NanoFlex


2024-12-16

[News] TSMC Reveals N2 Nanosheet Details: 35% Power Savings, 15% Performance Gain, Densest SRAM Cell Yet

With its N2 (2nm-class) node beginning mass production in the latter half of 2025, TSMC revealed more details about it at the IEEE International Electron Device Meeting (IEDM) a couple of days ago. According to IEEE Spectrum and Tom’s Hardware, TSMC's new 2nm technology delivers up to 15% faster p...

2024-06-06

[News] A Quick Overview at TSMC’s Latest Collaboration with Intel, NVIDIA and AMD at COMPUTEX 2024

If you happen to be a technology enthusiast, June would certainly be a month to watch. NVIDIA CEO Jensen Huang, joined by AMD CEO Lisa Su, visited Taiwan to announce their product roadmaps in COMPUTEX 2024. NVIDIA unveiled its new generation Rubin architecture, indicating that the R series products ...

2024-05-07

[News] More Complex than Intel’s? TSMC’s Super PowerRail – Elevating Chip Performance through Advanced Power Delivery

At TSMC's North America Technology Symposium, per a report from TechNews, the semiconductor giant unveiled its A16 process, designed to accommodate more transistors, enhance computational performance, and reduce power consumption. Of particular interest is the integration of the Super PowerRail arch...

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