Intel’s upcoming Lunar Lake platform has entrusted TSMC with the 3nm process of its CPU. This marks TSMC’s debut as the exclusive producer for Intel’s mainstream laptop CPU, including the previously negotiated Lunar Lake GPU and high-speed I/O (PCH) chip collaborations. This move positions TSMC to handle all major chip orders for Intel’s crucial platform next year, reported by UDN News.

Regarding this news, TSMC refrained from commenting on single customer business or market speculations on November 21st. Intel has not issued any statements either.

Recent leaks of Lunar Lake platform internal design details from Intel have generated discussions on various foreign tech websites and among tech experts on X (formerly known as Twitter). According to the leaked information, TSMC will be responsible for producing three key chips for Intel’s Lunar Lake—CPU, GPU, and NPU—all manufactured using the 3nm process. Orders for high-speed I/O chips are expected to leverage TSMC’s 5nm production, with mass production set to kick off in the first half of next year, aligning with the anticipated resurgence of the PC market in the latter half of the year.

While TSMC previously manufactured CPUs for Intel’s Atom platform over a decade ago, it’s crucial to note that the Atom platform was categorized as a series of ultra-low-voltage processors, not Intel’s mainstream laptop platform. In recent years, Intel has gradually outsourced internal chips, beyond CPUs, for mainstream platforms to TSMC, including the GPU and high-speed I/O chips in the earlier Meteor Lake platform—all manufactured using TSMC’s 5nm node.

Breaking from its tradition of in-house production of mainstream platform CPUs, Intel’s decision to outsource to TSMC hints at potential future collaborations. This move opens doors to new opportunities for TSMC to handle the production of Intel’s mainstream laptop platforms.

It’s worth noting that the Intel Lunar Lake platform is scheduled for mass production at TSMC in the first half of next year, with a launch planned for the latter half of the year, targeting mainstream laptop platforms. Unlike the previous two generations of Intel laptop platforms, Lunar Lake integrates CPU, GPU, and NPU into a system-on-chip (SoC). This SoC is then combined with a high-speed I/O chip, utilizing Intel’s Foveros advanced packaging. Finally, the DRAM LPDDR5x is integrated with the two advanced packaged chips on the same IC substrate.

(Image: TSMC)

In the dynamic wave of generative AI, AI PCs emerge as a focal point in the industry’s development. Technological upgrades across the industry chain and the distinctive features of on-device AI, such as security, low latency, and high reliability, drive their rapid evolution. AI PCs are poised to become a mainstream category within the PC market, converging with the PC replacement trend, reported by Jiwei.

On-Device AI, driven by technologies like lightweighting language large models (LLMs), signifies the next stage in AI development. PC makers aim to propel innovative upgrades in AI PC products by seamlessly integrating resources both upstream and downstream. The pivotal upgrade lies in the chip, with challenges in hardware-software coordination, data storage, and application development being inevitable. Nevertheless, AI PCs are on track to evolve at an unprecedented pace, transforming into a “hybrid” encompassing terminals, edge computing, and cloud technology.

Is AI PC Industry Savior?

In the face of consecutive quarters of global PC shipment decline, signs of a gradual easing in the downward trend are emerging. The industry cautiously anticipates a potential recovery, considering challenges such as structural demand cooling and supply imbalances.

Traditionally viewed as a mature industry grappling with long-term growth challenges, the PC industry is witnessing a shift due to the evolution of generative AI technology and the extension of the cloud to the edge. This combination of AI technology with terminal devices like PCs is seen as a trendsetter, with the ascent of AI PCs considered an “industry savior” that could open new avenues for growth in the PC market.

Yuanqing Yang, Chairman and CEO of Lenovo, elaborates on the stimulation of iterative computation and upgrades in AI-enabled terminals by AIGC. Recognizing the desire to enjoy the benefits of AIGC while safeguarding privacy, personal devices or home servers are deemed the safest. Lenovo is poised to invest approximately 7 billion RMB in the AI field over the next three years.

Analysis from Orient Securities, also known as DFZQ, reveals that the surge in consumer demand from the second half of 2020 to 2021 is expected to trigger a substantial PC replacement cycle from the second half of 2024 to 2025, initiating a new wave of PC upgrades.

Undoubtedly, AI PCs are set to usher in a transformative wave and accelerate development against the backdrop of the PC replacement trend. Guotai Junan Securities said that AI PCs feature processors with enhanced computing capabilities and incorporating multi-modal algorithms. This integration is anticipated to fundamentally reshape the PC experience, positioning AI PCs as a hybrid terminals, edge computing, and cloud technology to meet the new demands of generative AI workloads.

PC Ecosystem Players Strategically Positioning for Dominance

The AI PC field is experiencing vibrant development, with major PC ecosystem companies actively entering the scene. Companies such as Lenovo, Intel, Qualcomm, and Microsoft have introduced corresponding innovative initiatives. Lenovo showcased the industry’s first AI PC at the 2023 TechConnect World Innovation, Intel launched the AI PC Acceleration Program at its Innovation 2023, and Qualcomm introduced the Snapdragon X Elite processor specifically designed for AI at the Snapdragon Summit. Meanwhile, Microsoft is accelerating the optimization of office software, integrating Bing and ChatGPT into the Windows.

While current promotions of AI PC products may exceed actual user experiences, terminals displayed by Lenovo, Intel’s AI PC acceleration program, and the collaboration ecosystem deeply integrated with numerous independent software vendors (ISVs) indicate that the upgrade of on-device AI offers incomparable advantages compared to the cloud. This includes integrating the work habits of individual users, providing a personalized and differentiated user experience.

Ablikim Ablimiti, Vice President of Lenovo, highlighted five core features of AI PCs: possessing personal large models, natural language interaction, intelligent hybrid computing, open ecosystems, and ensuring real privacy and security. He stated that the encounter of AI large models with PCs is naturally harmonious, and terminal makers are leading this innovation by integrating upstream and downstream resources to provide a complete intelligent service for AI PCs.

In terms of chips, Intel Core Ultra is considered a significant processor architecture change in 40 years. It adopts the advanced Meteor Lake architecture, fully integrating chipset functions into the processor, incorporating NPU into the PC processor for the first time, and also integrating the dazzling series core graphics card. This signifies a significant milestone in the practical commercial application of AI PCs.

TrendForce: AI PC Demand to Expand from High-End Enterprises           

TrendForce believes that due to the high costs of upgrading both software and hardware associated with AI PCs, early development will be focused on high-end business users and content creators. This group has a strong demand for leveraging AI processing capabilities to improve productivity efficiency and can also benefit immediately from related applications, making them the primary users of the first generation. The emergence of AI PCs is not expected to necessarily stimulate additional PC purchase demand. Instead, most upgrades to AI PC devices will occur naturally as part of the business equipment replacement cycle projected for 2024.

(Image: Qualcomm)

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NVIDIA and Intel are adapting to the latest U.S. chip export restrictions by introducing downgraded AI chips specifically tailored for the Chinese market, UDN News said.

According to insider from the China Star Market, a Chinese media, NVIDIA has developed three downgraded AI chip models for the Chinese market. Intel also plans to release downgraded Gaudi 2 chip with an aim to US restriction.

NVIDIA’s latest downgraded AI chips, including HGX H20, L20 PCle, and L2 PCle, are anticipated to be unveiled after November 16th. Chinese companies are likely to receive samples in the coming days. These three chips, derived from the modification of NVIDIA H100, will align their performance with parameters below the new U.S. regulations. Ongoing communication with NVIDIA suggests mass production is slated for the year-end, said by industry sources.

Besides, Yicai also confirms from multiple NVIDIA supply chain sources. The three AI chip products are designed for cloud training, cloud inference, and edge inference, with specific launch times pending confirmation. Sampling is projected between November and December this year, followed by mass production from December this year to January next year.

On the Intel front, there are rumors of a response plan. As reported by The Paper, Intel is planning to release an improved version of its Gaudi 2 chip. Although the rumor exists, specific details are yet to be disclosed.

Since the U.S. government introduced chip export control to China last year, NVIDIA initially designed downgraded AI chips A800 and H800 for Chinese companies. However, new regulations in October this year by the U.S. Department of Commerce brought A800, H800, L40S, and other chips under control. Failure to secure export permission may necessitate order cancellations for NVIDIA.

(Image: Nvidia)

On November 7th, Intel held its “Intel Innovation Taipei 2023 Technology Forum”, with CEO Pat Gelsinger highlighting the healthy state of PC inventory. He also expressed optimism about the injection of several more years of innovative applications and evolution in PCs through AI. 

Intel Aims to Ship over One Hundred Million AI PC within the Next Two Years

Gelsinger expressed that the PC inventory has reached a healthy level, and he is optimistic about the future growth of AI PCs, which are equipped with AI processors or possess AI computing capabilities. He anticipates that AI will be a crucial turning point for the PC industry.

Additionally, Gelsinger stated that the server industry may have seemed uneventful in recent years, but with the accelerated development of AI, it has become more exciting. AI is becoming ubiquitous, transitioning from the training phase to the deployment phase, and various platforms will revolve around AI.

Gelsinger expressed his strong confidence in Intel’s position in the AI PC market, expecting to ship over one hundred million units within two years.

Intel’s Ambitious Expansion in Semiconductor Foundry Landscape

Intel is actively promoting its IDM 2.0 strategy, with expectations from the industry that the company, beyond its brand business, has advanced packaging capabilities to support semiconductor foundry operations. In the future, Intel is poised to compete with rivals such as TSMC and Samsung.

Gelsinger noted that some have viewed Intel’s plan of achieving five technical nodes in four years as “an ambitious endeavor.” However, he emphasized that Intel remains committed to its original goal of advancing five process nodes within four years.

The company’s foundry business has received positive responses from numerous potential customers, and while it may take three to four years for significant expansion, the advanced packaging aspect may only require two to three quarters to get on track.

This transformation marks a significant shift for the company, setting new standards in the industry. Intel is making steady progress in its four-year plan to advance five nodes, and Moore’s Law will continue to extend. The construction of Intel’s new factories is also ongoing.

According to Intel’s roadmap, Intel 7 and Intel 4 are already completed, Intel 3 is set for mass production in the latter half of this year, and Intel 20A and 18A are expected to enter mass production in the first and second halves of next year, respectively.

Regarding this roadmap, according to NIKKEI Asia’s report, Gelsinger also mentioned at the forum that for the 18A process, they currently have many test wafers in production. Additionally, the development of 18A has been completed, and it is progressing rapidly towards the production phase.

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• [News] Intense Competition in Advancing Processes at the 2nm by Samsung, Intel, and TSMC

(Photo credit: Intel Newsroom)

According to TechNews’ report, Gitae Jeong, Vice President of Samsung Electronics, recently revealed in an interview that the company is set to introduce the SF1.4 (1.4nm) process, expected to enter mass production in 2027.

This announcement intensifies the competition in advanced semiconductor manufacturing, particularly in the development of 2.5D/3D integrated heterogeneous structure packaging among the three major semiconductor foundry giants.

• TSMC: N3P Process Superior to Intel 18A, N2 to Lead Industry’s Advanced Processes

Previously, the semiconductor industry reported challenges with both TSMC and Samsung achieving yields above 60% for their 3nm processes due to undisclosed issues. TSMC’s yield was reported to be only 55%, below the normal yield rate.

However, TSMC’s President, C.C. Wei, expressed optimism, stating that current N3 demand is better than three months ago, contributing to a healthy growth outlook for TSMC in 2024.

Wei also anticipates that TSMC’s 3nm process will contribute a mid-single-digit percentage (4%-6%) to the company’s annual wafer revenue in 2023.

Regarding competition with rival Intel’s 18A process, Wei believes that TSMC’s N3P process offers better performance, power, and area (PPA), alongside improved cost efficiency and technical maturity. Furthermore, TSMC’s upcoming N2 process is expected to be the industry’s most advanced when introduced.

• Intel: Striving for the Fourth Customer for 18A Process Outsourcing Orders

Intel’s CEO, Pat Gelsinger, has revealed that the 18A process has secured orders from three customers and aims to acquire a fourth customer by the end of the year. The advanced 18A process is scheduled to begin production at the end of 2024, with one customer already having made an advance payment. External expectations suggest that the customer could possibly be NVIDIA or Qualcomm.

Intel has stated that Intel 4 and Intel 3 processes are similar, as are Intel 20A and Intel 18A processes. Consequently, Intel’s primary focus will be on offering Intel 3 and Intel 18A to semiconductor foundry customers. Meanwhile, Intel 4 and Intel 20A processes are more likely to be used internally. However, Intel is open to accommodating customer requests if they express interest in adopting these later processes.

• Samsung: Commencing Mass Production of SF2 in 2025, Prioritizing Internal Use

Due to challenges with the three-nanometer (3nm) manufacturing process, there have been reports that Samsung plans to shift directly to the more advanced two-nanometer (2nm) process.

According to Samsung’s Foundry Forum (SFF) plan, they will begin mass production of the 2nm process (SF2) in 2025 for mobile applications, expand to high-performance computing (HPC) applications in 2026, and further extend to the automotive sector and the expected 1.4nm process by 2027.

Similar to Intel, Samsung intends to prioritize the production of its own products using the 2nm process. The 2nm process products will initially be utilized for Samsung’s in-house products rather than external customer products.

• Summary

While TSMC’s N3 series currently enjoys broad support, including N3E, N3X, and N3P process series, the move to 2nm introduces new variables as it adopts a completely new GAAFET architecture. Regardless, whether it’s TSMC’s N2, Intel’s 18A, or Samsung’s SF2, each of them possesses its competitive strengths. The industry is also eagerly anticipating the future developments in advanced semiconductor processes.

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• [News] Progress and Adoption of Advanced Processes by Samsung, Intel, and TSMC