China has been in the spotlight lately with its breakthroughs in semiconductors. Following the buzz that SMIC is said to produce 5nm chips for Huawei this year, Xiaomi is rumored to have taped out its first 3nm SoC. China’s efforts can also been seen by the surge of semiconductor patent applicatio...

Recently, TSMC updated the progress of the expansion of its sub-2nm advanced process. On September 11, Hsu Mao-hsin, Director-General of Taiwan’s Central Taiwan Science Park Administration, announced the expansion of the Taichung Phase 2 park. Currently, 95% of the land required for TSMC’s pl...

In recent years, the U.S., Japan and the Netherlands, have increasingly expanding restrictions on China in semiconductor technology. South Korea, on the other hand, has been cautiously responding to U.S. demands due to its significant dependence on the Chinese market. Yet, according to a report b...

At its 2024 semi-annual results briefing, Loongson Zhongke Technology announced that the 3B6600 processor is expected to begin sampling in the first half of next year and be officially released in the second half. Per a report from IThome, Chairman and General Manager Hu Weiwu emphasized that thi...

ACM Research, Inc., a provider of wafer processing solutions for semiconductor and advanced wafer-level packaging applications in China, announced on September 3rd the release of its Ultra C bev-p panel bevel etching tool for fan-out panel-level packaging (FOPLP) applications. This new tool is de...