According to Taiwan's Economic Daily News, UMC has recently engaged in discussions with global giants such as Texas Instruments and Infineon about long-term cooperation plans. Additionally, Taiwan’s two leading IC design companies, MediaTek and Realtek, have seen their inventories of WiFi 6/6E chi...

According to a report from Korean media The Korea Economic Daily, Samsung Electronics Co. is planning to apply its 3nm process chips to its Galaxy series smartphones and smartwatches, posing a challenge to rivals Apple and TSMC. The report cited industry sources on May 13th, stating that Samsung'...

Looking at next-generation networks, a range of emerging technologies are playing pivotal roles. From ground-based B5G (Beyond 5G)/6G, Wi-Fi 7, and fixed wireless access (FWA), to non-terrestrial networks (NTNs) like low-orbit satellites, Taiwan-based companies are actively involved in shaping these...

As generative AI applications fuel the era of high computing power, Foxconn's connector subsidiary FIT announced on March 25th a cross-industry collaboration with MediaTek. Together, they will develop next-generation high-speed connectivity solutions, specifically Co-Packaged Optics (CPO), aiming to...

MediaTek has reportedly made its foray into the booming field of Heterogeneous Integration Co-Packaged Optics (CPO), announcing on March 20th a partnership with optical communications firm Ranovus to launch a customized Application-Specific Integrated Circuit (ASIC) design platform for CPO. This pla...