On August 29, 2023, Huawei quietly launched its new smartphone, the Huawei Mate 60 Pro, on its official website without the usual fanfare associated with new product releases. Unlike previous events or those held by other brands, Huawei chose to communicate with consumers solely through a letter. What intrigued the market most was the specification of the new device’s System-on-Chip (SoC). Initially, Huawei did not provide any official information about it. However, the release of this new smartphone demonstrates China’s determination to achieve semiconductor self-sufficiency.

Key Insights from TrendForce:

• Overcoming U.S. Sanctions, Huawei Makes a Comeback

In the past, Huawei secured its position as the second-largest player in the global smartphone market by leveraging the differentiating advantage of its in-house developed Kirin SoC chips. However, since May 2019, Huawei has been affected by U.S. sanctions. In September 2020, TSMC, which previously manufactured chips for Huawei, announced the cessation of production. With no supply from TSMC, Huawei’s inventory of 5G chips was depleted by the third quarter of 2022.

Unable to acquire high-end chips, Huawei’s market share in the smartphone industry saw a significant decline. The company could only source 4G chips not subject to U.S. sanctions from Qualcomm or UNISOC. It was believed that U.S. sanctions would severely impact Huawei’s smartphone supply chain and push the company into a dire situation. However, upon analyzing Huawei’s latest release, it is evident that the new smartphone not only features an in-house developed SoC chip by Huawei’s semiconductor subsidiary HiSilicon but also incorporates components and designs from various Chinese manufacturers.

• China’s Semiconductor Self-Sufficiency Continues to Strengthen, Minimal Impact on Taiwanese Supply Chain Expected

China’s pursuit of semiconductor self-sufficiency has become an inevitable outcome of industry development. Although Huawei has not provided detailed specifications for the SoC chip in the Mate 60 Pro, it is speculated that this chip likely uses SMIC’s N+2 process. Due to sanctions, SMIC has been unable to obtain essential EUV equipment. Furthermore, based on the chip’s performance benchmarking, it is comparable to Qualcomm’s flagship Snapdragon 888 chip released in 2021. This suggests that the SoC’s process technology likely falls in the range of 7-14nm, which still lags behind current advanced processes. Nevertheless, this achievement underscores China’s commitment to semiconductor self-sufficiency.

As China gains the ability to independently develop and produce chips, the question arises of whether other Chinese smartphone brands, apart from Huawei, will begin their own chip development efforts. Will this development impact Taiwanese IC design house and foundries that previously held related orders? MediaTek, for instance, primarily supplies chips to brands such as OPPO and vivo. Given that Huawei competes strongly with OPPO and vivo in the smartphone market, it is unlikely that these two brands will entrust their smartphone core SoCs to Huawei’s HiSilicon. Additionally, developing proprietary chips comes with significant costs. Therefore, under these circumstances, it is expected that OPPO and vivo will maintain their partnerships with MediaTek. MediaTek’s chip designs can also utilize TSMC’s advanced processes, giving OPPO and vivo a key competitive advantage against Huawei. Consequently, it is inferred that as long as there is a significant gap between the processes and yields of SMIC and TSMC, Taiwanese foundries will not be significantly affected.

(Photo credit: Huawei)

According to Taiwan’s Economic Daily, the consumer market is experiencing starkly low demand, causing IC design firms primarily relying on mature processes, such as those in driver ICs, power management ICs, CMOS image sensors (CIS), and microcontrollers (MCUs), to adopt a notably cautious approach in placing orders. Some manufacturers are hesitating to place orders due to persistently high inventory levels.

The industry consensus is that IC design companies are expected to increase their orders in mature processes, with the earliest effects possibly emerging by 2024, implying that the mature process market conditions might not improve significantly until the end of this year.

The consumer market entered a period of economic downturn in the latter half of last year, which in turn affected industries such as PCs, smartphones, and networking. This not only led to a surge in inventory levels for IC design firms but also significantly curtailed the momentum for chip tape-out. Looking ahead to the second half of this year, while inventory levels across various sectors have largely returned to normal, chip tape-out for Q3 have notably declined compared to Q2.

In particular, demand for high-speed I/O in the PC sector and Board Management Controller for data centers remains notably weak. The supply chain indicates that PC demand for the second quarter, driven by advanced stocking, has dampened the typical peak season effect for the latter half of the year. This trend is evident across desktop PCs, laptops, and Chromebooks.”

As for the smartphone sector, after various research institutions revised down this year’s smartphone market size, the supply chain’s chip tape-out momentum has cooled down significantly. Only Qualcomm has increased its tape-out momentum to semiconductor foundries in the first half of the year, while MediaTek continues to adhere to a conservative strategy as of now.

(Photo credit: SMIC)

According to a report by Taiwan’s Commercial Times, global smartphone brands are set to introduce a series of flagship-level new products. Following the introduction of Apple’s A17 chip using TSMC’s 3-nanometer process, Qualcomm’s next-generation processor Snapdragon 8 Gen 3 and MediaTek’s Dimensity 9300 are expected to be unveiled in October. These chips will be manufactured using TSMC’s N4P process, with plans to further transition to the N3E process next year.

Industry source have indicated that TSMC’s 3-nanometer yield is gradually improving, coupled with the return of N4P orders, providing a counterbalance against the impact of sluggish end market demand.

Commercial Times’ report highlights that TSMC previously expressed strong demand for its N3 process, projecting substantial growth in the second half of the year. The N3 process will support high-performance computing (HPC) and smartphone platforms, with an anticipated contribution of 4-6% to the company’s revenue in 2023. Additionally, N3E has already been verified and received its first batch of customer product design approvals, with mass production expected to commence in the fourth quarter. TSMC aims to achieve a monthly production capacity of 100,000 wafers in its 3-nanometer process by the end of the year to cater to Apple’s demands.

According to Bloomberg’s recent exposure of Apple’s projected M3 processor product roadmap set for release this fall, the basic M3 processor consists of 4 high-performance and 4 energy-efficient cores, paired with 10 GPU cores. M3 Pro comes in two versions: a basic version equipped with 12 cores (6 high-performance and 6 energy-efficient) and 18 GPU cores, and a higher-tier version with 14 CPU cores and 20 GPU cores.

M3 Max also offers two versions, featuring a fully-equipped 16-core CPU. The main difference between the basic and higher-tier versions lies in the GPU cores—32 for the former and a whopping 40 for the latter. The most powerful variant, M3 Ultra, essentially doubles the configuration of M3 Max, boasting 32 CPU cores paired with either 64 or 80 GPU cores. Industry experts widely regard TSMC as the primary beneficiary of these developments.

(Photo credit: TSMC)

Recently, there has been news of collaboration between NVIDIA and MediaTek. Speculation suggests that the future collaboration may extend to smartphone SoCs, allowing MediaTek to enhance the graphical computing and AI performance of Dimensity smartphone SoCs through NVIDIA’s GPU technology licensing.

Currently, the focus of this collaboration is primarily on NB SoC development, with some progress in the automotive-related chip sector. As for the scope of smartphone SoC collaboration, it is still under discussion, but the potential for related partnerships is worth noting.

In the announced collaboration between NVIDIA and MediaTek for the NB SoC products, MediaTek is mainly responsible for CPU, while other part such as GPU, DSP, ISP, and interface IP are provided by NVIDIA or external partners. NVIDIA holds the leadership position, while MediaTek plays a supporting role in this collaboration.

Regarding the industry’s speculation about possible collaboration in smartphone SoC development, it is estimated that MediaTek will take the lead in the design. Therefore, it is necessary to explore the motivations behind MediaTek’s adoption of related technologies.

Firstly, since the era of the Arm V9 instruction set, Arm’s reference GPU, Immortalis, has incorporated ray tracing functionality, assisting MediaTek’s flagship SoCs in improving gaming performance. This indicates that optimizing gaming scenarios is a key development focus for SoC manufacturers.

However, for high-end gaming applications, the current GPU performance of smartphone SoCs still cannot maintain high frame rates and native resolutions during gameplay. While selecting a pure core stacking approach to improve computational power is effective, it puts pressure on device power consumption. In light of this, Qualcomm introduced Snapdragon Game Super Resolution (GSR) technology this year, which simultaneously reduces power consumption and enhances game graphics quality. MediaTek has not yet explored this technology, and Arm Immortalis has not been released. Therefore, when it comes to GPU performance computing, MediaTek has incentives to seek external collaborations.

Furthermore, with the rapid upgrading of GPUs on smartphone SoCs, PC-level games are now being introduced to smartphones, and industry players are promoting compatibility with graphics APIs, opening doors for NVIDIA, AMD, and even Intel to enter the mobile gaming market. Samsung has partnered with AMD for its Exynos SoC GPU, while NVIDIA, with similar technology to Qualcomm Snapdragon GSR, becomes a logical choice as a cooperation partner for MediaTek.

TrendForce believes that if MediaTek integrates NVIDIA GPUs into Dimensity SoCs and leverages TSMC’s process power efficiency advantages, it could bring a new wave of excitement to MediaTek in the flagship or gaming device market, attracting consumer interest. However, despite the potential technical benefits of collaboration, considering the influence of geopolitical factors, MediaTek, which primarily sells its smartphone SoCs to Chinese customers, may ultimately abandon this collaboration option due to related policy risks.

The excitement surrounding ChatGPT has sparked a new era in generative AI. This fresh technological whirlwind is revolutionizing everything, from cloud-based AI servers all the way down to edge-computing in smartphones.

Given that generative AI has enormous potential to foster new applications and boost user productivity, smartphones have unsurprisingly become a crucial vehicle for AI tech. Even though the computational power of an end device isn’t on par with the cloud, it has the double benefit of reducing the overall cost of computation and protecting user privacy. This is primarily why smartphone OEMs started using AI chips to explore and implement new features a few years ago.

However, Oppo’s recent decision to shut down its chip design company, Zheku, casted some doubts on the future of smartphone OEMs’ self-developed chips, bringing the smartphone AI chip market into focus.

Pressing Needs to Speed Up AI Chips Iterations

The industry’s current approach to running generative AI models on end devices involves two-pronged approaches: software efforts focus on reducing the size of the models to lessen the burden and energy consumption of chips, while the hardware side is all about increasing computational power and optimizing energy use through process shrinkage and architectural upgrades.

IC design houses, like Qualcomm with its Snapdragon8 Gen.2, are now hurrying to develop SoC products that are capable of running these generative AI base models.
Here’s the tricky part though: models are constantly evolving at a pace far exceeding the SoC development cycle – with updates like GPT occurring every six months. This gap between hardware iterations and new AI model advancements might only get wider, making the rapid expansion of computational requirements the major pain point that hardware solution providers need to address.

Top-tier OEMs pioneering Add-on AI Accelerators

It’s clear that in this race for AI computational power, the past reliance on SoCs is being challenged. Top-tier smartphone OEMs are no longer merely depending on standard products from SoC suppliers. Instead, they’re aggressively adopting AI accelerator chips to fill the computational gap.

The approaches of integrating and add-on AI accelerator were first seen in 2017:

• Integrated: This strategy is represented by Huawei’s Kirin970 and Apple’s A11 Bionic, which incorporated an AI engine within SoC.
• Add-on: Initially implemented by Google Pixel 2, which used a custom Pixel Visual Core chip alongside Snapdragon 835. It wasn’t until the 2021 Pixel 6 series, which introduced Google’s self-developed Tensor SoC, that the acceleration unit was directly integrated into the Tensor.

Clearly, OEMs with self-developing SoC+ capabilities usually embed their models into AI accelerators at the design stage. This hardware-software synergy supplies the required computing power for specific AI scenarios.

New Strategic Models on the Rise

For OEMs without self-development capabilities, the hefty cost of SoC development keeps them reliant on chip manufacturers’ SoC iterations. Yet, they’re also applying new strategies within the supply chain to keep pace with swift changes.

Here’s the interesting part – brands are leveraging simpler specialized chips to boost AI-enabled applications, making standalone ICs like ISPs(Image Signal Processors) pivotal for new features of photography and display. Meanwhile, we’re also seeing potential advancements in the field of productivity tools – from voice assistants to photo editing – where the implementation of small-scale ASICs is seriously being considered to fulfill computational demands.

From Xiaomi’s collaboration with Altek and Vivo’s joint effort with Novatek to develop ISPs, the future looks bright for ASIC development, opening up opportunities for small-scale IC design and IP service providers.

Responding to the trend, SoC leader MediaTek is embracing an open 5G architecture strategy for market expansion through licensing and custom services. However, there’s speculation about OEMs possibly replacing MediaTek’s standard IP with self-developed ones for deeper product differentiation.

Looking at this, it’s clear that the battle of AI chips continues with no winning strategy for speeding up smartphone AI chip product iteration.

Considering the substantial resources required for chip development and the saturation of the smartphone market, maintaining chip-related strategies adds a layer of uncertainty for OEMs.With Oppo’s move to discontinue its chip R&D, other brands like Vivo and Xiaomi are likely reconsidering their game plans. The future, therefore, warrants close watch.

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