On January 26th, the Semiconductor Equipment Association of Japan (SEAJ) released statistical data revealing that in December 2023, sales of semiconductor equipment in Japan amounted to JPY 305.799 billion (approximately USD 2.07 billion), marking a 2.4% increase from November 2023.

This represents the second consecutive month of month-on-month growth. However, compared to the same month in 2022, there was a slight decline of 0.3%, marking the seventh consecutive month of contraction. Nonetheless, this decline is significantly smaller compared to the 11% decrease observed in the previous month.

In 2023, the total annual sales of semiconductor equipment in Japan amounted to roughly JPY 3.29 trillion (approximately USD 22.26 billion), reflecting a 6.7% year-on-year decrease. Despite the decline, this figure still represents the second-highest sales record in history, second only to the JPY 3.85 trillion (approximately USD 26.05 billion) recorded in 2022.

SEAJ predicts that aside from the recovery of foundries and logic manufacturers, expenditures from memory manufacturers are expected to significantly rebound in the second half of the fiscal year 2023 (from September 2023 to March 2024). It is anticipated that the compound annual growth rate (CAGR) will continue at 10% until March 2026.

Moreover, driven by the demand for new expenditures related to artificial intelligence (AI), semiconductor equipment sales in Japan are forecasted to surge by 27% in the fiscal year 2024 (starting from April 2024), reaching JPY 4.03 trillion (approximately USD 27 billion).

TrendForce has previously reported that Japan’s resurgence in the semiconductor arena is palpable, with the Ministry of Economy, Trade, and Industry fostering multi-faceted collaborations with the private sector. With a favorable exchange rate policy aiding factory construction and investments, the future looks bright for exports.

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• [News] Multiple Fabs in Japan to Commence Production Post-2024 Boosting Industry

Japanese telecommunications operator NTT is reportedly collaborating with American chipmaker Intel and other semiconductor manufacturers to research large-scale production of next-generation semiconductor technology, which involves significantly reducing power consumption using optical technology.

According to a report from Nikkei, SK Hynix is also set to participate in this initiative, expected to counter China through collaborative research and development strategies.

Meanwhile, the Japanese government will provide approximately JPY 45 billion in support. As cited by Nikkei quoting Japan’s Ministry of Economy, Trade, and Industry, Japan can lead the world in this technology as part of its strategy to revitalize the national semiconductor industry.

These companies are reportedly aiming to develop equipment manufacturing technology that integrates light with semiconductors and memory technology capable of storing data at Terabit-class speeds by the fiscal year 2027. Intel will provide technical development suggestions, aiming to reduce power consumption by 30-40% compared to conventional products.

As semiconductor scaling reaches physical limits, as per a report from TechNews, the industry is turning towards light. When combined with semiconductors, known as silicon photonics, it is expected to significantly reduce energy consumption. This technology is also seen as potentially game-changing for the semiconductor industry.

Signals received through optical communication is converted into electrical signals by specialized equipment, which are then transmitted to data center servers. Semiconductors within the servers then exchange electrical signals to process computations and memory. With the proliferation of AI and the need to process massive amounts of data, the demand for optical technology is anticipated to increase.

The integration of silicon photonics still presents numerous challenges, primarily concerning interface communication protocols. Consequently, synchronization in communication among semiconductor manufacturers is essential for the realization of silicon photonics technology.

Therefore, NTT aims to coordinate necessary technologies through collaboration with Intel and SK Hynix.

NTT holds a global leadership position in integrating optical and electronic technologies, having successfully pioneered the foundational technology of using light for transistor circuits. This achievement was published in the British scientific journal “Nature Photonics” in 2019, leading to the introduction of the IOWN (Innovative Optical and Wireless Network) fully optical network based on this technology.

(Photo credit: Intel)

With the highly anticipated opening of TSMC’s Kumamoto fab on February 24th, 2024, multiple Japanese or global semiconductor manufacturers are set to begin large-scale production in newly established plants in Japan.

According to sources cited by TechNews, this development will stimulate the growth and advancement of Japan’s domestic semiconductor supply chain, enhancing Japan’s semiconductor manufacturing capabilities, transitioning from Renesas Electronics’ 40-nanometer process to JASM’s 12-nanometer process.

TSMC Kumamoto Fab Set to Open on February 24

In Kikuyo Town, Kumamoto Prefecture, Japan Advanced Semiconductor Manufacturing (JASM) company, jointly invested by TSMC, SONY, and Japan’s DENSO, is currently constructing a 12-inch fab.

▲ TSMC’s Layout of Global Production Capacity Edited by TrendForce, January, 2024

The facility will employ 12/16-nanometer and 22/28-nanometer process, focusing on the production of chips for automotive electronic applications. The fab is scheduled to open on February 24, with mass production expected to commence in the fourth quarter of 2024.

This shift is regarded as the first step in Japan’s semiconductor revitalization policy. In support of this initiative, the Japanese government has provided a financial subsidy of JPY 476 billion (approximately USD 3.2 billion) to the JASM fab, covering nearly one-third of the total expenditure, which amounts to USD 8.6 billion.

Kioxia and Western Digital Jointly Constructing 12-Inch Plant

NAND Flash memory giants Kioxia and Western Digital are jointly investing in the construction of a 12-inch plant in Yokkaichi, Mie Prefecture. The facility is set to begin preparing for mass production of 3D NAND Flash memory products by March 2024.

Industry sources note that the plant’s construction will cost JPY 280 billion (approximately USD 1.8 billion ), with the Japanese government providing up to 92.9 billion yen (approximately USD 600 million) in subsidies.

Another Kioxia and Western Digital joint venture plant located in Kitakami, Iwate Prefecture, is slated to open in the second half of 2024. Originally scheduled for completion in 2023, the project faced delays due to unfavorable market conditions.

Renesas Electronics Expands Power Semiconductor Capacity

Renesas Electronics is set to launch a new power semiconductor production line in 2024. However, since the company’s Kofu factory in Yamanashi Prefecture closed in October 2014, Renesas is committing JPY 90 billion to install a 12-inch wafer production line at its existing facility to meet the growing demand for power semiconductors, especially in electric vehicles (EVs).

The new production line will enable Renesas Electronics to enhance its capacity for power semiconductors such as IGBT and MOSFET, with plans to achieve mass production by 2024. Renesas Electronics’ expansion plan is expected to receive subsidy support from the Japanese Ministry of Economy, Trade, and Industry.

Toshiba and ROHM Semiconductor Collaborate to Integrate Production Lines for Power Semiconductors

Toshiba and ROHM Semiconductor have reached an agreement to collaborate. Under the agreement, Toshiba’s power semiconductor factory will begin integrating production with ROHM’s newly developed Silicon Carbide (SiC) power semiconductor plant in Kunitomi City, Miyazaki Prefecture. This collaboration is expected to receive government subsidies equivalent to one-third of the investment in the project.

Japan’s New Fab Projects Beyond 2025

Beyond 2025, Japan is set to witness the emergence of several new plants, including Micron Technology’s new 1-gamma (1γ) DRAM production facility in Hiroshima Prefecture.

JSMC, a foundry subsidiary of Powerchip Semiconductor Manufacturing Corporation (PSMC), is collaborating with Japan’s financial group SBI to complete construction by 2027 and begin chip production thereafter.

Additionally, Japanese semiconductor startup Rapidus plans to commence production of 2-nanometer chips in Hokkaido by 2027.

Furthermore, TSMC is currently evaluating plans for its second plant in Japan, expected to be located in Kikuyo Town, Kumamoto Prefecture. Reports suggest that TSMC is set to officially announce the location of the second wafer plant on February 6th.

Earlier discussions by TSMC Chairman Mark Liu regarding the second plant in Japan indicated ongoing evaluations and discussions with the Japanese government. Once the decision to build the second plant is finalized, it is anticipated to manufacture products utilizing 7-nanometer to 16-nanometer process technologies.

Japan’s resurgence in the semiconductor arena is palpable, with the Ministry of Economy, Trade, and Industry fostering multi-faceted collaborations with the private sector. With a favorable exchange rate policy aiding factory construction and investments, the future looks bright for exports.

However, the looming shortage of semiconductor talent in Japan is a concern. In response, there are generous subsidy programs for talent development. Japan is strategically positioning itself to reclaim its former glory in the world of semiconductors.

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• [News] TSMC Reportedly Announcing Kumamoto Plant 2 in Japan, while U.S. Subsidies Expected by End of March
• [News] ROHM Eyes R&D Expansion in Power Semiconductor Production Venture with Toshiba

(Photo credit: TSMC)

While TSMC is pushing forward with its 2nm fab in Taiwan, there is also good news about its overseas expansion. According to the Japanese newspaper “Kumanichi,” TSMC is expected to announce the construction of its Kumamoto Fab 2 in Japan on February 6, with the possibility of incorporating the 7nm process. Additionally, the United States is also expected to provide several billion dollars in subsidies to TSMC’s new fab by the end of March.

▲ TSMC’s Layout of Global Production Capacity Edited by TrendForce, January, 2024

Per the report from the ” Kumanichi,” Japan’s Minister of Agriculture, Forestry, and Fisheries, Tetsushi Sakamoto, who hails from Kumamoto, stated during a local meeting on January 28th that TSMC is evaluating Kumamoto Prefecture’s Kikuyo Town as the location for its second fab. The announcement of the site for Fab 2 in Kumamoto is expected to be made as early as February 6th.

The report further indicates that Fab 2 is expected to be situated next to the first fab, which was completed at the end of last year. TSMC had previously mentioned that if a second fab were to be constructed, it would be located in the vicinity of the existing facility under construction.

Regarding the rumors, the spokesperson for TSMC stated that the expansion strategy of TSMC’s global manufacturing footprint is based on considerations of customer demand, business opportunities, operational efficiency, government support, and economic costs.

Through necessary investments, TSMC continues to support customer demands and respond to the structural growth of semiconductor technology in the long term. “We are currently focusing on evaluating the possibility of setting up a second fab in Japan, and there is no further information to share at the moment.”

During the recent earnings call, Mark Liu also mentioned that the plan for TSMC’s second fab in Japan is still under evaluation. However, he hinted at the possibility of adopting the 7-nanometer process.

TSMC’s Kumamoto plant is scheduled to hold its opening ceremony on February 24th. After retiring following the shareholders’ meeting in June this year, TSMC Chairman Mark Liu, along with the designated successor and current President C.C.Wei, will lead several top executives to Japan for the event. TSMC has also invited Japanese Prime Minister Fumio Kishida to attend.

The decision for TSMC to establish a plant in Kumamoto, Japan, was announced in October 2021, and construction began in 2022. In comparison to TSMC’s announcement of a plant in the United States in 2020, which faced delays and is set to commence production in 2025, the Japanese plant has advanced more swiftly.

This aligns with TSMC founder Morris Chang’s statement last year that Japan is considered an ideal location for establishing a semiconductor supply chain.

Analyst Joanne Chiao from TrendForce previously pointed out that Japan’s expertise in materials and machinery is one of the factors attracting TSMC’s expansion. Japan stands to benefit from TSMC’s establishment as the pace of creating a local semiconductor ecosystem by Japanese government surpasses that of the U.S. government.

On the other hand, despite TSMC delaying the production at its new US plant, according to Bloomberg, the United States plans to announce substantial chip subsidies by the end of March. The aim is to pave the way for chip manufacturers like TSMC and Intel by providing them with billions of dollars to accelerate the expansion of domestic chip production.

These subsidies are a core component of the US 2022 “CHIPS and Science Act,” which allocates a budget of USD 39 billion to directly subsidize and revitalize American manufacturing.

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• [News] Completion of TSMC’s Kumamoto Plant, Grand Opening on 2/24
• [News] Rumored to Build Third Plant in Kumamoto, TSMC: Currently Focusing on Assessing the Construction of a Second Plant

(Photo credit: TSMC)

TSMC’s foundry in Kumamoto, Japan, has been completed. Currently, the tool-in is underway, with a grand opening ceremony scheduled for February 24^th, 2024.

Following this, trial production will commence, with mass production expected by the year-end. The Taiwanese semiconductor supply chain is optimistic about TSMC’s continued investment in local facilities, with plans for establishing service points in Japan.

According to reports from Japanese news source Kyodo News, TSMC’s Kumamoto plant is operated by its Japanese subsidiary, Jasm. Construction commenced in April 2022, with a 24-hour rush to completion. The office building facilities were inaugurated in August 2023, and the four-story, two-basement fab was also completed by the end of last year. The cleanroom’s total area, where production takes place, is approximately 45,000 square meters.

After the grand opening ceremony of TSMC’s Kumamoto plant, trial production will begin, with mass production scheduled by the end of this year. The plant aims to produce 22/28nm and 12/16nm process chips, targeting a monthly capacity of 55,000 wafers. Joint venture partners at the facility include Sony’s subsidiary Sony Semiconductor Solutions and Denso.

According to Japanese media Nikkei Asia, TSMC is currently assessing the construction of a second plant in Kumamoto. The estimated total investment for this new facility is around JPY 2 trillion, and the Japanese Ministry of Economy, Trade, and Industry is considering a subsidy of approximately JPY 900 billion, surpassing the amount for the first plant. TSMC plans to utilize the Kumamoto Fab 2 for the production of 6nm chips. There is potential for further investment in a third plant in the future.

As per a report from Liberty Times Net, with optimism for TSMC’s opportunities in Japan, Taiwan’s semiconductor supply chain is establishing service points in the country.

Cleanroom and MEP (Mechanical, Electrical, Plumbing) integration engineering service provider, Marketech International Corp., has set up a subsidiary in Japan to cater to major clients. Topco Scientific Co. has established SHUNKAWA CO., LTD. in Japan and a branch in Kumamoto to offer specialized chemical warehouse services to major clients.

Analytical testing facility, MA-tek, established a lab in Nagoya over four years ago and expanded with a second lab in Kumamoto last September due to increased demand. Following suit, MSSCORPS Co. plans to establish a testing and analytical center in Tokyo, Japan.

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• [News] TSMC’s Kumamoto Plant Production Capacity Set for Significant Leap, Gradually Increasing to 55,000 Wafers per Month
• [News] Rumored to Build Third Plant in Kumamoto, TSMC: Currently Focusing on Assessing the Construction of a Second Plant

(Photo credit: TSMC)