After its 8-Hi HBM3e entered mass production in February, Micron officially introduced the 12-Hi HBM3e memory stacks on Monday, which features a 36 GB capacity, according to a report by Tom’s Hardware. The new products are designed for cutting-edge processors used in AI and high-performance comput...

According to a report from Korean media ZDNet Korea, Chinese memory manufacturers like CXMT (Changxin Memory Technologies) are aggressively expanding production, which could negatively affect profitability in the traditional DRAM market. Both Samsung and SK hynix are said to be closely monitoring th...

No eternal allies. No perpetual enemies. The old proverb seems so true when it comes to the semiconductor industry, when the world’s top foundry, TSMC, announced the collaboration with its rival Samsung, the second largest foundry globally, on the development of HBM4, according to the reports by K...

At the SEMICON Taiwan 2024, Samsung's Head of Memory Business, Jung Bae Lee, stated that as the industry enters the HBM4 era, collaboration between memory makers, foundries, and customers is becoming increasingly crucial. Reportedly, Samsung is prepared with turnkey solutions while maintaining fl...

As Samsung plans to unveil its next-gen flagship smartphone, Galaxy S25 series, in early 2025, more details regarding the product have surfaced. Months ahead of the launch, Samsung is said to abandon the dual-processor strategy and equip the entire series with Qualcomm’s new Snapdragon 8 Gen 4 pro...