Samsung’s foundry business has been facing difficulties with its advanced chip processes, particularly with its 3-nanometer production. According to a report from The Korea Times, the yield for Samsung’s 3nm process remained in the single digits until Q1 this year, causing delays in supplying engineering samples for its Exynos 2500 chipsets.

The same report notes that local analysts estimate Samsung’s yield for its 3-nanometer process improved to about 20% in the second quarter. Despite this progress, the yield rate is still significantly below the 60% threshold generally needed for mass production, creating challenges for the company in securing foundry orders.

Reflecting this situation, Samsung appears to have shifted its strategy for its newest facility, the P4 fab in Pyeongtaek, Gyeonggi Province. Instead of initially installing equipment for NAND and then moving to foundry products, Samsung is now prioritizing advanced DRAM memory production, such as high-bandwidth memory (HBM) chips. Industry sources cited by The Korea Times suggest that this shift comes as a result of weak demand for its foundry services. There is growing speculation that Samsung might even dedicate the P4 fab entirely to memory chip production, driven by the steady demand for HBM and other advanced memory types used in AI servers.

These developments also cast uncertainty on Samsung’s investment in its Taylor, Texas plant. The company had originally planned to begin mass production of 4-nanometer chips there next year, but this has now been pushed back to 2026. Although the yield for the 4nm process is reportedly stable, Samsung continues to face challenges in securing orders from fabless companies.

This situation has led to speculation that Samsung may pivot to focusing on more advanced 2-nanometer chips instead of 4-nanometer ones to attract orders for next-generation products. However, reports indicate that the company is also struggling to achieve high yields for both its 2nm and 3nm processes.

Low yields have been a key factor behind Samsung’s ongoing struggles in its foundry business, according to industry insiders cited by The Korea Times. While the company has managed to stabilize yields for its 4nm process, more advanced nodes like the second-generation 3nm and 2nm processes remain problematic.

Adding to the challenges, a report from Business Korea on September 11th highlighted that continued yield issues with the 2nm process have prompted Samsung to withdraw personnel from its Taylor, Texas plant, marking another setback for its advanced wafer foundry ambitions.

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• [News] Samsung’s 2nm Yield Rate at Most 20%, Withdraws Personnel from Texas Taylor Plant

(Photo credit: Samsung)

In recent years, the U.S., Japan and the Netherlands, have increasingly expanding restrictions on China in semiconductor technology. South Korea, on the other hand, has been cautiously responding to U.S. demands due to its significant dependence on the Chinese market.

Yet, according to a report by South Korean media outlet The Korea Herald, the U.S. is increasing pressure on South Korea to comply with its export controls to China.

At the Korea-U.S. Economic Security Conference 2024 held in Washington, D.C. on September 10th, U.S. Commerce Department Undersecretary Alan Estevez called on South Korea’s two leading HBM manufacturers, Samsung and SK hynix, to align with U.S. export controls on China. He urged that their production capacity be reserved for supplying advanced chips to allied nations, rather than competitors such as China.

Estevez emphasized his appreciation for South Korea’s long-standing cooperation with the U.S., but pointed out that since AI can be used for military purposes, it is crucial to prevent China from acquiring advanced chips to train AI models.

South Korea’s Trade Minister Cheong In-kyo responded that while they will discuss the matter with the U.S., export controls have a significant impact on South Korea’s businesses and economy.

Some industry sources cited by The Korea Herald have further pointed out that the direct export volume of chips from Samsung and SK hynix to China is not significant, so the actual impact may be limited.

However, per a previous Reuters report cited sources, it’s indicated that about 30% of Samsung’s HBM chip sales in the first half of this year were to China.

The Korea Institute for Industrial Economics and Trade noted that, unlike Japan and the Netherlands, South Korea cannot fully align with U.S. export control measures due to its significant reliance on exports to China.

Per the Chosun Daily citing data from South Korea’s Ministry of Trade, Industry, and Energy and the Korea International Trade Association, it’s shown that in July of this year, South Korea’s exports to China increased by 14.9% year-on-year to USD 11.4 billion, the highest since October 2022. Notably, memory exports surged 89% year-on-year to USD 6.8 billion.

Semiconductor exports saw particularly strong growth, with chip exports rising 49% year-on-year. In June this year, Korea’s memory exports also amounted to USD 8.8 billion, accounting for 65.8% of total semiconductor exports, which reportedly represents the highest proportion in two years since December 2021.

These figures reflect South Korea’s robust performance in the chip sector and the strong demand from the Chinese market for Korean semiconductors and other ICT products.

Meanwhile, due to the U.S.’s strict restrictions on chip manufacturing technology, China is striving for breakthroughs in the HBM field.

The HBM market is currently dominated by South Korea’s SK hynix, Samsung Electronics, and the U.S.’s Micron, all of which are producing the latest standard HBM3 chips.

However, a report from Tom’s Hardware, citing industry sources, has indicated that Chinese companies, including CXMT, have made progress in developing HBM and are in the early stages of production. Huawei is also collaborating with other Chinese companies, with plans to produce HBM2 chips by 2026.

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• [News] ChangXin Memory Technologies in China Has Reportedly Begun Mass Production of HBM2
• [News] Progress Made in Chinese Consortium’s Development of HBM, Reportedly Targeting HBM2 Production by 2026

(Photo credit: Samsung)

ACM Research, Inc., a provider of wafer processing solutions for semiconductor and advanced wafer-level packaging applications in China, announced on September 3rd the release of its Ultra C bev-p panel bevel etching tool for fan-out panel-level packaging (FOPLP) applications.

This new tool is designed for bevel etching and cleaning in copper-related processes, offering dual-side bevel etching for both the front and back of panels within a single system, further boosting process efficiency and enhances product reliability.

Moreover, a day after the announcement, the company further revealed that it had received purchase orders for four wafer-level packaging tools, including two from a U.S.-based customer and two from a U.S.-based research and development (R&D) center.

Dr. David Wang, ACM’s president and chief executive officer, believes that FOPLP will grow in importance as it addresses the evolving needs of modern electronic applications, offering benefits in integration density, cost efficiency, and design flexibility.

Reportedly, the new Ultra C bev-p tool is designed to deliver advanced performance, utilizing ACM’s expertise in wet processing. It is one of the first tools to incorporate double-sided bevel etching for horizontal panel applications.

Together with the Ultra ECP ap-p for electrochemical plating and the Ultra C vac-p flux cleaning tools, the Ultra C bev-p is expected to support the FOPLP market by enabling advanced packaging on large panels with high-precision features.

ACM emphasizes that the Ultra C bev-p tool is a critical enabler for FOPLP processes, employing a wet etching technique tailored for bevel etching and copper residue removal.

This process plays a vital role in preventing electrical shorts, reducing contamination risks, and preserving the integrity of subsequent processing steps, ensuring long-term device reliability. The tool’s effectiveness is driven by ACM’s patented technology, designed to tackle the specific challenges of square panel substrates.

Different from traditional round wafers, ACM’s design is said to ensure precise bevel removal process that stays confined to the bevel region, even on warped panels. This is essential for maintaining the integrity of the etching process while ensuring the high performance and reliability needed for advanced semiconductor technologies.

Currently, major players in the FOPLP advanced packaging field include Powertech Technology, ASE Group, SPIL, TSMC, Innolux, JSnepes, and Samsung Electro-Mechanics.

TrendForce points out that FOPLP technology presents advantages and disadvantages. Its main strengths are lower unit cost and larger package size, but as its technology and equipment systems are still developing, the commercialization process is highly uncertain.

It is estimated that the mass production timeline for FOPLP in consumer IC and AI GPU may fall between the second half of 2024 to 2026, and 2027-2028, respectively.

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• [News] ACM Research Steps into FOPLP Advanced Packaging Field
• [News] TSMC Reportedly Forms a Team on FOPLP Development, with Mini Line on the Road 

(Photo credit: ACMR)

While Samsung Electronics is said to be delivering an oversea workforce cut up to 30%, a report from Korean media outlet Business Korea on September 11th has added that persistent issues with its 2nm yield rate have led Samsung to decide to withdraw personnel from its Taylor, Texas plant, signaling another setback for its advanced wafer foundry business.

Originally envisioned as a mass production hub for advanced processes below 4nm, the Taylor facility’s strategic location near major tech companies was intended to attract U.S. clients. However, despite rapid development, Samsung continues to face 2nm yield issues, resulting in performance and production capacity falling short of its main competitor, TSMC.

Reportedly, Samsung’s wafer foundry yield is below 50%, particularly in processes below 3nm, while TSMC’s advanced process yield is around 60-70%. This gap has widened the market share difference between the two companies.

As per a report from TrendForce, TSMC held a 62.3% share of the global wafer foundry market in the second quarter, while Samsung’s market share was only 11.5%.

Industry sources cited by Business Korea further added that Samsung’s Gate-All-Around (GAA) yield is around 10-20%, which is insufficient for handling orders and mass production. Such yields have forced Samsung to reconsider its strategy and withdraw personnel from the Taylor plant, leaving only a minimal number of staff.

Samsung Electronics had signed a preliminary agreement to receive up to KRW 9 trillion in subsidies from the U.S. Chips Act. However, a key condition for receiving the funding is that the plant must operate smoothly, and Samsung’s current difficulties put this agreement at risk.

Reportedly, Samsung Chairman Lee Jae-Yong personally visited major equipment suppliers like ASML and Zeiss, hoping to achieve breakthroughs in process and yield improvements. However, there have been no significant results so far, and it remains uncertain when personnel might be reassigned back to the Taylor plant.

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• [News] Samsung Reportedly Buckling Under Pressure, with Plans to Cut Overseas Workforce by Up to 30%
• [News] Samsung Signals Will to Collaborate with Other Foundries on Basedie

(Photo credit: Samsung)

According to a report from Reuters citing sources, Samsung Electronics, the global leading manufacturer of smartphones, TVs, and memory, is said to be cutting up to 30% of its overseas workforce in certain departments.

Per the same report, sources revealed that Samsung has instructed its global subsidiaries to reduce sales and marketing staff by around 15% and management personnel by as much as 30%. The plan, set to be implemented by the end of this year, will affect jobs across the Americas, Europe, Asia, and Africa.

Additionally, other industry sources reportedly confirmed Samsung’s global layoff plan as well. However, details about the extent of the layoffs remain confidential, making it unclear how many employees will be affected and which countries or business units will be hit the hardest.

Amid these rumored layoffs, Samsung is grappling with increasing pressure on its key departments. In May, the company replaced the head of its semiconductor division to tackle the ongoing chip crisis, as it strives to catch up with competitor SK hynix in supplying high-end memory used in AI chipsets.

In the premium smartphone market, Samsung faces fierce competition from Apple and China’s Huawei, while it has also lagged behind TSMC in chip manufacturing.

A source pointed out that the layoffs are aimed at addressing the slowdown in global tech product demand due to the global economic downturn. Another source, however, mentioned that Samsung is looking to boost profits by cutting costs.

Per Reuters, Samsung has noted in a statement, claiming that some workforce adjustments in its overseas operations are routine measures aimed at improving efficiency. The company stated that these plans do not have specific targets and added that production staff would not be affected.

According to Samsung’s 2024 sustainability report, as of the end of 2023, the company employed 267,860 people, with over half (147,104 employees) located overseas. The report indicated that the majority of jobs were in manufacturing and development, with 25,136 employees in sales and marketing, and 27,887 in other areas.

Other sources cited by Reuters revealed that the global directive for layoffs was issued about three weeks ago. Samsung’s India operations have already offered severance packages to some mid-level employees who have left in recent weeks, with the total number of employees expected to leave the Indian subsidiary potentially reaching 1,000.

Samsung employs around 25,000 people in India, where the company generates an annual revenue of approximately USD 12 billion. Wage strikes are currently disrupting production in the country.

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• [News] Samsung Partners with TSMC, Its Foundry Rival, on HBM4 Development
• [News] Samsung Signals Will to Collaborate with Other Foundries on Basedie

(Photo credit: Samsung)