving a fivefold growth over five years. In particular, the data center server business catering primarily to Cloud Service Providers (CSPs) anticipates a tenfold growth within the same timeframe, driven by the adoption of AI server products.

Asus CEO recently emphasized that Asus’s foray into AI server development was prompt and involved collaboration with NVIDIA from the outset. While the product lineup might be more streamlined compared to other OEM/ODM manufacturers, Asus had secured numerous GPU orders ahead of the AI server demand surge. The company is optimistic about the shipping momentum and order visibility for the new generation of AI servers in the latter half of the year.

Embracing NVIDIA’s Versatile L40S GPU

The NVIDIA L40S GPU, built on the Ada Lovelace architecture, stands out as one of the most powerful general-purpose GPUs in data centers. It offers groundbreaking multi-workload computations for large language model inference, training, graphics, and image processing. Not only does it facilitate rapid hardware solution deployment, but it also holds significance due to the current scarcity of higher-tier H100 and A100 GPUs, which have reached allocation stages. Consequently, businesses seeking to repurpose idle data centers are anticipated to shift their focus toward AI servers featuring the L40S GPU.

Asus’s newly introduced L40S GPU servers include the ESC8000-E11/ESC4000-E11 models with built-in Intel Xeon processors, as well as the ESC8000A-E12/ESC4000A-E12 models utilizing AMD EPYC processors. These servers can be configured with up to 4 or a maximum of 8 NVIDIA L40S GPUs. This configuration assists enterprises in enhancing training, fine-tuning, and inference workloads, facilitating AI model creation. It also establishes Asus’s platforms as the preferred choice for multi-modal generative AI applications.

(Source: https://www.chinatimes.com/newspapers/20230831000158-260202?chdtv)

According to a report by Taiwan’s Commercial Times, Goldman Sachs Securities has noted that Intel has been consistently grappling with process upgrade delays since the 10-nanometer fabrication process. Recently, the company has decided to establish a foundry-like relationship between its manufacturing groups and
internal product business units. With the market scale growing increasingly substantial, it is anticipated that Intel will expand its outsourcing to TSMC in 2024 and 2025. In the rising trend of outsourced manufacturing, TSMC stands as the major beneficiary.

Goldman Sachs’ analysis reveals that the total addressable market of Intel’s outsourcing orders for 2024 and 2025 is set at $18.6 billion and $19.4 billion, respectively. During the same period, the total addressable market scope for TSMC’s wafer fabrication services amounts to $5.6 billion and $9.7 billion, approximately accounting for 6.4% and 9.4% of TSMC’s overall revenue in the corresponding years.

Prominent semiconductor industry analyst Andrew Lu also explains that Intel’s wafer chip manufacturing division competes with TSMC, rather than its design division. The design division is striving for survival in the high-speed computing semiconductor sector, and it is currently hopeful for close collaboration with TSMC. Lu even predicts that Intel’s wafer manufacturing and design divisions will inevitably be further separated into two companies several years down the line.

Semiconductor process technology is nearing the boundaries of known physics. In order to continually enhance processor performance, the integration of small chips (chiplets) and heterogeneous Integration has become a prevailing trend. It is also regarded as a primary solution for extending Moore’s Law. Major industry players such as TSMC, Intel, Samsung, and others are vigorously developing these related technologies.

What are SoC, SiP, and Chiplet?

To understand Chiplet technology, we must first clarify two commonly used terms: SoC and SiP. SoC (System on Chip) involves redesigning multiple different chips to utilize the same manufacturing process and integrating them onto a single chip. On the other hand, SiP (System in Package) connects multiple chips with different manufacturing processes using heterogeneous integration techniques and integrates them within a single packaging form.

Chiplet technology employs advanced packaging techniques to create a SiP composed of multiple small chips. It integrates small chips with different functions onto a single substrate through advanced packaging techniques. While Chiplets and SiPs may seem similar, Chiplets are essentially chips themselves, whereas SiP refers to the packaging form. They have differences in functionality and purpose.

Chiplets: Today’s Semiconductor Development Trend

The design concept of Chiplet technology offers several advantages over SoC, notably in significantly improving chip manufacturing yield. As chip sizes increase to enhance performance, chip yield decreases due to the larger surface area. Chiplet technology can integrate various smaller chips with relatively high manufacturing yields, thus enhancing chip performance and yield.

Furthermore, Chiplet technology contributes to reduced design complexity and costs. Through heterogeneous integration, Chiplets can combine various types of small chips, reducing integration challenges in the initial design phase and facilitating design and testing. Additionally, since different Chiplets can be independently optimized, the final integrated product often achieves better overall performance.

Chiplets have the potential to lower wafer manufacturing costs. Apart from CPUs and GPUs, other units within chips can perform well without relying on advanced processes. Chiplets enable different functional small chips to use the most suitable manufacturing process, contributing to cost reduction.

With the evolution of semiconductor processes, chip design has become more challenging and complex, leading to rising design costs. In this context, Chiplet technology, which simplifies design and manufacturing processes, effectively enhances chip performance, and extends Moore’s Law, holds significant promise.

Applications and Development of Chiplets

In recent years, global semiconductor giants like AMD, TSMC, Intel, NVIDIA, and others have recognized the market potential in this field, intensively investing in Chiplet technology. For example, AMD’s recent products have benefited from the ‘SiP + Chiplet’ manufacturing approach. Moreover, Apple’s M1 Ultra chip achieved high performance through a customed UltraFusion packaging architecture. In academia, institutions like the University of California, Georgia Tech, and European research organizations have begun researching interconnect interfaces, packaging, and applications related to Chiplet technology.

In conclusion, due to Chiplet technology’s ability to lower design costs, reduce development time, enhance design flexibility and yield, while expanding chip functionality, it is an indispensable solution in the ongoing development of high-performance chips.

This article is from TechNews, a collaborative media partner of TrendForce.

According to Taiwan’s TechNews report, Intel has revealed the architecture and supply schedule of the new generation data center Xeon processors, Sierra Forest and Granite Rapids. They are also set to unveil the consumer processor codenamed Meteor Lake in mid-September. However, with the semiconductor market’s current weak recovery, the impact of Intel’s new processors on driving upgrades and benefiting Taiwanese supply chain manufacturers remains uncertain, making it a market focal point.

Regarding the consumer-oriented Meteor Lake processor, industry sources suggest that it will not only be the first to adopt “Intel 4” technology, but also the first to utilize EUV lithography for cost reduction in mass-producing CPU tiles. TSMC will assist in production using the 5/6 nanometer process for graphics chip modules (GFX tile), system chip modules (SoC tile), and input/output chip modules (IOE tile), aiming for higher yields to decrease production costs.

Furthermore, the Meteor Lake processor shifts from traditional monolithic chip design to chiplet technology. After separating functions like graphics, system, and I/O chips, it employs the 3D Foveros advanced packaging technology. Through Foveros interconnects, multiple chiplets are vertically stacked into one chip. This approach not only increases the yield of critical modules but also reduces costs, granting Intel greater flexibility in rapidly creating next-generation chip capacities.

For the upcoming Meteor Lake processor, its direct beneficiary is undoubtedly TSMC, which assists in producing graphics chip modules, system chip modules, and input/output chip modules using the 5/6 nanometer process. This collaboration not only boosts revenue but also maintains the ongoing partnership with Intel.

However, despite Taiwanese foundries and board manufacturers securing orders for Intel’s new-generation processors, the current economic environment remains unfavorable. With a cautious and conservative outlook on consumer spending in the global market, the launch of Intel’s new products could either boost supply chain revenue or lead to increased inventory in the next phase, requiring further observation.

(Photo credit: Intel)

As reported by TechNews, a media partner of TrendForce, Southeast Asia and India, equipped with the advantages of demographic dividends, strategic geographic positioning, manufacturing capabilities, and rapidly growing economic markets, have undoubtedly emerged as the preferred destinations for the technology industry amidst the global supply chain transition prompted by geopolitical factors.

As supply chains actively seek production bases beyond China and governments introduce incentive programs and policy restrictions for localized supply, various Southeast Asian countries have become key hubs for different sectors. Vietnam has become a focal point for consumer electronics manufacturing such as laptops, watches, and headphones, while Thailand has become a preferred choice for automotive-related supply chains. Thailand and Malaysia host assembly bases for servers, and India is set to become a crucial hub for mobile phone production.

Apart from the movement of end-product assembling, the shift in the semiconductor supply chain has also garnered attention. With TSMC, Samsung, and Intel relocating wafer fabrication plants to the United States, Europe, and other regions, a significant cluster of semiconductor backend testing and packaging has been forming in Malaysia.

What Advantages Does Malaysia Offer to Attract Multinational Semiconductor Companies’ Investment, and What Is the Current Industry Landscape?

Firstly, Malaysia boasts higher education standards than neighboring countries. Among ASEAN nations, only Singapore and Malaysia employ the British legal system, providing a competitive edge for many companies’ location choices. Secondly, in terms of language proficiency, Malaysian citizens predominantly use English, Mandarin, and Malay, facilitating smooth communication with global enterprises.

Thirdly, Malaysia is home to two major ports—Port Klang and Port of Tanjung Pelepas—both ranked among the world’s top 15 ports, with substantial container handling capacity and global reach.

Lastly, the state of Penang stands as a semiconductor hub for Malaysia, having nurtured the semiconductor industry for several decades and holding a technological lead. Often referred to as the “Silicon Valley of the East,” Penang has primarily focused on producing chips for electronics, computers, and mobile phones. However, with the growing adoption of electric vehicles, the demand for automotive chips has surged. Concurrently, the green energy trend has propelled the need for solar panels and renewable energy sources. This optimistic outlook for the semiconductor industry has once again attracted numerous companies to establish facilities and expand production capacity.

Current State of Malaysia’s Semiconductor Industry

Looking at the recent dynamics of corporations over the past two years, the trend is evident that Malaysia is evolving into a center for semiconductor backend testing and packaging. Major global players have announced plans to establish or expand operations in Penang. Intel, for example, announced a $6.46 billion investment in Malaysia in 2021, focusing on advanced packaging capabilities in Penang and Kedah.

Texas Instruments declared its intent to construct semiconductor testing and packaging plants in Kuala Lumpur and Malacca, with a total investment of up to $2.7 billion. Infineon is investing $5.45 billion to expand existing facilities, producing silicon carbide and entering the electric vehicle sector. Bosch Group is investing $358 million in stages to strengthen its semiconductor supply chain position in Penang. ASE Technology Holding, also began construction on a new testing facility in Penang at the end of last year.

With the influx of semiconductor giants, Malaysia’s position in the semiconductor industry has become increasingly critical. The distinct production base trends, aligned with the strengths of various Southeast Asian countries, have become clear. The restructuring of supply chains and the transformation of production centers undoubtedly remain the focus and challenge for global companies.

(Photo credit: ASE)