Following the footsteps of semiconductor bellwethers TSMC and Intel, as well as memory giants Micron and SK hynix, Samsung has hopped on the last minute opportunity of securing the funding under the CHIPS Act in Biden’s term. According to U.S. Department of Commerce, it has finalized a nearly USD ...

A report from TechNews, citing Tom’s Hardware, indicates that in response to the rapidly growing demand driven by AI, SK hynix, Samsung, and Micron are all accelerating the development of HBM products, and recently Micron has revealed plans for its HBM4 and HBM4E. Micron shows in its AI memory po...

Is the DRAM winter really coming? Despite Micron’s sequential doubling of HBM revenue in the previous quarter, weak demand for PCs and smartphones, combined with a DRAM supply glut, continues to weigh on its business, as its second quarter guidance disappoints the market. Micron achieved record...

Marvell announces new custom HBM compute architecture that enables XPUs to achieve greater compute and memory density. According to its press release, this new AI accelerator (XPU) architecture enables up to 25% more compute, 33% greater memory while improving power efficiency. Notably, the new c...

Following the footsteps of semiconductor bellwethers TSMC and Intel, U.S. head-quartered Micron becomes the first memory giant to secure the funding under the CHIPS Act. According to U.S. Department of Commerce, it has finalized a USD 6.165 billion government subsidy for Micron to support semiconduc...