Recently, Samsung Electro-Mechanics announced that by 2026, the sales share of its high-end Flip Chip Ball Grid Array (FCBGA) substrates for server and artificial intelligence will exceed 50%.

FCBGA is an integrated circuit (IC) packaging technology，which involves flipping the chip and connecting it to the packaging substrate, then using spherical solder bumps to attach the package to the substrate.

It is mainly used in the packaging of high-density, high-speed, multi-functional large-scale IC chips, offering advantages such as high integration, small size, high performance, and low power consumption.

After a prolonged period of inventory cutting, the balance between semiconductor supply and demand sides has improved, with market demand gradually recovering.

The strong demand in fields such as high-speed network, server, smart driving, and optical module has continuously energized the development of high-multilayer high-speed boards and advanced HDI boards, which in turn is gradually boosting the prosperity of the packaging substrate industry.

As one of the main packaging methods for core electronic components like PC central processing unit, memory, and graphics processor, FCBGA boasts significant market potential in the development of 5G communications, artificial intelligence, virtual reality, and other fields.

Globally, IDM companies such as Micron, Infineon, and NXP have conducted extensive research and development in the FCBGA packaging field, while specialized packaging and testing companies like ASE Group, JCET, and Amkor have also developed various FCBGA technologies.

It is reported that numerous major international semiconductor companies, including Intel, Qualcomm, NVIDIA, AMD, and Samsung, are utilizing FCBGA technology.

Intel is one of the pioneers of FCBGA technology, first applying it to processors in 1997, while Apple is a loyal adopter of FCBGA technology, having used it in its processors from an early stage.

Data indicates that the global FCBGA packaging technology market will continue to grow rapidly in the coming years, with the market size expected to exceed USD 20 billion by 2026.

In face of such a highly potential opportunities, an increasingly more companies are channeling more efforts in developing FCBGA packaging technology, continuously facilitating its innovation and upgrade, and Chinese companies are also a part of this competition.

Currently, main companies engaging in FCBGA packaging substrates business in China include Fastprint, SCC, and FHEC (Forehope-elec), etc, which have disclosed their current progresses referring to FCBGA research and development.

Besides, Strongteam, a real estate company attempting to enter the semiconductor field, has set its sight on the FCBGA sector.

Fastprint disclosed that its low-layer FCBGA packaging substrates are currently in the small-batch delivery stage, with primary applications in the automotive and AI sectors.

SCC stated that it already has the capability of mass producing FCBGA packaging substrates with 16 layers and less, and the capability of sample manufacturing products with more than 16 layers.

The production line validation, sample delivery, and certification processes for various product levels have proceeded smoothly on track. Strongteam is actively transitioning into the semiconductor field and plans to invest in high-end FCBGA IC substrate enterprises.

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(Photo credit: Samsung)

Recently, two industrial moves took place in Shanghai’s integrated circuit (IC) sector.

First, the Shanghai Integrated Circuit Industry Investment Fund (Phase II) Co., Ltd. (hereinafter referred to as “Shanghai IC Industry Fund Phase II”) received a substantial capital increase.

Second, 14 key IC-related projects were signed and officially launched in Shanghai’s Lingang area on August 19, involving companies such as SICC, JHETECH, SIMIC, and Shanghai Institute of IC Materials (SICM) with a total investment of CNY 28.8 billion.

• The Capital of Shanghai IC Industry Fund Phase II Increased to CNY 14.5 Billion

Recently, the business registration information of Shanghai IC Industry Fund Phase II was updated, showing a significant increase in registered capital from CNY 7.6 billion to CNY 14.53 billion. Moreover, Shanghai Pudong Innovation Investment Development (Group) Co., Ltd. was added as a new shareholder, and some key personnel changes were made.

The Shanghai IC Industry Fund was founded in 2020. In June 2024, Shanghai AST announced the successful completion of its Series C financing round, with Shanghai IC Industry Fund Phase II among the investors, which has also invested in companies such as Hailin Microelectronics, SMIC, JCET, and GTX.

It is worth noting that this is the second capital increase for Shanghai IC Industry Fund Phase II. It’s learned that the fund’s initial registered capital was CNY 5.4 billion, which increased to CNY 7.6 billion in January 2022.

• Several IC Industry Funds Established

In 2016, Shanghai Integrated Circuit Industry Investment Fund Co., Ltd. (hereinafter referred to as “Shanghai IC Industry Fund Phase I”) was established with an initial fundraising scale of CNY 28.5 billion, making it the largest local IC industry fund in China at that time, with a focus on investing in IC manufacturing sector.

The National Integrated Circuit Industry Investment Fund ( “Big Fund”) was among the investors, currently holding a subscribed capital of CNY 3 billion and a 17.01% stake.

Up till now, Shanghai IC Industry Fund Phase I has invested in 14 companies, including HLMC Microelectronic, Hailin Microelectronics, Everdisplay, SMIC, GTA, HLMC IC, SouthChip, Zhaoxin, Unisoc, InnoGrit, and ACM, covering areas such as design, manufacturing, and equipment.

In July 2024, following the establishment of Shanghai IC Industry Fund Phase I and Phase II, Shanghai took further action by setting three new leading industry mother funds. It is reported that the funds invested a total of CNY 89.003 billion, respectively targeting three major industries: IC, biomedicine, and AI.

Among these, the IC mother fund has a capital of CNY 45.001 billion, focusing on areas including but not limited to IC design, manufacturing, packaging and testing, equipment materials, and components.

The AI mother fund, with a scale of CNY 22.501 billion, eyes fields such as intelligent chips, intelligent software, autonomous driving, and intelligent robots.

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(Photo credit: JCET)

According to a report from UDN, China’s largest semiconductor packaging and testing company, JCET, has completed the planning and verification work for the first phase of the “JCET Microelectronics Wafer-level Microsystems Integration High-end Manufacturing Project.”

The project will soon be completed and put into production. Once operational, it will have an annual production capacity of 6 billion high-end advanced packaging chips, providing one-stop services from collaborative packaging design to chip production for 5G, artificial intelligence, and other applications.

As per WeChat account DRAMeXchange citing sources, the project is a major industrial initiative in Jiangsu Province, China, with a total investment of CNY 10 billion. Upon completion of the first phase, the project will have an annual production capacity of 6 billion high-end advanced packaging chips.

The project will focus on leading-edge high-performance packaging technologies, such as 2.5D/3D high-density wafer-level packaging. JCET Microelectronics commenced construction of its new plant in the eastern part of Jiangyin City on July 29, 2022, with the project expected to be completed and put into production between June and July 2024.

At the groundbreaking ceremony in 2022, JCET CEO Zheng Li stated that this project will represent the highest production technology level and largest single-investment smart manufacturing project in China’s integrated circuit packaging and testing and chip manufacturing industry. Thus, it will support end applications such as 5G, artificial intelligence, the Internet of Things, and automotive electronics, covering key strategic customers worldwide.

This project, per Li, will further enhance JCET’s global market competitiveness in the chip manufacturing sector, aiming to achieve a higher industrial position in the global integrated circuit industry.

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(Photo credit: JCET Group)

On March 4th, Chinese assembly and testing company, JCET Group (JCET), announced its intention to acquire 80% equity of SanDisk Semiconductor Shanghai Co., Ltd. (SDSS), a subsidiary of Western Digital Corporation (WDC), for USD 624 million in cash. This strategic move aims to expand JCET’s market share in the storage.

The assembly and testing market competition is intensifying, especially with Moore’s Law slowing down in recent years. While advanced process technology still requires time, the demand for computing is skyrocketing.

As a result, advanced packaging is highly anticipated. Over the past two years, several testing and packaging giants have continuously enhanced their market competitiveness through mergers, expansion, and innovative technologies.

JCET Ventures into Storage with CNY 4.5 Billion Investment

According to the announcement, JCET has signed a “Equity Acquisition Agreement” with SANDISK CHINA LIMITED, the parent company of SANDISK CHINA LIMITED – SSDS.

Per the agreement, JCET Group intends to acquire 80% of the equity of SSDS held by the seller in cash. The transaction price, after full communication and negotiation between the parties, is approximately USD 624 million. After the completion of this transaction, JCET Group will hold 80% of the equity of SSDS, while SANDISK CHINA LIMITED will retain 20% ownership in SSDS.

According to the information available, SSDS was established in August 2006 and primarily engages in the research and development, packaging, and testing of advanced NAND Flash memory. Its product range includes iNAND flash modules, SD cards, MicroSD memory cards, etc., widely used in mobile communications, industrial IoT, automotive, smart home, consumer electronics, and other fields.

The selling party’s parent company, WDC, is a global leader in storage solutions. According to TrendForce’s data, in the third quarter of 2023, Western Digital held a market share of 16.9% in global NAND Flash revenue rankings, securing the third position worldwide.

Per the announcement, WDC has had a long-standing partnership with JCET since 2003, making it one of JCET’s key clients. JCET stated that following the completion of this transaction, the selling party (SANDISK CHINA LIMITED) and its parent company (Western Digital) will continue to be the primary or sole customers of SSDS for a certain period, ensuring a level of stability in its operational performance.

In its announcement of the acquisition of SSDS, JCET explicitly states that this decision stems from an in-depth analysis and forward-looking assessment of the global storage market.

As per the World Semiconductor Trade Statistics (WSTS), storage chips have emerged as the second-largest semiconductor sub-market, capturing approximately 28% of market share, trailing only behind logic chips. Looking ahead, it is projected that by 2024, the storage chip market will reach a staggering USD 130 billion in size.

Within this expansive market, NAND flash chips stand out, constituting approximately 40% of the global storage market. Moreover, it is projected to maintain a compound annual growth rate (CAGR) of 8% from 2021 to 2027. This indicates that the NAND flash chip market is not only vast but also possesses stable growth potential.

Intense Competition in the Semiconductor Packaging Market: Focus on Advanced Packaging

Major semiconductor packaging companies like ASE, Amkor Technology, Powertech, and Huatian Technology are continuously enhancing their competitive edge through expansions and acquisitions, driving rapid growth in the semiconductor packaging industry.

• ASE

Regarding ASE, it recently announced that its capital expenditure for this year is expected to increase by 40% to 50% compared to last year, with 65% allocated to packaging, especially for advanced packaging projects.

On February 22nd, ASE Group and semiconductor giant Infineon Technologies jointly announced the finalization of an agreement. ASE Group will invest EUR 62.589 million to acquire Infineon’s backend packaging facilities located in Cavite, Philippines, and Cheonan, South Korea.

In November 2022, ASE initiated construction on its fourth and fifth plants in Penang, Malaysia, with completion slated for 2025. Besides Malaysia, ASE continues its expansion efforts in Taiwan, including Kaohsiung, Zhongli, and Tanzi.

• Amkor

On January 16th, Amkor and semiconductor foundry Globalfoundries held a ribbon-cutting ceremony for the joint construction of the Amkor Porto plant in Portugal. Since February 2023, Globalfoundries has relocated 50 devices from its Dresden facility to Amkor’s new Porto plant.

The initial batch of client products has been certified using Globalfoundries’ equipment. Globalfoundries is transferring some of its 300mm production lines from Dresden to Amkor’s Porto facility, which is IATF16949 certified, to establish Europe’s first large-scale test and packaging plant.

• Powertech

In 2023, the packaging and testing firm, Powertech, expressed optimism about the future development of advanced packaging technologies. Powertech has outlined plans to resume significant capital expenditures in the latter half of 2024, ensuring sustained investments to maintain a competitive edge and prepare for long-term growth.

• Huatian Technology

In March 2023, Huatian Technology made significant strides by investing 2.858 billion yuan in its wholly-owned subsidiary, Huatian Technology (Jiangsu) Co., Ltd., for the construction of the “High-Density, High-Reliability Advanced Packaging Research and Industrialization” project.

Once completed, the project will enable an annual wafer-level integrated circuit packaging capacity of 840,000 pieces for Bumping, 480,000 pieces for WLCSP, and 26,000 pieces for ultra-high-density fan-out UHDFO. The construction period spans 5 years, from June 2023 to June 2028.

Currently, the packaging market’s competitive landscape extends beyond traditional OSATs, with major foundries and storage giants actively joining the fray. Technologies like TSMC’s SoIC, CoWoS, and InFO, Intel’s EMIB, Foveros, and Co-EMIB, as well as Samsung’s I-Cube (2.5D) and X-Cube (3D), are emerging and maturing.

The proliferation of various 2.5D and 3D packaging solutions indicates that competition in advanced packaging will only intensify, promising an exciting future ahead.

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(Photo credit: JCET Group)

Since October, China’s National Integrated Circuit Industry Investment Fund Phase II (hereafter referred to as “Big Fund Phase II”) has made two significant investments.

First, it invested in JCET Group’s subsidiary, JCET Group Automotive Electronics (Shanghai) Co., Ltd. (hereafter referred to as “JCET Automotive Electronics”). Later, it invested in ChangXin Xinqiao Storage Technology Co., Ltd. (hereafter referred to as “ChangXin Xinqiao”).

Data reveals that since its establishment, Big Fund II has invested in nearly 40 companies, with a total investment exceeding ¥55 billion. Despite the semiconductor industry’s low point this year, Big Fund Phase II has remained active, particularly emphasizing “strengthening the supply chain.” This includes increasing investments in critical areas like semiconductor equipment and materials.

1. Investing in ChangXin Xinqiao, Enhancing Storage Manufacturing

On October 26th, Big Fund II invested ¥14.5 billion to acquire a 33.14% stake in ChangXin Xinqiao.

According to industry sources, Changxin Xinqiao is one of the projects developed as part of the ChangXin Memory Technologies (CXMT), a collaboration between Hefei Municipal Government, CXMT, Overseas Chinese Town Holdings Company, and NAURA Technology Group Co. in 2019.

As per previous public announcements, the total investment in the CXMT Semiconductor Manufacturing Base exceeds 220 billion yuan. The project is situated in the Hefei Airport Economic Demonstration Zone and primarily focuses on the Changxin Memory project, involving the development of the entire upstream and downstream industrial chain.

Among these initiatives, the Changxin 12-inch storage memory wafer manufacturing base stands out with a total investment of 150 billion yuan, making it the largest single industrial project investment in Anhui Province.

Additionally, according to information on Changxin Memory’s official website, their core product is DDR4 memory chips, which belong to the fourth generation of double data rate synchronous dynamic random-access memory (SDRAM).

2. Increasing Investment in JCET Group’s Subsidiary: Automotive Electronics Focus

On October 27th, JCET Group’s subsidiary, JCET Group Automotive Electronics, received a total capital injection of 4.4 billion yuan from a combination of new and existing shareholders, further emphasizing its commitment to the development of in-vehicle technology. This infusion of capital will accelerate the construction of its first-phase project for manufacturing and testing automotive chips.

After this capital injection, the subsidiary’s registered capital increased from ¥400 million to ¥4.8 billion, remaining a subsidiary of JCET Group. JCET Group Management’s ownership will be diluted to 55%, while Big Fund Phase II will hold an 18% stake.

JCET Group stated that this capital injection is primarily intended for the construction and operation of the target company, aligning with the company’s strategic plans and business development requirements.It aims to better serve the continuously growing market and customer demands, especially in strengthening the company’s automotive electronics business.

Currently, the company’s financial health is robust, and it believes that this capital infusion will not significantly impact its liquidity.

3. Big Fund Phase II Focuses on “Strengthening and Supplementing the Supply Chain” and Plays a Significant Role in the Down Cycle

The semiconductor industry has experienced significant performance fluctuations due to the ongoing semiconductor down cycle. In response to these challenges, Big Fund Phase II has become more active.

The fund has appeared on the shareholder lists of multiple semiconductor companies striving for initial public offerings (IPOs), including Hua Hong Semiconductor Limited, RYCHIP Semiconductor Inc., Guanggang Gases & Energy Company Limited, and Sinophorus Electronic Materials Co..

Notably, Big Fund Phase II has shown continued interest in Hua Hong Semiconductor Limited.

Hua Hong Semiconductor 

Silan Microelectronics Co.

Silan Microelectronics Co. has also attracted significant attention from Big Fund Phase II. On August 28th, Silan Microelectronics announced its intention to jointly invest 1.2 billion RMB with affiliated company Big Fund Phase II and non-affiliated entity HaiChuang Development Fund to subscribe for newly increased registered capital of 1.19 billion RMB in the affiliated joint-stock company, Xiamen Silan Advanced Compound Semiconductor Co., Ltd.. Silan Microelectronics is set to acquire controlling interest in Xiamen Silan Advanced Compound Semiconductor, while Big Fund Phase II will hold a 14.11% stake.

Publicly available information indicates that Xiamen Silan Advanced Compound Semiconductor revolves around the manufacture of compound semiconductor chips. In July of the previous year, the company initiated the “SiC Power Device Production Line Construction Project.”

This project entails an investment plan of 1.5 billion RMB to construct a 6-inch SiC power device chip production line. Ultimately, it aims to achieve an annual production capacity of 144,000 pieces of 6-inch SiC power device chips, comprising 120,000 pieces/year of SiC-MOSFET chips and 24,000 pieces/year of SiC-SBD chips.

China Resources Microelectronics Limited

On August 15, it was announced that the company’s subsidiary, Runpeng Semiconductor, plans to increase capital and introduce external investors, including Big Fund Phase II. Following the completion of this transaction, Runpeng Semiconductor’s registered capital will increase from 2.4 billion RMB to 15 billion RMB.

The announcement indicates that the external investors that Runpeng Semiconductor intends to introduce include 12 institutions, including Big Fund Phase II. Big Fund Phase II is committed to subscribing to a registered capital of 3.75 billion RMB.

In addition, the upstream semiconductor materials sector has also attracted the attention of Big Fund Phase II. In late March of this year, Jingrui announced that its subsidiary, Hubei Jingrui, plans to introduce strategic investors through capital expansion. Big Fund Phase II, among others, is set to inject 160 million yuan in cash into Hubei Jingrui.

Summary

Overall, Big Fund Phase II’s investments span the entire integrated circuit industry chain. However, it’s worth noting that compared to Big Fund Phase I, Big Fund Phase II places more emphasis on strengthening and supplementing the supply chain.

It has increased investments in critical areas such as upstream semiconductor equipment, materials, and shows optimism towards emerging hot sectors like AI and automotive electronics.

(Photo credit: Pixabay)