Samsung


2024-07-10

[News] Samsung, SK Hynix and Micron Ramp Up HBM Production, Reportedly Doubling Output Next Year

According to a report from Commercial Times, SK Hynix, Samsung, and Micron, the world's top three memory manufacturers, are actively investing in high-bandwidth memory (HBM) capacity expansion plans. Industry sources cited by the same report estimate that by 2025, the additional production will r...

2024-07-10

[News] TSMC Reportedly Plans to Commence Trial Production for Apple’s 2nm Chips Next Week

After Samsung announced a major breakthrough in 2nm, securing the first batch of orders from Japanese AI company Preferred Networks, its rival TSMC is also advancing. According to reports from Wccftech and ET News, TSMC is set to begin trial production of 2nm chips next week, which would reportedly ...

2024-07-10

[News] Samsung Officially Secures Its First 2nm Order, Making AI Chips for Preferred Networks

Samsung Electronics has received the first client for its 2nm process. According to the official press release from Samsung on July 9th, Samsung Electronics will provide turnkey semiconductor solutions using the 2nm process and the advanced 2.5D packaging technology Interposer-Cube S (I-Cube S) to J...

2024-07-09

[News] Hanmi Semiconductor to Launch 2.5D TC Bonders, Eyeing Strong Growth in 2024-26

As the demand for AI chips surges, orders for thermal compression (TC) bonders, which play a critical role in HBM (high-bandwidth memory) manufacturing, are also heating up. To further gain market momentum, South Korean chip packaging equipment manufacturer Hanmi Semiconductor plans to launch 2.5...

2024-07-08

[News] Korean Advanced Packaging Industry’s Rise Delayed by TSMC and ASE Expansion

South Korean media reports that the main suppliers of artificial intelligence (AI) chip packaging are concentrated in TSMC and ASE Technology Holding Co., which have been actively expanding production to meet the growing market demand. Despite efforts to develop technology and invest, South Korean c...

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