According to a report from tom’s Hardware, Jack Huynh, AMD's senior vice president and general manager of its Computing and Graphics Business Group, announced at IFA 2024 in Berlin that AMD will unify its consumer microarchitecture "RDNA" and data center microarchitecture "CDNA" under a single nam...

According to a report from Commercial Times citing sources, it's revealed that NVIDIA has executed changes to the Blackwell series' 6-layer GPU mask. Therefore, the process can now proceed without re-taping out, as production delays being minimized. The report noted that NVIDIA's updated ...

After its 8-Hi HBM3e entered mass production in February, Micron officially introduced the 12-Hi HBM3e memory stacks on Monday, which features a 36 GB capacity, according to a report by Tom’s Hardware. The new products are designed for cutting-edge processors used in AI and high-performance comput...

Despite U.S. export controls aimed at preventing Chinese companies from acquiring advanced AI chips, small cloud service providers in China have reportedly found ways to obtain NVIDIA’s A100 and H100 chips. The cost of renting cloud services in China is even lower than in the U.S. According to�...

Recently, Samsung Electro-Mechanics announced that by 2026, the sales share of its high-end Flip Chip Ball Grid Array (FCBGA) substrates for server and artificial intelligence will exceed 50%. FCBGA is an integrated circuit (IC) packaging technology，which involves flipping the chip and connecti...