Ex-Intel CEO Brian Krzanich was recently appointed as CEO of Cerence Inc., an automotive AI technology company. The announcement quickly sparked criticism and backlash on social media. According to a report from Tom’s Hardware, even Cerence’s LinkedIn page was flooded with disapproving comments, forcing the company to disable the comment section.

According to a press release from Cerence, Krzanich was appointed Chief Executive Officer and a member of the Board of Directors, effective immediately following the announcement on October 7th.

In the press release, Arun Sarin, Chairman of the Cerence Board, stated that “Brian is a proven public company CEO with a successful track record of driving large-scale business transformations, fostering innovation and achieving sustainable growth. His leadership skills and expertise in AI and cloud computing make Brian the right leader to guide Cerence through this transition.”

The press release also highlights Krzanich’s previous experience, noting that he “led Intel into emerging areas such as cloud computing, artificial intelligence, and autonomous driving, while the company scaled from  USD 52 billion to over USD 70 billion in revenue” during his tenure from 2013 to 2018.

However, the announcement of Krzanich’s appointment as CEO has sparked criticism and disapproval on social media, forcing Cerence to shut down the entire comment section.

Among Intel’s former CEOs, Krzanich is often regarded as a controversial figure. During a period of decline in the PC market, he helped shift Intel’s focus toward the Internet of Things (IoT) and cloud computing. However, because he does not believe in the economic scalability of EUV technology, he decided to forgo ASML’s first-generation EUV equipment, resulting in delays in Intel’s 10nm progress. As a result, the company fell behind competitors like TSMC and Samsung in advanced nodes and lost market share to rival AMD.

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• [News] The Semiconductor Giant Falling from Grace: Intel and the CEOs Who Changed Its Destiny

(Photo credit: Cerence Inc.)

Intel, grappling with financial difficulties, is set to enter a peak phase of layoffs this week after announcing plans to cut around 15,000 jobs. According to a report by CTECH, following the departure of employees who opted for early retirement at the end of September, Intel is moving forward with its workforce reduction plan, aiming to complete the layoffs by the end of the year.

CTECH reported that managers across Intel’s divisions have already submitted lists of employees recommended for layoffs to their superiors. These employees will soon be notified, with many expected to receive notices as early as this week. Intel’s CEO, Pat Gelsinger, stated last month that most layoff notices will be issued around mid-October.

CTECH quoted Gelsinger in a message to employees, stating that Intel has already passed the halfway mark in its goal of reducing the workforce by approximately 15,000 employees by the end of the year, largely through voluntary early retirements and separation packages. However, he acknowledged that more difficult decisions lie ahead, with the next round of notifications expected in mid-October.

Intel announced in early August that it would cut approximately 15% of its workforce and suspend dividend payments starting in the fourth quarter. This layoff plan is part of Intel’s broader effort to implement a $10 billion cost restructuring

Then, on September 16th, Intel announced plans to transform its foundry business into a wholly-owned subsidiary with its own board of directors.

(Photo credit: Intel)

According to a report from TechNews, Christophe Fouquet, the CEO of ASML, announced that Intel’s second high-NA EUV system has been completely assembled.

Christophe Fouquet stated that the High-NA EUV machine is less likely to face delivery delays compared to the current standard EUV machines because it can be assembled directly at the customer’s facility, eliminating the need for disassembly and reassembly. This approach saves both time and costs for ASML and its customers, helping to expedite delivery, the report noted.

Mark Phillips, the Director of Lithography Hardware at Intel, announced that the company has successfully completed the installation of two High-NA EUV systems at its Portland facility.

Moreover, Mark Phillips highlighted that the improvements offered by High-NA EUV machines surpass expectations when compared to standard EUV machines.

Mark Phillips also noted that the installation of the second High-NA EUV system was completed even faster than the first. He stated that all necessary infrastructure for the High-NA EUV system is in place, and inspections of the masks used for High-NA EUV have begun as scheduled. As a result, Intel is well-positioned to move into production with minimal additional effort.

Additionally, Mark Phillips was asked about the issue of CAR (Chemically Amplified Resist) versus metal oxide resists. According to the report by TechNews, he stated that while CAR is currently sufficient, there may be a need for metal oxide photoresists at some point in the future. Intel aims to have its Intel 14A process in mass production by 2026-2027, at which point further advancements in the node will be made.

Intel’s early adoption of ASML’s High-NA EUV equipment is seen by many as a crucial move for Intel to reclaim its technological leadership.

Regarding other semiconductor giants, ASML previously confirmed that it will deliver its latest High-NA EUV systems to TSMC by the end of this year. According to a report from the Economic Daily News, it is rumored that TSMC’s first High-NA EUV equipment arrived in September, which will support the company in advancing its process technology.

On the other hand, while Samsung has also decided to purchase ASML’s High-NA EUV equipment, a report from South Korean media outlet BusinessKorea suggests that the company is planning to reduce its procurement of ASML’s next-generation EUV lithography equipment, after Vice Chairman Jun Young-hyun was appointed as the new head of the DS (Device Solutions) division and reviewed ongoing projects and investments.

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• [News] TSMC Strengthens Its Advanced Process with Next-Generation EUV Equipment Reportedly Arriving This Month
• [News] Samsung Reportedly Reduces Procurement of ASML’s Next-Generation EUV Lithography Equipment

(Photo credit: ASML)

Nvidia CEO Jensen Huang’s net worth has now reached USD 109.2 billion, surpassing Intel’s total market value of USD 96.595 billion. This development has sparked excitement among many netizens, with some calling for Huang to acquire Intel and create a new tech industry merger legend.

In fact, tech companies have long led the way in mergers and acquisitions (M&A), driven by the need to stay ahead in technological innovation and strengthen their market positions. Large-scale mergers have been a common strategy for tech giants looking to secure a competitive edge. The M&A Community has compiled a list of the 11 largest tech mergers in history.

Microsoft and Activision Blizzard

Microsoft’s USD 69 billion acquisition of gaming giant Activision Blizzard, completed in 2023 after overcoming regulatory challenges in the U.S. and UK, has solidified the tech giant’s position in the gaming market, particularly for its Xbox platform. Activision Blizzard, known for popular titles such as Warcraft and Call of Duty, gives Microsoft a strategic advantage in the competitive gaming industry.

EMC and Dell

In 2016, Dell finalized its USD 67 billion acquisition of EMC, a leader in data storage and security. The merger, one of the largest in tech history, combined Dell’s hardware expertise with EMC’s advanced storage solutions, strengthening its position in enterprise IT and cloud computing.

AMD and Xilinx

AMD’s USD 49 billion acquisition of Xilinx, completed in 2022, marked a significant expansion of AMD’s semiconductor capabilities, particularly in adaptive computing. The deal, initially valued at USD35 billion, surged in value by the time it closed, positioning AMD as a major player in the semiconductor industry.

Avago and Broadcom

Avago’s USD 37 billion acquisition of Broadcom in 2016 brought together two semiconductor powerhouses. The merger created a stronger presence in wireless communications and infrastructure, with Broadcom’s strengths in communications semiconductors complementing Avago’s portfolio in wired and wireless solutions.

IBM and Red Hat

IBM’s USD 34 billion purchase of open-source leader Red Hat in 2019 was a landmark deal, designed to boost IBM’s cloud and hybrid cloud offerings. The acquisition positioned IBM as a key player in enterprise cloud solutions, leveraging Red Hat’s expertise in open-source software.

Salesforce and Slack

Salesforce completed its USD 27.7 billion acquisition of Slack in 2021, a move aimed at integrating Slack’s communication platform with Salesforce’s customer relationship management (CRM) tools. The deal created a unified solution for enterprise collaboration, further enhancing Salesforce’s suite of cloud-based business tools.

Microsoft and LinkedIn

Microsoft’s USD 26.2 billion acquisition of LinkedIn in 2016 was designed to enhance business productivity by integrating LinkedIn’s networking platform with Microsoft’s suite of enterprise software. The deal allowed Microsoft to expand its reach in the professional networking space.

HP and Compaq

HP’s USD 25 billion acquisition of Compaq in 2002 was one of the largest tech mergers at the time, but it ultimately became known as a failure. The merger led to significant market value losses for HP, and its long-term impact was negative.

Facebook (Meta) and WhatsApp

Facebook’s USD 19 billion acquisition of WhatsApp in 2014 was widely regarded as a success. The deal allowed Facebook, now Meta, to significantly expand its global reach, particularly in international markets where WhatsApp has a strong user base.

Silver Lake and Qualtrics

In 2023, Silver Lake completed a USD 12.5 billion deal to acquire Qualtrics from SAP, marking another high-value transaction in the tech industry. The acquisition strengthened Silver Lake’s investment portfolio, particularly in the data analytics and survey software space.

Adobe and Marketo

Adobe’s USD 4.75 billion acquisition of Marketo in 2018 enhanced its marketing automation capabilities, allowing Adobe to offer a more comprehensive marketing platform to both B2B and B2C clients. The deal boosted Adobe’s presence in digital marketing solutions.

(Photo credit: Microsoft)

Intel’s first processor using rival TSMC’s technology, the Lunar Lake, has officially launched, intensifying the competition with AMD. According to a recent report by TechNews, third-party testing has confirmed Intel’s claims: Lunar Lake is indeed the most energy-efficient x86 processor to date, outperforming Qualcomm’s Snapdragon X and even rivaling Apple’s M3, reminiscent of Apple’s groundbreaking M1 launch.

TechNews attributes this success not only to Intel’s redesign of power supply, frequency regulation, and packaging but also to the advanced TSMC N3B process.

Recently, Intel announced that in order to reduce costs and better prepare for its in-house 18A process, it has decided to abandon the introduction of the 20A process. As a result, the Arrow Lake chip launching this month will also use TSMC’s process. TechNews raised the question in their article: “With Intel’s new platforms expected to rely on TSMC’s process at least until 2026, will AMD face significant challenges?”

Can AMD’s Zen 5 architecture turn the tide?

TechNews noted that AMD’s current advantage over Intel rests heavily on using TSMC’s process. However, AMD is not alone in benefiting from TSMC’s power efficiency. Across the board, chips produced with TSMC technology have demonstrated superior energy efficiency, delivering high performance without consuming excessive power. But, with the efficiency gains from advanced nodes like M4 or A18 nearing their limits, chipmakers will need to adopt more aggressive power and frequency strategies to push performance further.

Lunar Lake’s impressive energy efficiency highlights both TSMC’s process advantage and Intel’s enduring design prowess. This should serve as a warning for AMD, which plans a major push into the laptop market in 2025. With the launch of Strix Point and Hawk Point this year, AMD aims to release five new platforms next year, targeting the mid-to-high-end laptop market. However, reviews of Strix Point already show that, while performance has improved, energy efficiency remains stagnant—a problem that could persist with future Zen 5-based products.

This opens a window of opportunity for Arrow Lake, which is now powered by TSMC’s process. If Arrow Lake can offer higher peak performance than Raptor Lake Refresh or Meteor Lake while maintaining strong energy efficiency—and with better OEM partnerships—AMD’s hard-earned foothold in the mid-to-high-end market may once again be overshadowed by Intel.

Facing competition shifts due to process changes is nothing new for AMD. As mentioned in the TechNews report, when NVIDIA launched the RTX 30 series on Samsung’s 8LPU (8nm) process, early issues with leakage and high power consumption gave AMD’s RX 6000 series GPUs, known for their superior performance and energy efficiency, a competitive edge. The high-end 6800 and 6900 models were even able to compete with NVIDIA’s RTX 3080. However, once NVIDIA returned to TSMC for the RTX 40 series, AMD struggled to keep up and eventually abandoned its high-end GPU plans, shifting focus to niche markets.

TechNews concludes that while next year may see the lowest degree of processor process diversity—since almost everyone is using TSMC—it will also be a critical year to evaluate the true design strengths of each semiconductor company. With AMD’s Zen 5 already on the table, all eyes are now on Intel’s Arrow Lake to see what surprises it brings to the market with TSMC’s technology.

(Photo credit: AMD)