Intel


2023-09-08

Continuing Moore’s Law: Advanced Packaging Enters the 3D Stacked CPU/GPU Era

As applications like AIGC, 8K, AR/MR, and others continue to develop, 3D IC stacking and heterogeneous integration of chiplet have become the primary solutions to meet future high-performance computing demands and extend Moore's Law. Major companies like TSMC and Intel have been expanding their i...

2023-09-05

[News] Taiwan Micron Focuses on HBM Advanced Process and Packaging

According to Taiwan's TechNews report, Lu Donghui, Chairman of Micron Technology Taiwan, stated that in response to the growing demand in the AI market, Micron Technology Taiwan will continue to invest in advanced processes and packaging technologies to produce High Bandwidth Memory (HBM) products. ...

2023-08-31

[News] Asus AI Servers Swiftly Seize Business Opportunities

According to the news from Chinatimes, Asus, a prominent technology company, has announced on the 30th of this month the release of AI servers equipped with NVIDIA's L40S GPUs. These servers are now available for order. The L40S GPU was introduced by NVIDIA in August to address the shortage of H100 ...

2023-08-31

[News] Goldman Sachs: TSMC to Win Big with Intel’s Increased Outsourcing

According to a report by Taiwan's Commercial Times, Goldman Sachs Securities has noted that Intel has been consistently grappling with process upgrade delays since the 10-nanometer fabrication process. Recently, the company has decided to establish a foundry-like relationship between its manufacturi...

2023-08-31

Understanding Chiplets, SoC, and SiP: Why TSMC, Intel, Samsung Invest?

Semiconductor process technology is nearing the boundaries of known physics. In order to continually enhance processor performance, the integration of small chips (chiplets) and heterogeneous Integration has become a prevailing trend. It is also regarded as a primary solution for extending Moore's L...

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