Recently, Samsung Electronics announced that the development of its 8nm eMRAM has almost been completed and process upgrades is underway as planned.

According to a report from WeChat account DRAMeXchange, as a new type of non-volatile memory technology based on magnetic principles, eMRAM falls under the category of embedded MRAM (Magnetoresistive random-access memory). Compared to traditional DRAM, eMRAM offers faster access speeds and higher durability. Unlike DRAM, it does not require data refreshing, and its write rate is 1000 times that of NAND.

Due to these characteristics, the industry holds a positive outlook on the potential of eMRAM, especially in scenarios that demand high performance, energy efficiency, and durability.

Samsung Electronics is one of the main producers of eMRAM and is dedicated to promoting its adoption in the automotive sector. In 2019, Samsung developed and mass-produced the industry’s first eMRAM based on 28nm FD-SOI. After achieving the production capability of 28nm eMRAM, Samsung reportedly plans to mass-produce 14nm eMRAM in 2024, 8nm in 2026, and 5nm in 2027.

Samsung is confident about the application of eMRAM in future automotive uses, stating that its product’s temperature tolerance has reached 150-160°C, which can fully meet the stringent requirements of the automotive industry for semiconductors.

In recent years, the proliferation of big data and artificial intelligence applications has generated massive memory demands and placed higher requirements for memory technologies. Against this backdrop, new memory technologies have continuously emerged, among which SCM (Storage Class Memory) is a representative, which combines high-speed read and write performance of DRAM with the persistent storage capability of NAND flash, potentially addressing issues of small capacity, volatility, and high cost associated with DRAM. Key SCM products include phase-change memory (PCM), resistive RAM (ReRAM), magnetoresistive RAM (MRAM), and nanotube RAM (NRAM).

Aside from Samsung, companies like Kioxia and ByteDance have also acted vigorously in the new memory field this year. In April, Kioxia’s CTO Hidefumi Miyajima stated that compared to competitors developing both NAND and DRAM, Kioxia is at a competitive disadvantage in terms of business diversity, making the cultivation of new memory product business like SCM a necessity. With this goal in mind, Kioxia reorganized its “Memory Technology Research Laboratory” into the “Advanced Technology Research Laboratory.”

In March, it was reported by South China Morning Post that ByteDance invested in a Chinese memory company Innostar, becoming its third-largest shareholder. Innostar focuses on the R&D of new memory technologies like ReRAM and related chip products covering three categories: high-performance industrial control/automotive-grade SoC/ASIC chip, computing-in-memory (CIM) IP, chip and system-on-memory (SoM) chip.

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• [News] Intel’s Lunar Lake Bundled Memory Reportedly Causes Uproar in the PC Supply Chain
• [News] Battle in AI PCs: Exploring Intel, AMD, and Qualcomm Chips’ AI Computing Power

(Photo credit: Samsung)

On May 20th, Intel announced that the release date for its next-generation processor, Lunar Lake, has been moved up, with official shipments expected in the third quarter. The NPU performance is set to reach 45 TOPS. However, per a report from Economic Daily News, the industry is puzzled by the fact that this chip is bundled with 16GB and 32GB memory, with Intel holding the specification control tightly. Reportedly, this move has disrupted the industry order, and PC manufacturers are said to be privately expressing their dissatisfaction.

It is expected that 20 brands will release 80 models featuring this processor. Combined shipments of Metro Lake and Lunar Lake this year are projected to reach 40 million units. Unlike the previous generation, Lunar Lake’s packaging design integrates LPDDR5x memory into a single package, emphasizing low power consumption.

On May 20th, Microsoft launched its next-generation AI PCs, equipped with a more powerful AI assistant, Copilot, and new features. It also established a new standard for AI PC architecture, “Copilot+ PC.” The initial products all feature Qualcomm’s “Snapdragon X Elite” processors designed with Arm architecture.

Qualcomm’s CPUs in the new PCs are equipped with a Neural Processing Engine (NPE) designed specifically for AI applications, boasting 45 TOPS. This, as per another report from the Economic Daily News, results in a 58% increase in speed and extended battery life compared to Apple’s latest top-tier MacBook, which uses the M3 chip. Additionally, they support Microsoft’s AI chatbot, Copilot.

Intel, on the other hand, made a rare announcement, revealing that its next-generation Lunar Lake will have a total performance exceeding 100 TOPS, with the NPU alone exceeding 45 TOPS—nearly three times that of the previous generation. Additionally, the CPU and GPU combined computing power will exceed 60 TOPS, making it the second qualified processor for Microsoft’s Copilot+ PC platform.

However, it is important to note that according to Intel’s plans, the new generation processors Ultra 5/7/9 will be bundled with memory and shipped together with the CPU. Specifically, the high-end Ultra 9 will be bundled with 32GB of memory, while the Ultra 5 and Ultra 7 will have 16GB and 32GB versions. Per Microsoft’s recommendations, AI PCs need at least 16GB of memory. While Intel’s approach meets this requirement, it limits the ability of brands to adjust specifications and leaves memory manufacturers out of the loop.

In simpler terms, there is still a demand for 8GB memory in lower-end notebooks, and high-end laptops can require more than 64GB of memory. However, Intel’s Lunar Lake constraints make it difficult to plan both high-end and entry-level versions. Industry sources cited in the same report from Economic Daily News indicate that Intel’s next-generation Arrow Lake will not be bundled with memory.

Reportedly, industry sources also state that procurement contracts with memory suppliers have traditionally been long-term, accounting for annual memory requirements. Now, Intel’s bundling of memory with its single platform changes the industry’s ecosystem. Previously, PC brands would develop various combinations (CPU + memory + SSD capacity) for their product lines. However, with Intel defining five laptop CPU + memory specifications, it limits the customization capabilities of PC brands.

With Intel launching Lunar Lake early, AMD is set to counter with its next-generation AI processor Ryzen series named Strix Point in the fourth quarter. The Strix Point processor will feature AI processing power exceeding 50 TOPS, and there will also be an APU, Strix Halo, expected to launch around the end of the year with performance exceeding 60 TOPS, making it a significant player in AI computing power.

CEO Pat Gelsinger recently demonstrated the performance of the Lunar Lake processor, emphasizing that its total AI workload exceeds 100 TOPS, with the NPU contributing 45 TOPS. The CPU features Lion Cove architecture P-cores and Skymont architecture E-cores, while the GPU and CPU together provide over 60 TOPS of computing power. This means Intel’s chip AI performance will be more than three times that of current products, with a total combined performance exceeding 100 TOPS.

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• [News] Battle in AI PCs: Exploring Intel, AMD, and Qualcomm Chips’ AI Computing Power
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(Photo credit: Intel)

Kioxia, one of the world’s major NAND manufacturer, anticipates a strong market outlook, emphasizing a full recovery this season in key NAND applications such as PCs and smartphones.

According to a report from the Economic Daily News, coupled with an expected surge in demand for new laptops and smartphones driven by AI, NAND chip prices, which increased by 20% last season, are likely to continue rising this season, marking the fourth consecutive price hike. The industry’s future appears quite promising.

Benefiting from the recovering NAND market, Kioxia reported its first revenue growth in seven quarters and profitability for the first time in six quarters. During an investor conference, Kioxia noted that NAND chip prices in US dollar rose by approximately 20% last season, continuing an upward trend for three consecutive quarters, with the company’s quarterly shipment volume increasing by about 5% to 9%.

Kioxia emphasized that this season sees a recovery trend in key NAND end applications such as PCs and smartphones. Additionally, a new wave of laptop and smartphone upgrades driven by AI is expected, along with data centers requiring higher-capacity solid-state drives (SSDs) to support AI applications. All these factors positively impact the NAND industry.

Kioxia is reportedly optimistic that the proliferation of AI and the increase in memory capacity will continue to drive long-term growth in the NAND market. Due to disciplined production output by NAND chip manufacturers, the price increase trend is expected to continue this season, making the industry’s future prospects quite optimistic.

Taiwanese NAND manufacturer ADATA believes that although upstream NAND suppliers are gradually returning to profitability and steadily increasing capacity utilization rates, their approach to pricing and capacity planning remains rational. Coupled with a noticeable recovery in demand for enterprise and data center SSDs, ADATA is reportedly optimistic that NAND chip prices will continue to rise in a stable manner, per the same report from Economic Daily News.

As per a research from TrendForce on March 6, in 4Q23, Samsung still firmly held the top position in the NAND Flash market, with its market share increasing from 31.4% in the previous quarter to 36.6%; SK Group, with its market share increasing from 20.2% in the previous quarter to 21.6%, stood in the second place quarterly revenue.

Following them were Western Digital, whose market share decreased from 16.9% in the previous quarter to 14.5%, Kioxia, whose market share decreased from 14.5% in the previous quarter to 12.6%, and Micron, whose market share decreased from 12.5% in the previous quarter to 9.9%.

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• [News] Memory Giants Reportedly Increasing Prices, But Is the Market Outlook Truly Positive?
• [News] NAND Flash Market Landscape to Change?

(Photo credit: Kioxia)

According to a report from Korean media ETNews citing industry sources, it has indicated that Samsung Electronics has recently increased the capacity utilization rate of NAND Flash to over 90%, a further increase from the first quarter’s 80%.

Previously, Korean media including ETNews and The Elec held a relatively optimistic view of Samsung Electronics’ NAND Flash business, reporting that the operating rate of the Xi’an plant had reached 70%. However, the Chosun Daily has a different perspective, suggesting that Samsung Electronics continues to maintain its plan of reducing production by 50%.

According to the same report from ETNews, some NAND Flash fabs of Samsung are currently operating at full capacity, significantly better than the lowest utilization rate of 60% seen in 2023. Reportedly, the capacity utilization rate of the Xi’an plant in China has notably increased, followed by a gradual recovery in the NAND Flash capacity at Samsung’s Pyeongtaek facility in South Korea.

The report further cited another industry source who noted that downstream customers’ inventories of NAND Flash have essentially been depleted, leading to a balanced supply-demand trend. This is reportedly a key driver behind Samsung’s ongoing increase in capacity utilization.

The primary reason for the rise in NAND Flash market demand is attributed to the AI trend driving increased demand for enterprise solid-state drives (SSDs) from related businesses. This includes cloud computing service providers in North America and China increasing their purchases of enterprise storage to meet market demands.

As per TrendForce’s press release in March, it has projected a strong 13–18% increase in Q2 NAND Flash contract prices, with enterprise SSDs expected to rise highest. Despite Kioxia and WDC boosting their production capacity utilization rates from Q1 this year, other suppliers have kept their production strategies conservative. The slight dip in Q2 NAND Flash purchasing—compared to Q1—does not detract from the overall market’s momentum, which continues to be influenced by decreasing supplier inventories and the impact of production cuts.

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• [News] Korean NAND Flash Manufacturers Cautiously Increase Wafer Input, Capacity Utilization Maintains Around 50%
• [News] Western Digital Customer Letter Confirms HDD Supply Shortage! NAND Flash and Hard Drive Prices Continue to Rise

(Photo credit: Samsung)

According to sources cited in Bloomberg’s report, the US government is considering imposing sanctions on Chinese technology firms, including ChangXin Memory Technologies (CXMT), in its latest move against China’s advanced semiconductor sector.

The same report has pointed out that the US Department of Commerce’s Bureau of Industry and Security (BIS) is currently considering including CXMT in the Entity List, which would restrict the listed companies’ access to US technology. Apart from CXMT, US officials are also contemplating restrictions on five other Chinese companies, though the final list has yet to be confirmed.

Regarding this matter, the BIS and White House National Security Council declined to comment.

CXMT is a major Chinese DRAM manufacturer whose products include chips applicable in computer servers, smart vehicles, and other devices. Its primary competitors include Micron, Samsung Electronics, and SK Hynix. Micron.

The recent actions by the US government reportedly stem from Huawei’s breakthrough last year in circumventing US restrictions to acquire advanced process chips, specifically obtaining chips using the 7-nanometer process from SMIC (Semiconductor Manufacturing International Corporation). This allowed Huawei to make a comeback in the 5G smartphone market, prompting concerns and responses from the US government.

Gina Raimondo, the US Secretary of Commerce, has responded by stating that the US will take “as strong and effective action as possible” to uphold national security interests.

Currently, companies that have been listed on the Entity List by the US Department of Commerce include Huawei, SMIC (Semiconductor Manufacturing International Corporation), and Shanghai Micro Electronics. Additionally, China’s other major memory manufacturer, Yangtze Memory Technology Corp, was added to this restriction list in 2022.

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• [News] Bypassing U.S. Restrictions? CXMT Showcases GAA Technology for 3nm Chips
• DRAM Industry Sees Nearly 30% Revenue Growth in 4Q23 Due to Rising Prices and Volume, Says TrendForce

(Photo credit: CXMT)