According to a report from Korean media The Korea Economic Daily, Samsung Electronics Co. is planning to apply its 3nm process chips to its Galaxy series smartphones and smartwatches, posing a challenge to rivals Apple and TSMC. The report cited industry sources on May 13th, stating that Samsung'...

Looking at next-generation networks, a range of emerging technologies are playing pivotal roles. From ground-based B5G (Beyond 5G)/6G, Wi-Fi 7, and fixed wireless access (FWA), to non-terrestrial networks (NTNs) like low-orbit satellites, Taiwan-based companies are actively involved in shaping these...

As generative AI applications fuel the era of high computing power, Foxconn's connector subsidiary FIT announced on March 25th a cross-industry collaboration with MediaTek. Together, they will develop next-generation high-speed connectivity solutions, specifically Co-Packaged Optics (CPO), aiming to...

MediaTek has reportedly made its foray into the booming field of Heterogeneous Integration Co-Packaged Optics (CPO), announcing on March 20th a partnership with optical communications firm Ranovus to launch a customized Application-Specific Integrated Circuit (ASIC) design platform for CPO. This pla...

According to TechNews' report, Apple, NVIDIA, AMD, Qualcomm, and MediaTek all utilize TSMC's semiconductor processes for manufacturing their latest chips, with some potentially employing Samsung's foundry, though typically not for flagship products. With Samsung's improved yield rates in recent m...