On August 13th, as per a report from Wallstreetcn citing industry sources, it's indicated that SK hynix has raised the price of its DDR5 DRAM by 15% to 20%. Per the sources, the price hike by hynix is primarily due to the production capacity being squeezed by HBM3/3e. Additionally, the increased ...

According to industry sources cited in a report from TechNews, a temporary power outage occurred in certain areas in northern Taiwan (Linkou, Taishan, Xinzhuang) at 1:35 PM on August 13. Addressing the matter, DRAM manufacturer Nanya Technology is currently assessing the damage, while Micron, on ...

As the demand for memory chips used in AI remains strong, prompting major memory companies to accelerate their pace on HBM3e and HBM4 qualification, SK hynix CEO Kwak Noh-jung stated on August 7 that driven by the high demand for memory chips like high-bandwidth memory (HBM), the market is expected ...

Per a report from Reuters, Intel is said to be receiving the second new High-NA EUV equipment from ASML, costing EUR 350 million (~USD 383 million). According to Intel's earnings call on August 1, CEO Pat Gelsinger stated that Intel began receiving the first large equipment in December, and the i...

According to a report from Economic Daily News, Innolux President James Yang announced on August 5 that the company is advancing its semiconductor fan-out panel-level packaging (FOPLP) with three key processes, targeting to enter mass production as soon as year-end. The chip-first process tech...