In 2022, Intel engaged in negotiations with the Italian government, planning to invest USD 5 billion in constructing a packaging and testing facility. This project would also receive subsidies from the Italian government, expected to cover 40% of the construction costs, along with additional subsidi...

According to sources cited by Reuters,  TSMC is reportedly considering plans to establish a production line for its CoWoS technology in Japan. However, TSMC has yet to make any further decisions, and they have declined to comment on the matter. CoWoS is an advanced packaging technology that stac...

Samsung, as per a report from the global media outlet wccftech, has decided to enter the next generation of packaging technology by commencing R&D works for the adoption of "Glass Substrate" by 2026. The report further indicates that Samsung's preparation to enter the glass substrate indus...

Intel has reportedly retained the export licenses that would have prohibited them from selling laptop processor (CPU) chips to the Chinese telecommunications giant Huawei. This signifies that Intel has temporarily preserved its business of providing chips worth hundreds of millions of dollars to Hu...

Recently, IC design company Marvell announced an expansion of its long-term partnership with TSMC to include 2-nanometer technology. They will collaborate on developing the industry's first 2-nanometer semiconductor production platform optimized for accelerating infrastructure. Currently, the...