The U.S. memory giant Micron Technology has started the mass production of high-bandwidth memory "HBM3e," which will be utilized in NVIDIA's latest AI chips. Micron stated on February 26th that HBM3e consumes 30% less power than its competitors, meeting the demands of generative AI applications...

Currently, the top three leaders—Samsung, SK Hynix, and Micron—in the HBM sector are undergoing unprecedented expansion. Below is an overview of the progress made by each of these giants in the realm of HBM: Samsung: HBM Production to Increase 2.5 Times in 2024, Another 2 Times in 2025 S...

Another breakthrough has emerged in flash memory layer technology! A recent report cited by tom’s Hardware has suggested that at the upcoming International Solid-State Circuits Conference (ISSCC) in February of this year, Samsung Electronics will unveil the next-generation V9 QLC NAND solution, pu...

Amid the AI trend, the significance of high-value-added DRAM represented by HBM continues to grow. HBM (High Bandwidth Memory) is a type of graphics DDR memory that boasts advantages such as high bandwidth, high capacity, low latency, and low power consumption compared to traditional DRAM chips. ...

Global memory giants continue to reduce production, coupled with the situation where market demand is increasing due to the rise in artificial intelligence and high-performance computing applications, as well as inventory replenishment from the smartphone market. This combination is driving a contin...