Micron


2024-06-27

[News] Memory Giant Micron’s 3Q24 Earnings Report Released, Outlook Slightly Better Than Expected

On June 26, American memory manufacturer Micron announced its financial results for the third quarter of the 2024 fiscal year (ending May 30, 2024) after the market closed: revenue increased by 82% year-over-year (17% quarter-over-quarter) to $6.811 billion; Non-GAAP diluted earnings per share (EPS)...

2024-06-27

[News] Outpacing Samsung or the End of Race? Kioxia Aims 1000-layer NAND by 2027

After ending production cuts amidst a recovery in the memory industry, Kioxia disclosed its plans on the 3D NAND roadmap last week. According to reports from PC Watch and Blocks & Files, Kioxia stated that achieving a 1,000-layer level by 2027 would be possible. According to the reports, the ...

2024-06-27

[News] GDDR7 Emerging as a New Driver for Memory Industry

AI applications is driving the memory market forward, with HBM (High Bandwidth Memory) undoubtedly being a sought-after product of the industry, attracting increased capital expenditure and production expansion from memory manufacturers. At the meantime, a new force in the memory market has quietly ...

2024-06-26

[Insights] Memory Spot Price Update: DRAM Remains Weak Despite Samsung’s Capacity Shift to HBM

According to TrendForce's latest memory spot price trend report, the spot price of DRAM remains weak, as Samsung’s reallocation of its D1A process to the manufacturing of HBM products did little help. As for NAND flash, overall transactions are also sitting on the enervated end due to weakening m...

2024-06-26

[News] ASMPT Reportedly Provided Demo TC Bonder to Micron for HBM Production

Driven by memory giants ramping up high-bandwidth memory (HBM) production, according to a report from Korean media outlet TheElec, ASMPT, a back-end equipment maker, has supplied a demo thermal compression (TC) bonder for Micron's HBM production. TC bonders play a pivotal role in HBM production...

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