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    2022-01-14

    Heterogeneous Integration Expected to Become Key Part of Packaging Technology Thanks to Development from EDA Companies

    Semiconductors

    Although current semiconductor process technologies have evolved to the 3nm and 5nm nodes, SoC (system on a chip) architecture has yet to be manufactured at these nodes, as memory and RF front-end chiplets are yet to reach sufficient advancements in transistor gate length and data transmission perfo...

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