According to a report on the official website of the Shanghai Qingpu District’s Government on August 11th, the exterior construction and interior decoration of Huawei’s Xicen apartment project in Shanghai have been completed, and the project has entered its final stages.

The apartments are expected to be finished by the end of September this year. Once completed, the project will provide over 6,000 housing units for the influx of Huawei research talent moving to Qingpu (Shanghai). This further hints that Huawei’s largest global R&D center is getting closer to being fully operational.

The project, which started construction in December 2023, will provide ample accommodation for employees serving in the eight parks at Huawei’s Lianqiu Lake R&D Center. Once completed, it will house over 15,000 people.

Reportedly, the Huawei Lianqiu Lake R&D Center in Shanghai’s Qingpu District, was completed on July 9. It covers an area of 2,400 acres, with a total building area of 2.06 million square meters and an investment exceeding CNY 10 billion.

The center is mainly used for research, office space, and supporting facilities, including R&D offices, laboratories, conference halls, cafeterias, and data centers.

This research center, per a previous report from EE Times China, is designed with 40,000 offices and is expected to gradually attract about 35,000 Huawei R&D talents.

The focus will be on R&D, product design, and sales in areas such as 5G chips, wireless, and the Internet of Things (IoT). By the end of this year, it is anticipated that 10,000 personnel will have joined the new R&D center, primarily consisting of employees from other Huawei R&D centers and newly hired research and development talent.

Regarding Huawei’s substantial investment in building this research center, tech media outlet “Tom’s Hardware” highlighted on July 14th that amid the US-China semiconductor rivalry and various US sanctions against Huawei, the company must bolster its research and development efforts. Consolidating multiple research centers allows Huawei to streamline operations and facilitate easier collaboration among different departments.

The report states that this flagship project showcases Huawei’s investment commitment in future technologies. The new R&D Center is even said to be larger in scale than the combined size of Apple Park and Microsoft’s Redmond Campus headquarters in Seattle.

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(Photo credit: Huawei)

AI industry has been driving semiconductor industry to advance forward. Benefited from the surge in AI-driven demand for advanced process chip, foundry industry is experiencing a gradual turnaround, while demands for consumer chip and automotive chip have not yet fully recovered, and competition remains fierce in the mature process chip sector, representing a stark contrast within the wafer foundry industry.

• Financial Results Indicate Strong AI Development but Weak Automotive Terminal Demands

Recently, several major foundries released their Q2 financial reports and shared outlook on future market conditions.

For the second quarter ending June 30, TSMC reported consolidated revenue of approximately USD 20.82 billion, up 32.8% YoY and 10.3% QoQ, which was attributed to strong demand for its 3nm and 5nm technologies.

As per the financial report, revenue from advanced technologies (7nm and below) accounted for 67% of TSMC’s total wafer revenue in 2Q24. In terms of application areas, HPC has replaced mobile business as the core driver of the company’s growth, contributing 52% of revenue.

Additionally, although TSMC’s automotive electronics revenue grew 5% QoQ, the company warned of a potential downturn in the automotive market this year.

UMC reported Q2 revenue of TWD 56.8 billion, up 4% QoQ. UMC expected customer inventories in the communications, consumer electronics, and computer sectors to return to seasonal levels as usual in the second half of this year, and to reach healthy levels by the end of the year.

However, demand in the automotive end market remains weak, which may extend the period of inventory adjustment, with healthy levels anticipated only by the first quarter of next year.

On August 6, GlobalFoundries released its latest financial report.

In the second quarter of this year, the company achieved revenue of USD 1.63 billion, a year-on-year decrease of 12% and a quarter-on-quarter increase of 5%. Net profit was USD 155 million, a year-on-year decrease of 35% and a quarter-on-quarter increase of 16%.

Industry sources cited by the report from WeChat account DRAMeXchange believe that during the pandemic, customers in sectors such as IoT, mobile device, and data center accumulated high inventory, which impacted GlobalFoundries’ revenue.

Moreover, the company is experiencing a cyclical downturn due to soft demands in the automotive, industrial, and other sectors.

• Advanced Processes Continue to Thrive while Mature Processes Face Intense Competition

The adoption of AI generative models keeps on the rise, driving high demand for AI chip. In this context, advanced processes have been well-received, leading to price increase and production expansion.

TrendForce’s survey in June showed that TSMC is seeing full capacity utilization in its 5/4nm and 3nm nodes due to strong demand from AI applications, new PC platforms, HPC applications, and high-end smartphones.

Its capacity utilization is expected to exceed 100% in the second half of the year, with visibility extending into 2025. Given cost pressures from overseas expansion and rising electricity prices, TSMC plans to raise prices for its advanced processes, which are experiencing strong demand.

TSMC is seeing full capacity utilization in its 5/4nm and 3nm nodes due to strong demand from AI applications, new PC platforms, HPC applications, and high-end smartphones. Its capacity utilization is expected to exceed 100% in the second half of the year, with visibility extending into 2025.

Given cost pressures from overseas expansion and rising electricity prices, TSMC plans to raise prices for its advanced processes, which are experiencing strong demand.

As per other sources cited by the same report, TSMC informed customers of a price increase for 5/3nm process products in 2024 at the beginning of this year.

In late July, TSMC notified several customers that due to rising costs, prices for 5/3nm process products will increase again starting January 2025, and the increase will range from 3-8%, depending on the tape-out plan, product, and partnership.

Meanwhile, the surge in demand for advanced packaging driven by AI will also lead to higher CoWoS prices.

To seize the significant opportunities brought by AI, many companies are actively investing in advanced processes. Currently, the 3nm process is the most advanced in the industry.

Meanwhile, TSMC, Samsung, Intel, and Rapidus are vigorously promoting the construction of 2nm fabs. Previously, TSMC and Samsung intended to produce 2nm chip at scale in 2025, while Rapidus planed to start trial production in 2025.

Following 2nm, 1nm chip will be the next goal for these fabs. According to their plans, the industry is likely to see the mass production of 1nm chip from 2027 to 2030.

Unlike the rising prices and volume in advanced process chip, mature process chip faces some uncertainty due to weaker-than-expected recovery in end-user demand, and sees more intense competition among manufacturers.

TrendForce’s survey reveals that the capacity utilization rates of PSMC and Vanguard is expected to improve more than anticipated in the second half of the year. However, overall demand for mature processes remains weak, with average capacity utilization still around 70–80%—indicating no significant shortages.

TrendForce further pointed out that in 2024, concerns over global inflation and weak recovery in end-demand may result in inconsistent momentum in replenishing inventory. Many foundries might offer price incentives to attract customers and boost capacity utilization, leading to a decline in overall ASP.

Furthermore, a significant amount of new capacity is expected to come online in 2025, including TSMC JASM, PSMC P5, SMIC’s new Beijing/Shanghai plants, HHGrace Fab9, HLMC Fab10, and Nexchip N1A3.

This increase in mature process capacity could intensify competition and impact future pricing negotiations.

Read more

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(Photo credit: TSMC)

Over the past few decades, semiconductor manufacturing technology has evolved from the 10,000nm process in 1971 to the 3nm process in 2022, driven by the need to increase the number of transistors on chips for enhanced computational performance. However, as applications like artificial intelligence (AI) and AIGC rapidly advance, demand for higher core chip performance at the device level is growing.

While process technology improvements may encounter bottlenecks, the need for computing resources continues to rise. This underscores the importance of advanced packaging techniques to boost the number of transistors on chips.

In recent years, “advanced packaging” has gained significant attention. Think of “packaging” as a protective shell for electronic chips, safeguarding them from adverse environmental effects. Chip packaging involves fixation, enhanced heat dissipation, electrical connections, and signal interconnections with the outside world. The term “advanced packaging” primarily focuses on packaging techniques for chips with process nodes below 7nm.

Amid the AI boom, which has driven demand for AI servers and NVIDIA GPU graphics chips, CoWoS (Chip-on-Wafer-on-Substrate) packaging has faced a supply shortage.

But what exactly is CoWoS?

CoWoS is a 2.5D and 3D packaging technology, composed of “CoW” (Chip-on-Wafer) and “WoS” (Wafer-on-Substrate). CoWoS involves stacking chips and then packaging them onto a substrate, creating a 2.5D or 3D configuration. This approach reduces chip space, while also lowering power consumption and costs. The concept is illustrated in the diagram below, where logic chips and High-Bandwidth Memory (HBM) are interconnected on an interposer through tiny metal wires. “Through-Silicon Vias (TSV)” technology links the assembly to the substrate beneath, ultimately connecting to external circuits via solder balls.

The difference between 2.5D and 3D packaging lies in their stacking methods. 2.5D packaging involves horizontal chip stacking on an interposer or through silicon bridges, mainly for combining logic and high-bandwidth memory chips. 3D packaging vertically stacks chips, primarily targeting high-performance logic chips and System-on-Chip (SoC) designs.

When discussing advanced packaging, it’s worth noting that Taiwan Semiconductor Manufacturing Company (TSMC), rather than traditional packaging and testing facilities, is at the forefront. CoW, being a precise part of CoWoS, is predominantly produced by TSMC. This situation has paved the way for TSMC’s comprehensive service offerings, which maintain high yields in both fabrication and packaging processes. Such a setup ensures an unparalleled approach to serving high-end clients in the future.

Applications of CoWoS

The shift towards multiple small chips and memory stacking is becoming an inevitable trend for high-end chips. CoWoS packaging finds application in a wide range of fields, including High-Performance Computing (HPC), AI, data centers, 5G, Internet of Things (IoT), automotive electronics, and more. In various major trends, CoWoS packaging is set to play a vital role.

In the past, chip performance was primarily reliant on semiconductor process improvements. However, with devices approaching physical limits and chip miniaturization becoming increasingly challenging, maintaining small form factors and high chip performance has required improvements not only in advanced processes but also in chip architecture. This has led to a transition from single-layer chips to multi-layer stacking. As a result, advanced packaging has become a key driver in extending Moore’s Law and is leading the charge in the semiconductor industry.

(Photo credit: TSMC)

According to TrendForce, the global quantum computing market was valued at US$470 million in 2021, an increase of 16.7% compared to 2020. This market is mainly led by China and the United States, driving global quantum computing and its technological progress, especially in upper-layer software. In terms of algorithmic speed, small-scale problems have been put to the test through experimentation. The market is expected to reach US$580 million in 2022, with an annual growth rate of approximately 18.8%, and current growth rate expanding every year until 2027.

According to TrendForce, as stated in the Chinese government’s plan for software and information technology services, its quantum technology policy will be further implemented from a national level to departments including national defense, industry, and technology and more targeted policies will be released through tiered departmental levels such as for AI, quantum information technology, biotechnology, semiconductors, and autonomous systems. To this end, the Chinese government is establishing relevant laboratories in Beijing, Shanghai, and Hefei to promote the rapid development of quantum technology and quantum computing cloud platforms.

When China launched its “Five-Year Plan” in 2006 to promote economic and industrial development, it also focused on the development of quantum science and technological breakthroughs, as well as the deeply integrated development and application of quantum computing in emerging technologies such as AI, edge computing, big data, IoT, and cloud such as advanced space quantum communication technology and quantum computing combined with AI/ML, IoT, and cloud, providing assistance to the Chinese Academy of Sciences’ quantum satellites, the University of Science and Technology of China’s quantum computer, and other quantum processors to achieve breakthroughs in technology and functional characteristics. Therefore, the cumulative investment in China’s quantum field is estimated to reach US$15 billion in 2022.

Main applications of China’s quantum computing market

Considering the immense size, extremely harsh operating environment, and high price of quantum computers, quantum computing applications are rapidly developing towards cloud platforms. Therefore, research on quantum computers primarily focus on four types of applications: simulation, optimization, cryptography, and machine learning. “Simulation” is most used in processes that occur in nature such as weather forecasting, mid- and long-term climate deductions, and polar climate change. It is also widely used in fluid mechanics, drug discovery, battery design, and high-frequency trading, derivatives, and options pricing in the financial industry.

“Optimization” is the use of quantum algorithms to determine the best solution among a set of feasible options and is mostly used for risk management in traffic arteries, logistics, self-driving navigation systems, and financial investment portfolios. “Machine learning” is used to identify patterns in data and statistics, enhance the training of machine learning algorithms, accelerate AI development, and introduced to self-driving cars and financial systems to prevent fraud and money laundering.

As enumerated above, the scope of quantum computing applications is gradually expanding, covering fields including supply chain, finance, transportation, logistics, pharmaceuticals, chemicals, automobiles, aviation, energy, and meteorology. Sectors such as pharmaceuticals, chemicals, and new materials use quantum operations to analogize molecular properties, directly analyze and obtain large molecular properties through a computerized digital format, shorten the time for theoretical verification, and thereby accelerating drug research and development and the development of new materials.

In the automotive field, in order to accelerate the promotion of electrification strategies, major carmakers have applied quantum computing to chemical analogies and are committed to developing batteries with better performance. In the aerospace field, quantum computing is used to solve some of the most difficult challenges facing the aviation industry, from basic materials, product research and development, machine learning optimization, to complex system optimization, and are even changing the way aircraft are made and fly.

（Image credit: Pixabay）

Exponential demand growth for remote and unmanned terminals in smart home, logistics, manufacturing and other end-user applications has driven iterative updates in Wi-Fi technology. Among the current generations of technologies, Wi-Fi 5 (802.11ac) is mainstream while Wi-Fi 6 and 6E (802.11ax) are at promotional stages, according to TrendForce’s investigations. In order to meet the connection requirements of industry concepts such as the Metaverse, many major manufacturers have trained their focus on the faster and more stable next generation 802.11be Wi-Fi standard amendment, commonly known as Wi-Fi 7. Considering technical characteristics, maturity, and product certification status, Wi-Fi 6 and 6E are expected to surpass Wi-Fi 5 to become mainstream technology in 2022, with global market share expected to reach 58%.

TrendForce states, in common residential applications of Wi-Fi, Wi-Fi 6E supports 6GHz and expands bandwidth by at least 1200MHz, delivering higher efficiency, throughput, and security than Wi-Fi 6, and can optimize remote work, VR/AR, and other user experiences. Moreover, in terms of the vertical IoT sector with the highest output value, smart manufacturing still mostly employs Ethernet and 4G/5G mobile networks as the central communication technologies in current smart factories. However, as early as 2019, major British aerospace equipment manufacturer, Mettis Aerospace, and the Wireless Broadband Alliance (WBA) conducted phased testing of the practicality of Wi-Fi 6 in factories, and they believe that Wi-Fi 6 can be widely adopted for manufacturing.

Market not yet mature, practical application of Wi-Fi 7 must wait until the end of 2023 at the earliest

TrendForce believes that the introduction of Industry 4.0 technology tools will become more common and the degree of digitalization within companies will increase in the post-pandemic era, with 5G and Wi-Fi expected to bring complementary and synergistic effects to the manufacturing field. The primary reason for this is that 5G characteristics include wide connection, large bandwidth, and low latency. In addition, multi-access edge computing (MEC) and standalone (SA) network slicing can improve computing power and flexibility, all of which significantly upgrade smart manufacturing tools. Although the transmission range of Wi-Fi is small, it resists interference and enhances the physical penetration of wireless signals at smart manufacturing locations. Wi-Fi also reduces the cost of 5G distributed antennas and small base stations while extending communications range and improving equipment battery life.

Looking forward to next generation Wi-Fi 7, companies such as MediaTek, Qualcomm, and Broadcom, are already laying the groundwork for their forays into this standard. TrendForce believes, even though focus is currently shifting to Wi-Fi 7, scheduled application of Wi-Fi 7 is expected to fall between the end of 2023 and the beginning of 2024. Challenges remain in terms of overall development and issues such as equipment investment, spectrum usage, deployment cost, and terminal equipment penetration must all be overcome in order to demonstrate the technical benefits of Wi-Fi 7.