Intel


2023-08-11

Intel and Samsung Join TSMC in Fierce Advanced Packaging Race

As semiconductor process technology nears known physical limits, the spotlight among major industry players is shifting towards the development of advanced packaging. Concurrently, the rise of applications like artificial intelligence and AIGC has propelled the concept of advanced packaging into a n...

2023-08-08

[News] Global Wafer Plants: Are Two More on the Horizon?

Leading semiconductor companies are making significant strides in global expansion with the announcement of two new fabrication facilities. TSMC is set to greenlight a factory in Germany, while GlobalFoundries plans to establish its first 12-inch wafer plant in Singapore. TSMC's Bold Move: German...

2023-08-07

TrendForce’s Analysis of Notebook CPU Market 2022-2024

According to the latest report from TrendForce, the primary factors influencing the global market share of notebook CPUs in 2024 can be categorized into "Architectural Design" and "Economic Factors." "Architectural Design" as a long-term factor affecting market share: (1) Both AMD (AMD 3D V-Ca...

2023-06-26

HBM and 2.5D Packaging: the Essential Backbone Behind AI Server

With the advancements in AIGC models such as ChatGPT and Midjourney, we are witnessing the rise of more super-sized language models, opening up new possibilities for High-Performance Computing (HPC) platforms. According to TrendForce, by 2025, the global demand for computational resources in the ...

2023-05-09

Samsung Starts the Foundry Battlefield with a Saying of Surpassing TSMC in 5 Years

Samsung recently announced that they will ahead of TSMC in the foundry market within 5 years. At the same time, Intel also claimed to become the second-largest player in the market before 2030. Currently, both Samsung and TSMC are adapting 3nm process to do the chip manufacturing, with the technolog...

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