Intel Corporation today announced that it has mutually agreed with Tower Semiconductor to terminate its previously disclosed agreement  to acquire Tower due to the inability to obtain in a timely manner the regulatory approvals required under the merger agreement, dated Feb. 15, 2022. In accordance with the terms of the merger agreement and in connection with its termination, Intel will pay a termination fee of $353 million to Tower.

In response to this development, TrendForce provides the following analysis:

As previously mentioned by TrendForce, Intel’s active entry into the semiconductor foundry market has presented challenges. These include:

Diversification of Manufacturing Expertise: Intel, historically focused on manufacturing CPUs, GPUs, FPGAs, and peripheral I/O chips, lacks the specialized fabrication processes possessed by other foundries. The success of acquiring Tower to expand its product line and market presence remains crucial.

Operational Segmentation: Apart from financial divisions, the division of physical facilities and actual production capacity must be strategically managed. Successfully emulating models like AMD/GlobalFoundries or Samsung LSI/Samsung Foundry, where there is a clear distinction between foundry and client, is essential. Simultaneously, Intel faces challenges in preventing orders from its significant client, the Intel Design Department, from flowing outward.

The official termination of the Tower acquisition plan introduces greater uncertainties and challenges for Intel in the competitive foundry market. In an industry marked by heightened competition, having dominance in specialized process technologies and diversified production lines is pivotal for sustaining profitability amid industry downturns. Without the assistance of Tower’s established specialized processes, Intel’s strategic approach and technology development in the foundry business will be worth monitoring.

(Photo credit: Intel)

As per a report from Taiwan’s TechNews,” TSMC, Samsung, and Intel have been actively deploying Backside Power Delivery Network (BSPDN) strategies recently, and have announced plans to incorporate BSPDN into their logic chip development roadmap. For instance, Samsung intends to implement BSPDN technology in its 2-nanometer chips, a move unveiled at the VLSI Symposium in Japan.

According to imec, BSPDN aims to alleviate the congestion issues faced by front-end logic chips in later-stage processes. Through Design Technology Co-Optimization (DTCO), more efficient wire designs are achieved in standard cells, aiding in the downsizing of logic standard cell.

In essence, BSPDN can be seen as a refinement of chiplet design. The conventional approach, where logic circuits and memory modules are integrated, is transformed into a configuration with logic functions on the front and power or signal delivery from the back.

While the traditional method of front-side wafer power delivery achieves its purpose, it leads to decreased power density and compromised performance. Nevertheless, the new BSPDN technique has not yet been adopted by foundries.

Samsung claims that, compared to the conventional method, BSPDN reduces area by 14.8%, providing more chip space for additional transistors and improved overall performance. Wire lengths are also cut by 9.2%, reducing resistance, allowing greater current flow, and thereby lowering power consumption while enhancing power transmission efficiency.

In June of this year, Intel also introduced its BSPDN-related innovations under the name ‘PowerVia.’ Team Blue plans to utilize this approach in the Intel 20A process, potentially achieving a chip utilization rate of 90%.

Intel believes PowerVia will address interconnect bottlenecks in silicon architecture, enabling continuous transmission through backside wafer powering. The company anticipates incorporating this novel approach into its Arrow Lake CPUs slated for release in 2024.

Furthermore, according to Taiwan’s supply chain sources, TSMC remains on track to launch its 2-nanometer process in 2025, with mass production expected in the latter half of the year in Hsinchu’s Baoshan. The company’s N2P process, planned for 2026, will feature BSPDN technology.

(Photo credit: Samsung)

When Apple unveiled its inaugural wearable device, the Vision Pro, in June this year, CEO Tim Cook remarked, “Apple Vision Pro introduces us to spatial computing.”

The era of spatial computing entails redefining how users interact with digital content within the context of the real world. Apple’s ambition extends beyond mere immersive entertainment, aiming to seamlessly integrate personal computers and smartphones into everyday life and work scenarios, replicating the success it achieved in personal and mobile computing.

The launch of the Vision Pro has once again thrust new display technologies into the industry spotlight. Although the Vision Pro employs Micro OLED, the potential to achieve a portable, outdoor-capable mixed-reality headset rests on Micro LED, seen as the most promising option.

“Micro LED demonstrates balanced performance beyond average levels in terms of brightness, energy consumption, pixel density (Pixel per Inch, PPI), and optical module size,” noted Eric Chiou, Senior Research Vice President at TrendForce. He further emphasized Micro LED’s potential in the development of AR devices, stating, “This also explains why Meta, Google, and MIT are continuously evaluating and assisting in the development of Micro LED technology.”

The application potential of Micro LED in AR devices is evident from the number of companies investing in its development.

In the first half of 2023 alone, six companies—Raysolve, Porotech, Sitan, Kopin, GoerOptics, JBD—announced progress in the development of Micro LED micro-display products. Additionally, two AR glasses manufacturers, Rayneo Innovation and Nubia, unveiled products featuring Micro LED chips.

Certainly, Micro LED’s implementation is not confined to AR eyewear; it is making inroads into the realm of wearables, particularly in the form of smartwatches. Soon, consumers will find the first commercially available watch featuring a Micro LED screen on the market. Tag Heuer, a luxury watch brand, is leading the way with support from AU Optronics for Micro LED panels.

Anticipation mounts for an Apple Watch featuring a Micro LED screen, with rumors circulating consistently. According to earlier information from TrendForce, the release of the Micro LED version of the Apple Watch, originally projected for the second half of 2025, has been delayed to the first quarter of 2026. Initial reports suggested the supply of Micro LED chips would come from Epistar and Osram and that Apple would handle mass transfer at its Longtan facility. Recent reports, however, suggest that Apple might entrust mass transfer and subsequent work to its long-term collaborator, LG Display (LGD).

It’s rumored that LGD has visited Apple’s Longtan facility, indicating a potential handover of equipment to LGD, facilitating smooth mass transfer and back-end processes. Despite shifts in the supply chain, this alteration underscores Apple’s commitment to advancing the Micro LED version of the watch into mass production, with wearables continuing to play a pivotal role in the practical implementation of Micro LED.

The industry’s technological development and investment in wearables, particularly watches and AR glasses, demonstrate a shift towards small-sized sectors represented by headsets and wearables. This indicates that Micro LED is edging closer to large-scale commercialization and breakthrough applications.

Regarding the commercial development of Micro LED, the launch of large-sized products remains a critical indicator. Korean giants Samsung and LGD are pivotal players in this regard. Following Samsung’s introduction of the high-end 110-inch Micro LED TV, LGD’s plans to release a 136-inch Micro LED TV in 2024 have surfaced. Factoring in Samsung’s and LGD’s entries, a total of five companies, including AUO, BOE, and SmartKem, have announced developments in Micro LED display technology in 2023.

Considering the market trends mentioned above, based on TrendForce’s projections, the production value of Micro LED chips is expected to reach $27 million in 2023, showing a 92% annual growth. Looking ahead, driven by the expansion of current application shipments and the introduction of new use cases, the estimated chip production value is set to hit $580 million by 2027. This anticipates a compound annual growth rate of 136% from 2022 to 2027.

(Photo credit: Samsung)

As semiconductor process technology nears known physical limits, the spotlight among major industry players is shifting towards the development of advanced packaging. Concurrently, the rise of applications like artificial intelligence and AIGC has propelled the concept of advanced packaging into a new technological wave. In the midst of the semiconductor industry’s global competition, securing more orders has become a core objective for major players.

A Competitive Landscape in Advanced Packaging

The competition in advanced packaging technology is intensifying, with companies pouring substantial investments into the field, resulting in a landscape of vigorous competition. Various packaging technologies have emerged, with notable offerings from industry giants such as TSMC, Intel, and Samsung.

TSMC introduced 3DFabric, an integration of its TSMC-SoIC front-end technology with CoWoS and InFO back-end technologies, providing maximum flexibility for diverse innovative product designs.

Intel, on the other hand, features its 2.5D EMIB and 3D Foveros packaging technologies. EMIB is applied in the connection of logic chips and high-bandwidth memory, as seen in the Intel Xeon Max series and Intel Data Center GPU Max series.

Foveros allows top dies to overcome size limitations and accommodate more top and base dies, connected through copper pillars to reduce potential interference from through-silicon vias (TSVs).

Samsung also exhibits strong competitiveness in advanced packaging, with its 2.5D I-Cube4 and H-Cube, along with 3D X-Cube packaging technologies, achieving breakthroughs in multi-chip interconnects and integration.

Samsung’s I-Cube4, for example, integrates four HBM stack dies and one core compute IC on the silicon interposer layer, while H-Cube enhances packaging area through the stacking of HDI PCBs to accommodate designs with six or more HBM stack dies.

Advantages of the Three Giants

In recent years, the three semiconductor giants have directed substantial capital expenditure towards advanced packaging. Their diverse technological developments and marketing strategies are poised to ignite a global battle in the semiconductor advanced packaging industry.

TSMC holds the advantage with its dominant wafer process technology and an end-to-end comprehensive service approach. Coupled with Taiwan’s robust semiconductor ecosystem, TSMC leads the way in the advanced packaging domain.

Intel, while slightly trailing TSMC in advanced process technology, matches it in advanced packaging capabilities. Emphasizing flexible foundry services, Intel allows clients to mix and match its wafer manufacturing and packaging offerings. With manufacturing facilities scattered worldwide, Intel leverages geographic advantages, particularly in Western countries, to expand capacity and services, leading to anticipated gains in the future.

Samsung, like TSMC, offers end-to-end services, but its packaging technology lags behind TSMC’s. It secures a share in constrained supply situations. Notably, Samsung, in June 2022, was ahead of TSMC in unveiling the innovative GAA 3nm process, and is poised to combine it with 3D packaging technology, potentially marking a pivotal point in the next semiconductor generation.

With semiconductor technology’s continuous evolution and surging market demand, the competition among the three giants in advanced packaging will remain fierce. While wafer fabs currently prioritize processes, the next three to five years are expected to witness a gradual shift towards advanced packaging. Different packaging technologies and marketing strategies will ultimately determine companies’ positions and influence in the market.

(Photo credit: TSMC)

Read more:

• An In-Depth Explanation of Advanced Packaging Technology: CoWoS
• ASE, Amkor, UMC and Samsung Getting a Slice of the CoWoS Market from AI Chips, Challenging TSMC

In recent times, Transsion Holdings, often referred to as the “African King” in the smartphone industry, has voluntarily disclosed a performance forecast on its official website. According to estimates from its financial department, Transsion is projected to achieve a net profit attributable to the parent company owner of approximately 1.58 billion Chinese Yuan (CNY) in the second quarter of 2023, marking a substantial 84% increase compared to the same period in 2022.

Perspective from TrendForce:

• Improved conditions in certain regional markets have facilitated Transsion’s growth, though the growth rate is approached with caution.

In contrast to most Chinese brands that primarily target the domestic market, Transsion has maintained a sales focus on overseas markets. Building on its pioneering advantage by being among the first to enter the African market, Transsion established its position as the market leader. To mitigate the risks associated with dependence on a single market, the company also expanded into emerging markets like India. This strategic approach has contributed to Transsion’s potential for profit growth this time.

Based on the disclosed information, Transsion attributes the increase in profitability primarily to improvements in emerging markets’ economic conditions, leading to increased product sales. However, from a market perspective, the internally estimated 84% growth rate might be based on a relatively optimistic scenario.

Further analysis suggests that the term “emerging markets” here likely refers not to the Middle East and Africa, which have historically represented a significant portion of Transsion’s revenue, but more likely points to the Indian market.

Despite adjustments made by the World Bank and the International Monetary Fund (IMF) in their economic outlooks for the Middle East and Africa, factors like high inflation in countries such as Turkey in the Middle East and Egypt in North Africa have weakened consumer purchasing power. In such an economic environment with declining growth, consumers are likely to feel pessimistic about their future disposable income, resulting in reduced non-essential expenditures such as buying smartphones.

In the case of the Indian market, it has benefited from an economic recovery following a slowdown caused by the pandemic, coupled with a trend of foreign investment shifting away from China as a manufacturing hub. Increased exports have driven GDP growth in India, translating to higher disposable incomes for consumers.

However, despite the seemingly promising outlook for India’s smartphone market, competition is fierce, with brands like Samsung and Xiaomi already occupying a significant market share. As a newcomer to the market, Transsion faces challenges in achieving substantial performance growth amid this intense competitive landscape.

• China remains the largest market for smartphones, indicating short-term market recovery remains challenging.

Transsion’s focus on expanding into overseas markets outside of China has opened doors for potential growth. When examining global smartphone revenue by regional markets, China still reigns as the largest single-country market, contributing nearly a quarter of the company’s revenue. However, a closer look at China’s recent macroeconomic performance reveals a youth unemployment rate surpassing 20%, reaching a staggering 21.3%.

Given the rising unemployment rate, it can be inferred that consumers may hold pessimistic expectations for their future disposable income. Moreover, as the smartphone market matures and innovation becomes scarce, the lack of growth momentum in China’s market suggests that the overall smartphone market may continue to struggle to recover in the short term.

(Photo credit: Transsion)