On January 16, Siliconware Precision Industries (SPIL), a subsidiary of ASE Technology Holding, officially inaugurated its new advanced packaging facility at the Tanzi Science Park. SPIL also announced that three additional advanced packaging facilities are set to expand production capacity by 2025....

Amid the AI boom, global semiconductor giants such as TSMC have been making strides in CoWoS capacity expansion. However, market demand for materials related to advanced packaging has also been brewing, as China is seeing a surge in mergers and acquisitions in the sector recently, according to Chine...

According to a report in South China Morning Post, China's leading chip-packaging company, Changjiang Electronics Technology Co. (JCET), recently announced a significant restructuring of its board of directors following the acquisition of a 22.5% stake by the state-owned China Resources Group, as t...

Recently, Samsung Electro-Mechanics announced that by 2026, the sales share of its high-end Flip Chip Ball Grid Array (FCBGA) substrates for server and artificial intelligence will exceed 50%. FCBGA is an integrated circuit (IC) packaging technology，which involves flipping the chip and connecti...

Recently, two industrial moves took place in Shanghai's integrated circuit (IC) sector. First, the Shanghai Integrated Circuit Industry Investment Fund (Phase II) Co., Ltd. (hereinafter referred to as "Shanghai IC Industry Fund Phase II") received a substantial capital increase. Second, 14 key...