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    2024-09-12

    [News] ACM Research Launches Panel-Level Etching Tool, Expanding Its FOPLP Porfolio

    Semiconductors

    ACM Research, Inc., a provider of wafer processing solutions for semiconductor and advanced wafer-level packaging applications in China, announced on September 3rd the release of its Ultra C bev-p panel bevel etching tool for fan-out panel-level packaging (FOPLP) applications. This new tool is de...

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