As the standard DRAM market experiences an unprecedented cycle of supply-demand imbalance, the shortage of DDR3 production capacity has become even more severe. According to a report from the Economic Daily News, with leading manufacturers like Samsung exiting DDR3 production, while demand for D...

According to the latest report by TheElec, though Samsung has been using thermal compression (TC) bonding until its 12-stack HBM, the company now confirms its belief that hybrid bonding is necessary for manufacturing 16-stack HBM. Regarding its future HBM roadmap, Samsung reportedly plans to prod...

According to a report from TechNews, South Korean memory giant SK Hynix is participating in COMPUTEX 2024 for the first time, showcasing the latest HBM3e memory and MR-MUF technology (Mass Re-flow Molded Underfill), and revealing that hybrid bonding will play a crucial role in chip stacking. MR-M...

Samsung has been strengthening its alliance regarding the semiconductor packaging technology, attempting to narrow the technological gap with TSMC, according to the latest report by Business Korea. Citing industry sources, Business Korea noted that Samsung is expected to expand its 2.5D and 3D MD...

Qualcomm President & CEO Cristiano Amon, at COMPUTEX 2024, showcased devices powered by Snapdragon X Elite and Snapdragon X Plus processors, claiming them to be the only PCs capable of delivering Copilot+ PC experiences. Afterwards, during a media briefing, he disclosed Qualcomm’s plans on a d...