Due to the impact of international situations and uncontrollable factors, the global semiconductor supply chain is undergoing a shift. According to a report from WeChat account DRAMeXchange, the Southeast Asian region, with its advantages in labor and development conditions, has become the preferred...

According to a report from TechNews, South Korean memory giant SK Hynix is participating in COMPUTEX 2024 for the first time, showcasing the latest HBM3e memory and MR-MUF technology (Mass Re-flow Molded Underfill), and revealing that hybrid bonding will play a crucial role in chip stacking. MR-M...

Driven by the rapid growth in demand for high-bandwidth memory (HBM) fueled by artificial intelligence (AI), memory manufacturers are vying for market opportunities. According to a report from CNA, Micron has announced its target to achieve a 20% to 25% market share in HBM by 2025. Targeting the...

JEDEC (the Solid State Technology Association) recently confirmed that the long-used SO-DIMM and DIMM memory standards will be replaced by CAMM2 for DDR6 (LPDDR6 included). According to a report from WeChat account DRAMeXchange, the minimum frequency for DDR6 memory is 8800MHz, which can be incre...

To capture the booming demand of AI processors, memory heavyweights have been aggressively expanding HBM (High Bandwidth Memory) capacity, as well as striving to improve its yield and competitiveness. The latest development would be Micron's reported new plant in Hiroshima Prefecture, Japan. The ...