Intel has outsourced the production of its Lunar Lake processors to TSMC. According to a report from Commercial Times, due to recent setbacks in Intel’s wafer foundry business, the company has decided to outsource all sub-3nm process manufacturing to TSMC.

The company is also said to be implementing a global 15% workforce reduction plan in an effort to reverse its decline. However, industry sources also reveal that the layoffs are primarily targeting the foundry business, while Intel’s Taiwan branch remains unaffected to maintain production partnerships with local chip manufacturers.

Intel remains committed to its wafer foundry business, as it reportedly released the 18A process design kit (PDK) to IC manufacturers in July.

However, recent reports indicate that Broadcom has expressed concerns about the feasibility of Intel’s 18A process, concluding that it is not suitable for mass production. A Broadcom spokesperson cited by the report has indicated that it is currently evaluating Intel Foundry Services’ products and services, though no final assessment has been reached yet.

Industry sources cited by Commercial Times further note that Broadcom has been collaborating with TSMC for many years, particularly in advanced processes below 7nm, positioning itself as a key player and securing a spot among TSMC’s top ten customers.

Looking at Intel’s latest quarterly report, its foundry business posted a loss of USD 2.8 billion, with an operating profit margin of -65.5%. The company acknowledged that the ongoing expansion of its Intel 4 and Intel 3 facilities in Ireland, along with increased R&D and startup costs for advancing its technology development, will impact profitability.

This has thus underscored the significant challenges Intel faced in achieving both technological breakthroughs and mass production in the semiconductor industry.

Intel is cutting costs and driving efficiency while actively pursuing transformation. The company aims to save USD 10 billion by 2025, even halted dividend payments—a move not seen in 30 years.

Additionally, its global expansion efforts have slowed. As per a recent report from Malaysian media outlet The Star, citing informed sources, it’s reported that Intel will temporarily halt its new chip packaging and testing project in Penang as part of cost-cutting efforts.

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(Photo credit: Intel)

In a report by Bloomberg on August 29 citing sources, it’s rumored that Intel Corp. is working with investment bankers to navigate what is described as the most challenging period in its 56-year history.

Reportedly, Intel is said to be exploring various options, including spinning off its product design and foundry businesses, and canceling certain construction plans. Notably, Morgan Stanley and Goldman Sachs have been advising Intel, with merger being one of the options on the table.

Multiple options are expected to be presented at the board meeting in September. According to sources cited by Bloomberg, Intel is unlikely to spin off its foundry business unless absolutely necessary. The company is rumored to favor more moderate approaches, such as delaying certain expansion plans.

Per another report from CNBC, during the Deutsche Bank’s Technology Conference on August 29, Intel CEO Pat Gelsinger acknowledged that the past few weeks have been challenging. He then emphasized that the company is prepared to face the market’s criticism and tackle the challenges ahead.

Gelsinger further mentioned that the surge in AI has led to weaker performance in Intel’s server business, a challenge the company is still working to address. However, he remains optimistic about the future, noting that the finish line is already in sight.

He also mentioned that Intel will soon launch “Lunar Lake,” which he described as the most compelling PC product the company has ever developed.

Intel is currently facing significant challenges. On August 1, the company announced financial results that fell short of Wall Street expectations and revealed plans to cut over 15% of its workforce.

Gelsinger noted that the layoffs would impact approximately 15,000 employees. He acknowledged that Intel’s revenue growth has been below expectations and that the company has not yet benefited from trends like AI. Gelsinger highlighted issues with high costs and low profit margins as well, stating that he never anticipated an easy path ahead.

A report from Reuters also revealed that former Intel board member Lip-Bu Tan has stepped down after just two years. Tan, who was previously the CEO and executive chairman of electronic design automation (EDA) software company Cadence Design Systems Inc..

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(Photo credit: Intel)

Intel CEO Pat Gelsinger delivered a keynote speech at COMPUTEX Taipei earlier today, unveiling the next-generation client architecture set to launch this year. According to a report from CNA, He expressed gratitude to TSMC for collaborating on the development of the Lunar Lake processors, intended for the next generation of AI PCs. Currently, there are over 80 designs from 20 manufacturers.

Previously on the IFS Direct Connect event in San Jose, USA, Gelsinger pointed out in an interview that two generations of CPU Tiles would be manufactured using TSMC’s N3B process,  marking the official arrival of Intel CPU orders for laptop platforms.

Gelsinger’s interview confirms that Intel has indeed expanded its outsourcing orders to TSMC. Currently, TSMC is responsible for producing Intel CPUs, GPUs, and NPUs tiles for the Arrow and Lunar Lake platforms.

As per CNA’s report, Gelsinger announced the launch of the Xeon 6 platform and processor family designed to meet the demands of data centers, as well as the Gaudi AI accelerator. He also unveiled details of the Lunar Lake processor architecture.

As the flagship processor for the next generation of AI PCs, Lunar Lake significantly enhances graphics and AI processing, reducing system-on-chip power consumption by 40% and providing over three times the AI computing capability. Lunar Lake processors are expected to start shipping in the third quarter of this year.

Additionally, Intel plans to ship over 40 million Core Ultra processors this year, further solidifying its position in the AI PC field.

Gelsinger remarked that having 100,000 transistors on a chip would be remarkable in the early days, but now there are already 1 billion transistors on a chip, with the potential to reach even 1 trillion in the future.

Contrary to what NVIDIA CEO Jensen Huang recently described in his speech, Gelsinger indicated further that Moore’s Law is alive and well, and Taiwan continues to play a core role.

According to Gelsinger, Intel has been operating in Taiwan since 1985 and will enter its 40th year of operation next year. The partnership between Intel and Taiwan spans 39 years, and the combined initials of Intel (I) and Taiwan (T) stand for information technology (IT). Together, Intel and its Taiwanese partners can change the world once again.

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(Photo credit: Intel)

Intel’s upcoming Lunar Lake platform has entrusted TSMC with the 3nm process of its CPU. This marks TSMC’s debut as the exclusive producer for Intel’s mainstream laptop CPU, including the previously negotiated Lunar Lake GPU and high-speed I/O (PCH) chip collaborations. This move positions TSMC to handle all major chip orders for Intel’s crucial platform next year, reported by UDN News.

Regarding this news, TSMC refrained from commenting on single customer business or market speculations on November 21st. Intel has not issued any statements either.

Recent leaks of Lunar Lake platform internal design details from Intel have generated discussions on various foreign tech websites and among tech experts on X (formerly known as Twitter). According to the leaked information, TSMC will be responsible for producing three key chips for Intel’s Lunar Lake—CPU, GPU, and NPU—all manufactured using the 3nm process. Orders for high-speed I/O chips are expected to leverage TSMC’s 5nm production, with mass production set to kick off in the first half of next year, aligning with the anticipated resurgence of the PC market in the latter half of the year.

While TSMC previously manufactured CPUs for Intel’s Atom platform over a decade ago, it’s crucial to note that the Atom platform was categorized as a series of ultra-low-voltage processors, not Intel’s mainstream laptop platform. In recent years, Intel has gradually outsourced internal chips, beyond CPUs, for mainstream platforms to TSMC, including the GPU and high-speed I/O chips in the earlier Meteor Lake platform—all manufactured using TSMC’s 5nm node.

Breaking from its tradition of in-house production of mainstream platform CPUs, Intel’s decision to outsource to TSMC hints at potential future collaborations. This move opens doors to new opportunities for TSMC to handle the production of Intel’s mainstream laptop platforms.

It’s worth noting that the Intel Lunar Lake platform is scheduled for mass production at TSMC in the first half of next year, with a launch planned for the latter half of the year, targeting mainstream laptop platforms. Unlike the previous two generations of Intel laptop platforms, Lunar Lake integrates CPU, GPU, and NPU into a system-on-chip (SoC). This SoC is then combined with a high-speed I/O chip, utilizing Intel’s Foveros advanced packaging. Finally, the DRAM LPDDR5x is integrated with the two advanced packaged chips on the same IC substrate.

(Image: TSMC)