As AMD unveiled the roadmap for its upcoming AI accelerators at Advancing AI 2024, including MI325X and MI355X, its longtime foundry partner TSMC is expected to be the major beneficiary, according to the reports by the Commercial Times and the Economic Daily News.

TSMC, as AMD’s key chip making partner, is expected to benefit the most, as the foundry giant also provides advanced packaging services such chiplets and CoWoS, Commercial Times notes.

Other Taiwanese companies in the supply chain are also expected to benefit, including ASMedia, which provides PCIe Gen5 high-speed interface chips, as well as ASIC firms GUC and Alchip, according to the report. Among server OEM partners, Compal, Wistron, Wiwynn, and Inventec are listed as AMD’s collaborators.

According to the Economic Daily News, AMD’s Instinct MI325X AI accelerator is said to be manufactured with TSMC’s 4nm and 5nm, with mass production anticipated to begin this quarter. It is worth noting that the AI GPU would be the first of its kind to be equipped with 256GB HBM3e memory, according to another report by Wccftech.

On the other hand, to compete with AI chip giant NVIDIA’s GB200, AMD also introduced the MI350 series at the event. According to Commercial Times, MI355X will be launched in the second half of 2025, leveraging TSMC’s 3nm process while equipped with 288GB HBM3e memory.

The report by Commercial Times further notes that in addition to its larger memory capacity, the MI355X accelerator also incorporates the CDNA 4 architecture, allowing it to achieve a significant 35x increase in FP8 computational performance.

Featuring TSMC’s 3nm node just like NVIDIA’s Rubin reportedly does, AMD’s MI355X has the potential to catch up with, or even run ahead of its archrival in terms of product schedule, the report suggests. NVIDIA’s Rubin is reportedly to be released in the fourth quarter of 2025.

Notably, AMD’s MI300X accelerator has been reportedly adopted by a few tech heavyweights. According to Commercial Times, following Microsoft’s adoption, Samsung has also purchased USD 20 million worth of AMD MI300X units for AI training.

At Advancing AI 2024, which took place on October 10^th, AMD also introduced its latest EPYC server processors, EPYC 9005 Series, previously codenamed Turin. According to its press release, the EPYC 9005 Series is built on the latest “Zen 5” architecture, which offers up to 192 cores and will be available in a wide range of platforms from leading OEMs and ODMs. According to the Economic Daily News, EPYC 9005 Series is manufactured with TSMC’s 3nm and 4nm nodes.

Read more

• [News] AMD Unifies RDNA and CDNA into UDNA Architecture, Aiming to Compete with NVIDIA’s CUDA
• [News] AMD MI325X Reported to Debut in October, Claiming AI Supercycle Has Just Started

(Photo credit: AMD)