According to a report from Economic Daily News, TSMC’s advanced packaging platform SoIC is said to have secured another heavyweight customer, with Apple expected to adopt the technology in 2025. If confirmed, Apple will join AMD as a major client expanding its use of TSMC’s SoIC .

TSMC has categorized advanced packaging under its 3D Fabric system integration platform, which comprises three main parts: the SoIC series for 3D silicon stacking technology, and the CoWoS and InFo families for back-end advanced packaging.

Reportedly, it is said that the CoWoS family has been facing capacity constraints recently. To address this, TSMC is not only expanding its own production but also collaborating with testing service providers to increase output.

On the other hand, TSMC’s SoIC platform, which is part of front-end packaging, has fewer bottlenecks and began small-scale production in 2022. TSMC has long-term plans to expand SoIC capacity by more than 20 times by 2026 to meet growing customer demand.

In recent years, NVIDIA and AMD have been aggressively targeting the AI market, setting high growth targets for 2024. Both companies have sought collaboration with TSMC and several Taiwanese supply chain partners. The key advantage is Taiwan’s comprehensive supply chain, which can accelerate innovation. As TSMC’s advanced packaging capacity ramps up, industry analysts are optimistic that this will facilitate the smooth procurement and delivery of critical components.

In the highly anticipated SoIC area, AMD’s MI300 series is a recent story of deepened collaboration with TSMC. According to information from AMD and TSMC’s technology forum, the MI300 series not only uses TSMC’s 5nm process but also integrates multiple technologies from TSMC’s 3DFabric platform. This includes stacking the 5nm GPU and CPU on a base chip using SoIC-X technology and further integrating them into CoWoS packaging.

Beyond AMD’s adoption, the same report has cited rumors that Apple might adopt this technology in 2025.

Although TSMC consistently refrains from commenting on individual client details, industry speculation has long suggested that Apple intends to incorporate related technology into the next-generation M-series chips, and possibly even the A-series processors. This could significantly increase transistor density, driving the next wave of innovation in the mobile device and AI PC markets.

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(Photo credit: TSMC)

AMD benefited from AI demand last quarter (January to March), with revenue of USD 5.47 billion, surpassing Wall Street expectations and turning a profit compared to the same period last year. However, this quarter’s fiscal forecast and market outlook are not as expected.

AMD achieved a net profit of USD 120 million last quarter, with an adjusted EPS of USD 0.62, surpassing Wall Street’s expected USD 0.61. AMD expects revenue for this quarter to be between USD 5.4 billion and USD 6 billion, with a midpoint of USD 5.7 billion, a 6% increase from the same period last year but slightly below Wall Street’s expected USD 5.73 billion.

After enduring a downturn in the semiconductor industry, AMD finally returned to profitability last quarter, largely due to strong sales of its MI300 series AI chips, which drove revenue in the data center division to grow by 80% year-on-year to USD 2.3 billion.

As per a report from the Wall Street Journal, AMD CEO Lisa Su stated that since the launch of the latest MI300X chip at the end of last year, sales have surpassed $1 billion, with major customers including Microsoft, Meta, Oracle, among other tech giants.

In January, Lisa Su had forecasted that AMD’s AI chip revenue for this year could reach USD 3.5 billion, which was recently revised upwards to USD 4 billion. The AMD MI300 series chips are seen as direct competitors to NVIDIA’s H100 chips. However, NVIDIA announced its new generation AI chip architecture, Blackwell, in March this year, forcing AMD to accelerate its pace. Lisa Su stated that AMD is already developing the next generation of AI chips.

AMD’s client division, which sells PC chips, has also benefited from the AI wave, with revenue increasing by 85% year-on-year to USD 1.4 billion last quarter, once again proving the recovery and growth of the global PC market. AMD’s chips for PCs are capable of executing AI computations locally, targeting the increasingly expanding demand for AI-enabled PCs.

Regarding the applications of AI PCs, Su previously stated in an interview with Sina that she found communication, productivity, and creativity particularly exciting. Many applications are still in their early stages, but she expects to see more developments in the coming years.

However, AMD’s businesses outside of AI chips are facing increasing challenges. Revenue from the gaming console chip division declined by 48% year-on-year to USD 920 million last quarter, falling short of Wall Street’s expectations of USD 970 million. Additionally, the revenue from the embedded chip division, established after AMD’s acquisition of Xilinx in 2022, also decreased by 46% year-on-year to USD 850 million last quarter, similarly below Wall Street’s expectations of USD 940 million.

TrendForce previously issued an analysis in a press release, indicating that the AI PC market is propelled by two key drivers: Firstly, demand for terminal applications, mainly dominated by Microsoft through its Windows OS and Office suite, is a significant factor. Microsoft is poised to integrate Copilot into the next generation of Windows, making Copilot a fundamental requirement for AI PCs.

Secondly, Intel, as a leading CPU manufacturer, is advocating for AI PCs that combine CPU, GPU, and NPU architectures to enable a variety of terminal AI applications.

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(Photo credit: AMD)

Following NVIDIA’s GTC 2024, AMD also hosted an AI PC Innovation Summit on March 21st, with CEO Lisa Su leading the top executives in attendance. As per a report from Commercial Times, by collaborating with partners including brands ASUS, MSI, and Acer, AMD has showcased its exciting applications in AI PCs.

AMD highlights that future language models will evolve in two directions: one is the large-scale models introduced by tech giants, which use increasingly more parameters and become more complex in operation, with closed architecture being a major characteristic.

The other direction is small open-source models, which are becoming more widely accepted by the public. These models with fewer parameters can run smoothly on edge devices, especially AI PCs, expecting a significant influx of developers.

Furthermore, the AI compute requirements for large and small language models are entirely different. AMD has different hardware positioning to meet all demands.

Lisa Su emphasizes that artificial intelligence is driving a revolution, reshaping every aspect of the tech industry, from data centers to AI PCs and edge computing. AMD is excited about the opportunities presented by this new era of computing.

TrendForce previously issued an analysis in a press release, indicating that the AI PC market is propelled by two key drivers: Firstly, demand for terminal applications, mainly dominated by Microsoft through its Windows OS and Office suite, is a significant factor. Microsoft is poised to integrate Copilot into the next generation of Windows, making Copilot a fundamental requirement for AI PCs. Secondly, Intel, as a leading CPU manufacturer, is advocating for AI PCs that combine CPU, GPU, and NPU architectures to enable a variety of terminal AI applications.

Introduced around the end of 2023, Qualcomm’s Snapdragon X Elite platform is set to be the first to meet Copilot standards, with shipments expected in the second half of 2024. This platform is anticipated to deliver around 45 TOPS.

Following closely behind, AMD’s Ryzen 8000 series (Strix Point) is also expected to meet these requirements. Intel’s Meteor Lake, launched in December 2023 with a combined CPU+GPU+NPU power of 34 TOPS, falls short of Microsoft’s standards. However, Intel’s upcoming Lunar Lake might surpass the 40 TOPS threshold by the end of the year.

The race among Qualcomm, Intel, and AMD in the AI PC market is set to intensify the competition between the x86 and Arm CPU architectures in the Edge AI market. Qualcomm’s early compliance with Microsoft’s requirements positions it to capture the initial wave of AI PC opportunities, as major PC OEMs like Dell, HPE, Lenovo, ASUS, and Acer develop Qualcomm CPU-equipped models in 2024, presenting a challenge to the x86 camp.

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(Photo credit: AMD)

TSMC operates at full capacity, AMD aims for AI chips reportedly seeks CoWoS-like supply chain.

In 2023, NVIDIA led the global AI chip development, and in 2024, the global demand for AI chips is expected to continue to surge due to the expansion of end-user applications such as PCs and mobile phones.

Meanwhile, AMD has not stopped in AI chip development either, with the expected MI300 products poised to heat up the global AI business opportunities. However, the key to supply lies in advanced packaging, and AMD will seek outsourced semiconductor assembly and test (OSAT) service providers to offer support similar to CoWoS.

According to Taiwan’s Commercial Times, TSMC’s CoWoS capacity has long been fully loaded, and even if it expands production this year, it will mainly be reserved for NVIDIA. Market sources pointed out that TSMC will continue to increase CoWoS capacity to support AMD’s demand, but it takes six to nine months to establish a new production line. Therefore, it is expected that AMD will seek cooperation with other companies with CoWoS-like packaging capabilities. ASE, Amkor, Powertech, and KYEC are the first batch of potential partners.

TSMC has been outsourcing part of its CoWoS operations for some time, mainly targeting small-volume, high-performance chips. TSMC maintains in-house production of the CoW, while the back-end WoS is handed over to test and assembly houses to improve production efficiency and flexibility. This model will continue in the future 3D IC generation.

ASE and Amkor both received WoS orders last year. ASE has strengthened the development of advanced packaging technology and has a complete solution for the entire CoWoS process. ASE previously stated that it sees the strong potential of AI and expects related revenue to double in 2024.

According to reports citing market sources, the monthly production capacity of the ASE Group’s 2.5D packaging is about 2,000 to 2,500 pieces. Some experts believe that test and assembly houses will maintain the business model of TSMC or UMC providing the interposer. Therefore, in 2024, a significant increase in CoWoS production capacity is expected.

KYEC is responsible for testing Nvidia AI chips and is expected to benefit from AMD’s search for CoWoS-like capacity. Nvidia is currently KYEC’s second-largest customer.

KYEC’s testing of Nvidia A100 and H100 chips is mainly in the final test (FT), with a market share of up to 70%. KYEC provides comprehensive IC burn-in testing, has self-developed burn-in equipment, and has been in the industry for more than a decade, accumulating many patents and technologies.

AMD stated at the end of 2023 that AI chip revenue could reach US$2 billion in 2024, excluding other HPC chips. AMD pointed out that the annual compound growth rate of the AI chip market in the next four years will reach 70%, and it is estimated that it will reach US$400 billion in 2027.

(Image: AMD)