Samsung


2023-09-13

After the iPhone 15 Series Debut, Will a Foldable Phone Be Apple’s Next Step?

TrendForce’s latest insights reveal that by 2023, shipments of foldable smartphones could skyrocket to an impressive 18.3 million units, marking a 43% YoY surge. However, this only captures a slim 1.6% of the year’s total smartphone market. Fast forward to 2024, and we’re looking at another le...

2023-09-12

[News] Apple’s 5G Chip Dreams Crushed, TSMC Wins Big

According to the news from ChinaTimes, Qualcomm announced on the 11th that it has reached a three-year agreement with Apple to supply 5G communication chips for Apple's smartphones from 2024 to 2026. This also implies that Apple's efforts to develop its own 5G modem chips may fall through, and the c...

2023-09-05

[News] Taiwan Micron Focuses on HBM Advanced Process and Packaging

According to Taiwan's TechNews report, Lu Donghui, Chairman of Micron Technology Taiwan, stated that in response to the growing demand in the AI market, Micron Technology Taiwan will continue to invest in advanced processes and packaging technologies to produce High Bandwidth Memory (HBM) products. ...

2023-08-31

Understanding Chiplets, SoC, and SiP: Why TSMC, Intel, Samsung Invest?

Semiconductor process technology is nearing the boundaries of known physics. In order to continually enhance processor performance, the integration of small chips (chiplets) and heterogeneous Integration has become a prevailing trend. It is also regarded as a primary solution for extending Moore's L...

2023-08-23

[News] TSMC Faces Capacity Shortage, Samsung May Provide Advanced Packaging and HBM Services to AMD

According to the Korea Economic Daily. Samsung Electronics' HBM3 and packaging services have passed AMD's quality tests. The upcoming Instinct MI300 series AI chips from AMD are planned to incorporate Samsung's HBM3 and packaging services. These chips, which combine central processing units (CPUs), ...

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