According to the Korea Economic Daily. Samsung Electronics' HBM3 and packaging services have passed AMD's quality tests. The upcoming Instinct MI300 series AI chips from AMD are planned to incorporate Samsung's HBM3 and packaging services. These chips, which combine central processing units (CPUs), ...

In recent market speculations, TSMC is rumored to have reduced its 8-inch wafer manufacturing quotes by as much as 30%, with subsequent reports suggesting that South Korean wafer foundries are following suit in lowering 8-inch wafer production prices. According to TrendForce's channel check, TSMC...

Intel Corporation today announced that it has mutually agreed with Tower Semiconductor to terminate its previously disclosed agreement  to acquire Tower due to the inability to obtain in a timely manner the regulatory approvals required under the merger agreement, dated Feb. 15, 2022. In accordance...

As per a report from Taiwan's TechNews," TSMC, Samsung, and Intel have been actively deploying Backside Power Delivery Network (BSPDN) strategies recently, and have announced plans to incorporate BSPDN into their logic chip development roadmap. For instance, Samsung intends to implement BSPDN techno...

When Apple unveiled its inaugural wearable device, the Vision Pro, in June this year, CEO Tim Cook remarked, "Apple Vision Pro introduces us to spatial computing." The era of spatial computing entails redefining how users interact with digital content within the context of the real world. Apple's...