Source to China Times, the International Semiconductor Industry Association (SEMI) forecasts that from 2023 to 2026, the global semiconductor industry will add 12 new 8-inch wafer fabs, with 8-inch fab monthly production capacity increasing by 14% to a historic high of 7.7 million wafers. In response, UMC stated that from a supply and demand perspective, capacity growth still lags behind demand growth. UMC emphasized that it remains optimistic about the future of the 8-inch wafer market, thanks to ongoing advancements in special processes and differentiation.

SEMI notes that the continuous rise in the penetration rate of electric vehicles (EVs) worldwide is driving substantial growth in the demand for inverters and charging stations. The future mass adoption of EVs is the primary driver for increased investments in 8-inch fabs and the continued expansion of global 8-inch fab capacity.

Examining the situation of new 8-inch fabs in various countries, Southeast Asia will see the largest capacity increase, with a growth rate of approximately 32%. SEMI predicts that China’s 8-inch fab capacity will follow, with an increase of about 22%, reaching a monthly production capacity of 1.7 million wafers. The United States, Europe, the Middle East, and Taiwan are expected to have growth rates of approximately 14%, 11%, and 7%, respectively.

SEMI reports that by 2023, China’s 8-inch fab capacity will account for approximately 22% of the global total, with Japan at around 16%, Taiwan at around 15%, and Europe, the Middle East, and the United States each at about 14%. Furthermore, to meet future market demand, suppliers such as Bosch, Infineon, Mitsubishi, Onsemi, and STMicroelectronics are accelerating their 8-inch fab capacity expansion. It is estimated that from 2023 to 2026, the 8-inch fab capacity for automotive and power semiconductors will increase by 34%.

Concerns have been raised about potential oversupply as global 8-inch fabs expand, but UMC, a major semiconductor foundry, states that given the current rate of 8-inch fab expansion worldwide, the increase in capacity is relatively modest compared to demand. From a supply and demand perspective, it is certain that capacity growth will not keep pace with the growing global demand for 8-inch wafers.

UMC further notes that while 8-inch fabs are increasing, demand is unlikely to remain stagnant. Currently, the majority of semiconductor fabs being built worldwide are 12-inch fabs, making the expansion of 8-inch fabs relatively limited, and the supply-demand balance has not worsened.

(Source: https://www.chinatimes.com/newspapers/20230922000218-260204?chdtv)

Report to Liberty Times Net, In a joint statement on the comprehensive strategic partnership between the United States and Vietnam, the two countries highlighted Vietnam’s significant potential to become a key player in the semiconductor industry. The United States expressed its support for the rapid development of Vietnam’s semiconductor ecosystem. To foster the development of human resources in the semiconductor industry, the United States will provide a $2 million seed fund, with future investments coming from the Vietnamese government and the private sector. These initiatives are seen as a significant step forward for Vietnam in its journey to join the global semiconductor industry.

U.S. census data showed semiconductor imports from Vietnam surged by 75% to $562.5 million in August compared to the same period last year, capturing approximately 11.6% of the market share. However, experts point out that considering the entire supply chain, Vietnam’s contribution remains relatively small.

Semiconductor manufacturing involves three fundamental stages: design, fabrication, and packaging. Since Intel’s Ho Chi Minh City factory is its primary production facility, Vietnam is primarily involved in the final packaging stage of semiconductor production, which represents the lowest value-added segment of the supply chain. According to data from the Semiconductor Industry Association (SIA), packaging accounts for only 6% of the chip’s value. Additionally, Korean semiconductor design companies are following Samsung’s lead by establishing factories in Vietnam, including CoAsia in Hanoi and Amkor in Bac Ninh province.

Shortage of Engineers in Vietnam Poses a Major Challenge

A shortage of packaging and design engineers poses a significant challenge for Vietnam. The country lacks the capacity for domestic semiconductor manufacturing. Currently, Vietnam has over 5,500 semiconductor design engineers, while Intel’s Ho Chi Minh City factory has shipped over 3 billion chips to date. The supply chain ecosystem of American giants is gradually taking shape in Vietnam. However, with just over 5,000 engineers, Vietnam remains a distant bridge to this multi-billion-dollar industry.

Vietnam faces two choices for industry growth: expanding its manufacturing sector or enhancing skills and value in the design and packaging phases. Experts suggest that Vietnam has chosen the latter. However, the shortage of personnel poses a barrier to Vietnam’s ambitions to increase the value of its semiconductor supply chain.

According to estimates, the semiconductor industry needs to cultivate 10,000 engineers annually, but Vietnam’s current rate is less than 20%. In fact, according to a report by the Vietnam Microchip Association, the number of engineers only increases by about 500 people each year. Currently, most of Vietnam’s semiconductor engineers work for foreign companies.

(Source: https://ec.ltn.com.tw/article/breakingnews/4432014)

According to the news from ChinaTimes, the semiconductor market is experiencing a slowdown, with Taiwan’s three major mature process wafer foundries UMC, VIS, and PSMC all reporting reduced revenues in August. VIS and UMC both posted lower revenues compared to the previous month, while PSMC managed a slight 1.2% monthly increase in August. However, this increase still falls within this year’s relatively low range. Industry experts anticipate that the semiconductor industry will maintain a subdued market outlook in the latter half of this year, with a potential recovery likely delayed until the first half of the next year.

The semiconductor industry began its correction in the second half of last year. Initially, there was optimism for inventory adjustments to conclude within four quarters by the end of this year’s second quarter, anticipating a demand rebound in the latter half of the year. However, since the second quarter, semiconductor manufacturers have grown pessimistic due to slower downstream inventory depletion and weak end-user demand. This is reflected in third-quarter revenues for mature process wafer foundries, which are expected to remain flat or slightly decline based on August revenues. A robust recovery in the fourth quarter is unlikely, suggesting that industry-wide recovery is likely postponed until the first half of next year.

UMC saw consecutive monthly revenue growth from February to July. However, following five consecutive increases, the company experienced a slight decrease in revenue in August. TSMC previously stated in a conference that the current market recovery falls short of expectations, with an unclear outlook for wafer demand. It anticipates a 3~4% quarter-on-quarter decrease in wafer shipments in the third quarter, which aligns with the market’s expectations for a slight decline in August revenue.

UMC forecasts a 3~4% quarter-on-quarter decrease in wafer shipments in the third quarter, a 2% quarter-on-quarter increase in the average wafer price in USD, a low single-digit percentage decrease in the average gross margin, and an approximate 65% capacity utilization rate. Overall, industry insiders expect TSMC to face slight downward pressure on third-quarter revenue.

VIS reported July revenue reaching NT$3.596 billion, marking a new high for the first seven months of the year. However, its August revenue showed a decline, with a 2.23% month-on-month decrease to NT$3.516 billion. This is significantly different from the typical revenue growth momentum observed during the third-quarter peak season in previous years. Cumulative revenue for the first eight months of this year also decreased by 34.54% compared to the same period last year.

VIS anticipates a 4~6% quarter-on-quarter increase in wafer shipments in the third quarter, with a capacity utilization rate similar to that of the second quarter, around 60%. The average selling price (ASP) is expected to remain stable. However, due to increased production costs and depreciation expenses, the gross margin is estimated to decline to 25~27% in the third quarter, putting more pressure on profitability compared to revenue.

As for PSMC, although its August revenue saw a slight 1.2% month-on-month increase, the company has maintained around NTD 3.4 billion in monthly revenue from June to August, which is considered a low level compared to the second quarter when monthly revenue was approximately NTD 3.8 billion. The third quarter is expected to continue to exert downward pressure on revenue compared to the previous quarter. The company has also previously stated that it does not rule out the possibility of a quarterly loss in its core business during the third quarter.

(Source: https://www.chinatimes.com/newspapers/20230911000124-260202?chdtv)

According to the news from Mydrivers.com, TSMC announced its ambitious plans for constructing cutting-edge 4nm and 3nm chip fabs in the United States. The move is expected to generate tens of thousands of job opportunities in the US job market. However, TSMC’s timeline for commencing production at its inaugural 4nm fab has been pushed back from 2024 to 2025. The attributed cause behind this delay is the insufficient availability of skilled American workers, causing setbacks in equipment installation.

This situation has led to a heated dispute between TSMC and local labor unions. TSMC’s assertion of a skilled worker deficit in the US has sparked disagreement from the unions. They assert that TSMC’s stance is a pretext for bringing in lower-wage overseas labor to vie for domestic employment opportunities. TSMC, on the other hand, refutes these claims, emphasizing that employing local staff on assignment doesn’t undermine their US-based operations or recruitment efforts.

Apart from the skill-related quandary, the delay in TSMC’s factory plans may have an underlying factor – the scorching conditions in Phoenix, Arizona. Sources report that the city has experienced an unbroken streak of over 20 days with temperatures hovering around 43 degrees Celsius. Notably, this heat wave has raised internal questioning within TSMC about the wisdom of selecting a desert-adjacent location for their facility.

According to this industry insider, the intense heat seemingly played a role in impeding progress. The sweltering climate of over 40 degrees Celsius undoubtedly hampers worker productivity, particularly for outdoor tasks.

The informer indicated that TSMC had an alternative option when choosing a location for its US facility. Aside from Arizona, they could have set up shop in Portland, the capital of Oregon, which is also a hub for the semiconductor industry. However, TSMC’s rationale for settling in Arizona remains undisclosed.

Notably, Phoenix, Arizona, is also a focal point for Intel’s chip investments, with the company injecting 20 billion USD into the establishment of new wafer fabs over the past couple of years.

(Source: https://news.mydrivers.com/1/928/928753.htm)

Major economies are investing heavily in semiconductor industries, with China leading at $143 billion, the U.S. at $52.7 billion, and the EU at $47 billion, according to “EE Times”. India plans to give $922 million amid U.S.-China tensions.

Despite China’s much larger subsidies compared to India’s, the Chinese semiconductor industry faces various challenges. But under mainly from the United States, to slow down its progress, some Chinese companies are struggling to survive, while others are shutting down. For instance, after OPPO’s unexpected announcement in May to close their IC design company ZEKU, active for less than 4 years, Holding Group, Geely, also declared on August 8th that it would halt its self-developed chip business through the Xingji Meizu group, only 5 months after its launch.

According to a recent report from ‘EE Times,’ governments from around the world are actively pursuing semiconductor self-sufficiency to meet their high-tech and communication needs. China, in particular, has taken the lead by planning a substantial $143 billion subsidy program to boost its industry and reduce dependence on the United States.

In the U.S., the ‘Chips ACT’ passed last year allocated $52.7 billion in subsidies. As per McKinsey, the cumulative commercial investments related to this endeavor have already exceeded $200 billion.

The European Union is also making its mark, aiming to increase its global semiconductor market share from 10% to 20% by 2030. The ‘European Chips Act’ is expected to see $47 billion in government investment. TSMC has confirmed plans to establish a factory in Germany and is expected to receive relevant subsidies.

Singapore is projecting a $19 billion subsidy for its semiconductor industry, while Japan’s exact subsidy scale remains unknown, with reports suggesting a minimum of $6.5 billion. South Korea is focusing on tax reductions for semiconductor-related companies, offering 15% tax credits for corporate groups and up to 25% for small and medium-sized enterprises.

Recently, the UK and India have joined the battle. The UK has set aside a $1.5 billion subsidy, and India’s ‘Semicon India’ initiative offers at least $922 million to bolster its influence in the global electronics supply chain. While Malaysia hasn’t disclosed the amount of support for its chip industry, the country is providing approved priority industries, especially high-tech firms, with a full 10-year tax exemption. The government also offers investment subsidies and various incentives within specific investment zones.

Amidst U.S. restrictions, China initially aimed to boost its chip industry and create its own ‘China chips.’ However, setbacks have occurred. OPPO’s IC design company, ZEKU, formed in 2019, spent a staggering $44 billion over three years only to shut down on May 12th, leaving 3,000 employees jobless. Geely Holding Group’s subsidiary, Xingji Meizu, also announced on August 8th their decision to halt self-developed chip operations due to global economic uncertainties. Their focus will now turn to product innovation and software user experiences.

(Source: https://ec.ltn.com.tw/article/breakingnews/4392195)