Due to restrictions on AI products’ usage in China, Apple is actively seeking Chinese partners to advance in the local AI application market. According to the latest report by the Economic Daily News, the tech giant has been engaged with Chinese firms such as Baidu, Alibaba, and Baichuan Intelligence to push AI efforts. While the move helps to boost these firms’ investment in AI server infrastructure, it may further benefit Taiwan’s AI server supply chain.

The report noted that the industry is optimistic about Baidu’s potential cooperation with Apple, while Alibaba is also a strong competitor. Taiwanese contract electronics manufacturer Inventec, a contract manufacturing partner for both Baidu and Alibaba’s servers, thus reportedly positions itself as a major winner in Apple’s bid to capture the Chinese AI application market.

It is worth noting that Inventec has formed strong partnership with Baidu, as the company has been providing customized server manufacturing services for the Chinese search engine leader for 13 years, according to the report. Inventec has been a key partner since the second generation of Baidu’s super AI computing platform, X-MAN 2.0, which addresses cooling challenges with cold plate liquid cooling technology.

Inventec’s clients include the four major North American cloud service providers (CSPs) as well as Chinese CSP giants such as Baidu, Alibaba, Tencent, and ByteDance.

Based on the information disclosed on its official website, Inventec not only builds edge computing products for brand-name server customers, but also focuses on customizing designs to meet cloud clients’ demands for deep learning, training, and machine learning by maximizing the synergies between CPU and GPU.

The pressure Apple has been facing in the Chinese market, on the other hand, is escalating in the AI arena. As China is Apple’s largest market for iPhones outside the United States, in order to bring AI functions into its devices, Apple is still searching for a Chinese AI partner to support its new iPhone launch in a few months.

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• [News] Apple’s AI Push on iPhone 16 in China Faces Obstacles in Finding Local Partners

(Photo credit: Inventec)

During NVIDIA founder and CEO Jensen Huang’s keynote speech on June 2, he shared insights on how the AI era is driving the development of a new global industrial revolution.

According to a report from TechNews, he covered various technologies and application areas, including advancements in accelerated computing, microservices, industrial digitalization, and consumer devices, which are expected to become key focus areas in the evolving AI market.

• Accelerated Computing

1. Collaboration between the computer industry and NVIDIA to build AI factories and data centers: NVIDIA and leading computer manufacturers worldwide announced today the launch of a series of systems based on the NVIDIA Blackwell architecture. These systems feature Grace CPUs, NVIDIA networking technologies, and infrastructures to assist enterprises in establishing AI factories and data centers.

2. Foxconn utilizes NVIDIA artificial intelligence and Omniverse technology to train robots and streamline assembly operations: Foxconn operates over 170 plants worldwide, with its latest being a virtual plant driving the latest developments in industrial automation technology.

The latest of Foxconn’s plant is a digital twin model of a new factory in Guadalajara, Mexico, a hub for the electronics industry. Engineers at Foxconn define processes and train robots in this virtual environment to enable physical factories to efficiently produce the next generation of accelerated computing engines, the NVIDIA Blackwell HGX system.

3. NVIDIA significantly strengthens Ethernet networks for generative artificial intelligence: NVIDIA announced widespread adoption of the NVIDIA Spectrum-X Ethernet platform and will accelerate the release of new products. CoreWeave, GMO Internet Group, Lambda, Scaleway, STPX Global, and Yotta are the first batch of AI cloud service providers to adopt NVIDIA Spectrum-X, bringing ultimate network performance to their AI infrastructure.

Additionally, NVIDIA’s partners have also released products utilizing the Spectrum platform, including ASRock Rack, ASUS, GIGABYTE Technology, Ingrasys Inc., Inventec, Quanta Cloud Technology, Wistron and Wiwynn. Moreover, Dell Technologies, Hewlett Packard Enterprise, Lenovo, and Super Micro Computer have collaborated with NVIDIA to incorporate the Spectrum platform into their respective products.

• Microservices

NVIDIA NIM has revolutionized deployment model: NVIDIA has announced that its inference microservice, NVIDIA NIM, optimized in container form, is now available for download by 28 million developers worldwide.

This allows deployment to cloud, data centers, or workstations, enabling developers to effortlessly build generative artificial intelligence applications for assisting partners, such as copilots and chatbots, within minutes, a process that previously took several weeks.

• Industrial Digitalization

1. Electronics manufacturers adopt NVIDIA AI and Omniverse to drive robotic factories and accelerate industrial digitization: NVIDIA announced that major Taiwanese electronics manufacturers, including Delta Electronics, Foxconn, Pegatron Corporation, and Wistron Corporation, are using NVIDIA’s technology to transform their factories into more autonomous production facilities through new reference workflows.

This workflow combines NVIDIA Metropolis visual artificial intelligence (AI) technology, NVIDIA Omniverse’ physically accurate rendering and simulation technology, and NVIDIA Isaac’s AI robot development and deployment technology.

2. Industry leaders adopt NVIDIA’s robotic technology to develop tens of millions of AI-supported autonomous machines, including BYD Electronics, Siemens, Teradyne Robotics, and Alphabet’s Intrinsic, among more than ten global leading companies in the robotics industry.

These companies integrate NVIDIA Isaac acceleration libraries, physically principled simulation content, and AI models into their software frameworks and robot models to enhance efficiency in factories, warehouses, and distribution centers. This enables human colleagues to work in safer environments and serves as intelligent assistants in executing repetitive or ultra-precise tasks.

3. NVIDIA introduces NVIDIA IGX with Holoscan support, enabling enterprise software to run medical, industrial, and scientific artificial intelligence applications in real-time at the edge: To meet the growing demand for real-time artificial intelligence computing technology at the industrial edge, NVIDIA announces the comprehensive launch of NVIDIA AI Enterprise-IGX software with Holoscan on the NVIDIA IGX platform.

• Consumer Devices

1. NVIDIA utilizes GeForce RTX AI PC to deliver the real AI assistant experience: NVIDIA announces the launch of the new NVIDIA RTX technology, designed to support AI assistants and digital human platforms running on new GeForce RTX AI laptops.

2. NVIDIA introduces Digital Human Microservices to lay the foundation for future generative AI digital avatars: NVIDIA announces the comprehensive rollout of NVIDIA ACE generative artificial intelligence microservices to accelerate the development of the next wave of digital humans and numerous breakthroughs in generative AI soon to be introduced on the platform.

Companies in customer service, gaming, and healthcare sectors are among the first to adopt ACE technology, making it easier to create, personalize, and interact with realistic digital humans. These microservices have broad applications in customer service, telehealth, gaming, and entertainment.

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(Photo credit: NVIDIA)

Astera Labs, a leading provider of AI server connectivity solutions, has announced that it will gather Taiwanese manufacturers to establish its first Cloud-Scale Interop Lab outside of Silicon Valley in Taiwan. According to a report from Commercial Times, the company will closely collaborate with major Taiwanese ODM clients, while key manufacturers such as Quanta, Inventec, Wistron, Wiwynn, and Foxconn are expected to benefit from this initiative.

The emerging AI company Astera Labs has surpassed a market value of USD 10 billion and is renowned for providing high-speed transmission interface solutions for AI servers. Founded in 2017, the company celebrated its new public listing on NASDAQ this March.

Per a report from Business Today, the company, headquartered in California, USA, specializes in Retimer chips used for transmission in cloud data centers. These chips mitigate electronic signal attenuation issues, making them widely adopted in the market following PCIe Gen 5.

In response to the rapid expansion of the AI server market, Astera Labs is following in NVIDIA’s footsteps by establishing an R&D center, the Cloud-Scale Interop Lab, in Taiwan.

• • [COMPUTEX 2024] The Rise of Generative AI Sparks Innovation across Industries, with Taiwan-based Companies Leading as Essential Partners in the Global Supply Chain

(Photo credit: Astera Labs)

Apple is reportedly intensifying its AI efforts, with plans to collaborate with Baidu on the Chinese version of its iPhone 16 series this year, as per a report from Economic Daily News. The devices will feature Baidu’s developed Generative AI technology, thus sparking a new wave of AI server deployment by Baidu.

In China, due to official requirements, providing generative AI services to ordinary consumers requires prior approval and scrutiny from relevant authorities. Only Chinese companies like Baidu and Alibaba have been granted permission. Apple has chosen Baidu as its AI service partner in the Chinese market.

According to the aforementioned reports, Apple and Baidu have entered into negotiations, planning to integrate Baidu’s generative AI services into products such as the iPhone for sale in China. By incorporating a Chinese version of AI, Apple aims to enhance its competitive advantage in the Chinese market.

Inventec, a Taiwanese manufacturer, has had close collaboration with Baidu for 13 years in the field of customized server manufacturing, has jointly developed an AI computing platform. Serving as a key server manufacturing partner for Baidu’s “All in AI” strategy, Inventec plays a major role in Apple’s swift push into the Chinese AI market alongside Baidu.

Inventec has traditionally refrained from commenting on order dynamics and customer relationships, emphasizing instead the robust shipment momentum of AI servers this year. Shipments are expected to more than double compared to last year. With AI server revenue accounting for approximately 5% to 6% last year, it is projected to surpass 10% this year.

Sources cited by the same report from Economic Daily News are optimistic that with Baidu becoming a key partner for Apple in the China’s generative AI landscape, Inventec’s AI server shipment momentum is poised to amplify, benefiting from the opportunities brought by the collaboration between Apple and Baidu.

As per a previous report from TrendForce, Baidu’s foray into AI chips can be traced back to as early as 2011. After seven years of development, Baidu officially unveiled its self-developed AI chip, Kunlun 1, in 2018. Built on a 14nm process and utilizing the self-developed XPU architecture, Kunlun 1 entered mass production in 2020. It is primarily employed in Baidu’s search engine and Xiaodu businesses.

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• [News] Apple Reportedly Places Large Orders for TSMC’s 3nm While Simultaneously Securing Significant Advanced Packaging Capacity
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(Photo credit: Apple)

Intel collaborates with Foxconn, Microloops, and Inventec to introduce a new cooling technology. Boasting superior performance compared to conventional liquid cooling, this initiative, alongside Gigabyte and Wiwynn, aims to enter the server immersion liquid cooling technology market, positioning themselves for potential orders.

TrendForce’s Insights:

1. Intel Teams Up with Taiwanese Manufacturers to Pave the Way for Liquid Cooling Technologies, Targeting Immersive Water-Cooled AI Server Orders

Intel, in collaboration with Foxconn, Microloops, and Inventec, introduces a brand new Liquid Cooling solution. This technology, capable of managing Thermal Design Power (TDP) exceeding 1500W, utilizes the principles of physical pressurization to facilitate rapid liquid flow for efficient heat dissipation.

With a threefold improvement in performance over conventional liquid cooling, the liquid cooling plate circulates water to dissipate heat. Future developments include non-conductive liquid solutions to mitigate leakage risks.

Simultaneously, Gigabyte’s subsidiary, GIGA Computing Technology, partners with liquid cooling experts CoolIT and Motivair to unveil cutting-edge liquid cooling solutions. The strategic focus on liquid and immersive liquid cooling aims to enhance the sustainability and energy efficiency of data centers.

Wiwynn, also keenly interested in liquid cooling technology, has secured substantial orders from Middle Eastern clients by prioritizing two-phase immersion cooling technology, with rumors suggesting the order’s value is approximately USD 4 billion.

The advantages of two-phase cooling technology include fanless operation, rapid heat dissipation, noiseless and vibration-free performance, and higher cooling energy efficiency. Moreover, it is less susceptible to environmental influences, ensuring normal usage.

On the other hand, Taiwanese manufacturers, AURAS Technology and AVC (Asia Vital Components), are actively developing and mass-producing open-loop liquid cooling and immersion liquid cooling technologies.

Due to the novelty of immersion cooling technology, the current market demand visibility is relatively low. However, major Taiwanese contract manufacturers are increasingly focusing on the technical development and introduction of immersion cooling solutions. This is primarily driven by the growing demand for high-end AI servers, which require efficient computation and often generate high power consumption.

At present, only immersion liquid cooling can provide a cooling solution surpassing 1500W, meeting the requirements of large-scale data centers. Consequently, numerous Taiwanese manufacturers are actively engaging in the development of this technology to seize the opportunities presented by the initial wave of immersion liquid cooling products.

2. Short-Term Dominance of 3D VC Air Cooling and Open Liquid Cooling Technologies in Heat Dissipation Solutions

Due to the need for adjustments in facility structure, including the layout of cooling spaces, immersion liquid cooling comes with higher construction costs. Cases of immersion liquid cooling in large-scale data centers are also relatively rare.

In consideration of cost, many enterprise users still opt for 3D VC (Vapor Chamber) air cooling technology to establish their data centers, aiming to save on the significant costs associated with facility modifications.

3D VC air cooling and open liquid cooling technologies are the current primary options for heat dissipation solutions. The retrofitting cost for 3D VC is twice that of traditional cooling modes, while the cost for liquid cooling solutions can be up to 10 times higher than traditional modes.

Therefore, enterprise users need to tailor their server deployments based on specific requirements, taking into account the Thermal Design Power (TDP) to choose the corresponding heat dissipation solution.

For instance, AI servers with power consumption ranging from 1000 to 1500W can utilize open liquid cooling solutions, while those below 1000W may adopt the 3D VC cooling approach.

With the target of achieving net-zero emissions by 2050, both China and Europe impose restrictions on the Power Usage Effectiveness (PUE) of data centers, limiting it to no higher than 1.4.

In anticipation of this, server OEMs and cooling solution providers are expected to increase the development and offerings of liquid and immersive liquid cooling products. This trend aims to provide data centers with customized solutions and services, aligning with the evolving energy efficiency requirements.