semiconductor


2023-05-09

Samsung Starts the Foundry Battlefield with a Saying of Surpassing TSMC in 5 Years

Samsung recently announced that they will ahead of TSMC in the foundry market within 5 years. At the same time, Intel also claimed to become the second-largest player in the market before 2030. Currently, both Samsung and TSMC are adapting 3nm process to do the chip manufacturing, with the technology of GAA(Samsung) and FinFET(TSMC) respectively.

Samsung sees GAA technology as a crucial key to surpassing TSMC. Currently, Samsung’s 4nm lags behind TSMC by about 2 years, and its 3nm is about a year behind. However, this situation will change when TSMC turns to 2nm. Industry insider sources indicate that TSMC plans to use GAA technology in 2nm process, and Samsung believes that they can seize the chance to catch up with TSMC since TSMC may have a hard time when turning to 2nm process.

Industry insiders have revealed that AMD has shifted some of its 4nm CPU chip orders from TSMC to Samsung. It is reported that AMD has signed an agreement with Samsung to manufacture some of its mobile SoC by using Samsung’s 4nm node, and Samsung may also manufacture AMD’s Chromebook APU.

The Fight in the Foundry Market is On

According to TrendForce, the top 10 global foundry players in 4Q22 with TSMC account for 58.5% of market share by revenue, far ahead of Samsung’s 15.8%. Industry insiders suggest that Samsung still has a long way to go to catch up with TSMC. Some sources say that TSMC’s 2nm process will be mass-produced as scheduled in 2025, while Samsung’s plans are still to be observed.

Intel is also striving for the top spot in the wafer foundry market. Since the beginning of 2021, Intel has implemented a series of measures in its foundry business after announcing its “IDM 2.0” strategy. Last July, Intel stated that it will manufacture chips for MediaTek, and the first batch of products will be produced within the next 18 to 24 months using more mature manufacturing technology (Intel 16). In addition, Intel said that Qualcomm and Nvidia are also interested in having them manufacture their chips. To regain its leading edge in chip manufacturing, Intel has unveiled its 5 process technology stages to be launched in the next few years, including 10nm, 7nm, 4nm, 3nm, and 20A.

And TSMC has no competitive relationship with their clients by not doing the wafer design, apparently, this is also a significant advantage for TSMC and other foundry manufacturers. In recent years, more companies have recognized the importance and highly profitable nature of foundry manufacturing, leading to the independent establishment of foundry manufacturing operations. Samsung and Intel have also followed this trend, as foundry manufacturing can optimize production technology and provide major companies with more opportunities for trial and error.

2023-03-17

U.S. Government to Target 28nm Processes in Next Phase of Export Regulations

On October 7, 2022, the U.S. government imposed export regulations restricting China’s access to semiconductor technology. In particular, the sanctions pertained to manufacturing equipment required in the production of 16nm/14nm or more advanced logic chips (FinFet, GAAFET), 18nm or more advanced DRAM chips, and NAND Flash with 128 or more layers. It’s evident that the U.S. intends to restrict China’s semiconductor manufacturing to 1Xnm. Moving forward, 28nm processes are likely to be included in the next set of regulations as some equipment used in manufacturing 28nm nodes can also be utilized in more advanced processes.

TrendForce predicts that upcoming U.S. export regulations will further focus on 28nm processes. Not only can 28nm manufacturing equipment be used in more advanced processes, but tight restrictions have forced Chinese companies to focus their efforts on expanding their 28nm operations. 28nm processes can be used to produce a large variety of other products: SoCs, ASIC AI chips, FPGAs, DRAMs, NAND Flash, ISPs, DSPs, Wi-Fi chips, RF components, Driver ICs, MCUs, CISs, DAC/ADC chips, PMICs, and other core components in a wide range of applications. If the U.S. allows Chinese companies to accelerate the expansion of their 28nm processes, China’s importance in the supply chain for terminal products will continue to climb — ultimately setting back the U.S’s efforts to decouple itself from China.

China still unable to fully manufacture 28nm chips domestically as expansion exhibits signs of slowing down

China cannot fully rely on domestic production for their 28nm semiconductors. If the U.S. chooses to move forward with restricting China’s access to 28nm manufacturing equipment, expansion will surely grind to a halt. China currently possesses equipment that is able to clean, backgrind, etch, and sediment for 16nm/14nm or more advanced processes. However, this is not enough for China to achieve semiconductor autonomy. Semiconductor manufacturing is relatively complicated as it involves thousands of processes; Chinese factories are only involved in a few of the processes — the majority of which depend on American and Japanese factories. All in all, with China’s semiconductor industry largely focused on 28nm/40nm and more mature processes, it will be difficult for them to achieve semiconductor autonomy for processes more advanced than 28nm by 2028.

2023-02-09

[Chip War] The Latest Update of US Sanctions’ Impact on The Progress of Chinese Semiconductor Development

According to TrendForce’s latest investigation, Chinese foundries have already suspended plans to expand production capacity for advanced processes after the US government began restricting the exportation of equipment and technical support for processes related to non-planar architectures. TrendForce believes that a further tightening of the restrictions on lithography equipment will mainly affect mature processes, especially the 28nm. Chinese foundries might proceed more slowly in adding new production capacity or raising output for the 28nm process due to the prolonged reviews on their equipment purchases.

TrendForce semiconductor analyst, Joanne Chiao, said that Chinese semiconductor companies have already suspended the development of chips featuring the GAA architecture (i.e., nodes that are generally ≤3nm) after the US government began restricting the exportation of EDA tools and related technical support. If we talk about the FinFET architecture that Chinese foundries are able to produce for now, it is possible to achieve the faster computing speed of the more advanced chips by combining multiple lower-end chips. However, it might also be very challenging to raise the production yield rate of a solution that integrates multiple chips, not to mention that the power consumption of such solution might be very high as well.

Seeing the US export control, for now, US government has not imposed restrictions on the exportation of technical support for processes related to planar architectures. On the other hand, Chinese foundries might halt their advanced chip (14nm) production at any time if they encounter an equipment malfunction or another problem that requires technical support from US equipment providers.

At last, Chiao emphasized that the US sanction has definitely accelerated the development of an “all-China” semiconductor manufacturing supply chain. Nevertheless, the world’s top eight semiconductor equipment providers all come from Japan or the US. From the perspective of the foundry industry, it will be hard for China to realize a wholly or mostly native semiconductor supply chain within the foreseeable future.

2023-02-03

Oversupply Worries in Semiconductor Industry in 2023

The market started worrying about the oversupply in semiconductor 2023, when the demand will start growing again depends on two factors: the situation of the macroeconomy and the inventory status.

Since foundries’ capacity utilization rates started drop in 3Q22, chip supply as a whole has decreased significantly. This, in turn, has helped limit inventory growth across the supply chain. However, the global economy is still at risk of a mild recession, so consumers may allocate more of their spending to daily necessities. They may also spend more on tourism due to easing of the pandemic. This could lead to weak sales for consumer electronic products.

Not to mention that most consumers already purchased the electronic products that they need for working or studying at home during the pandemic. Assuming that the overall inventory level of the supply chain will return to a healthier level, TrendForce believes that chip demand will begin to rebound to a certain extent in 2Q23. Then, the demand growth will become more obvious from 3Q23 onward. Nevertheless, this demand growth may not be too strong due to uncertainties in the global economy.

If we observe the situation from the perspective of the foundry industry, smartphones represent the largest application segment in terms of wafer consumption. The smartphone supply chain started inventory correction earlier, so demand rebound might be more obvious initially for smartphone-related chips compared with chips used in other consumer devices. On the other hand, with different benchmarks, the demand for HPC chips will show more significant growth compared with the demand for smartphone chips.

2021-05-25

With Employees from TSMC and VIS Testing Positive for COVID-19, What Will Happen to the Global Supply of Chips?

Owing to an uncontrolled spread of the COVID-19 pandemic, Taiwan has instituted Level 3 restrictions throughout the island. With employees from several tech companies testing positive for the virus, major foundries, including TSMC and VIS, are successively finding positive cases among their midst as well. Worries have therefore cropped up in the global semiconductor supply chain over whether the supply of chip can remain unaffected despite the infections in Taiwan.

Taking into account Taiwan’s share of foundry capacity within the global total, the aforementioned supply chain’s worries are not without merit. According to TrendForce’s investigations, Taiwanese foundries, including TSMC, UMC, VIS, and PSMC, collectively account for about 50% of the global foundry capacity, meaning about 50% of the global supply of chips is contingent on Taiwan.

However, TrendForce also finds that, despite the domestic spread of the pandemic, which forced various companies to institute WFH policies for their employees, most semiconductor fabs are operating without interruptions at the moment, indicating that the COVID-19 pandemic has yet to impact the production and supply of chips.

As well, both TSMC and VIS have immediately made public announcements stating that their operations remain unaffected by the positive cases. However, whether the pandemic can be sufficiently managed and whether it will hinder the supply of semiconductors going forward remains to be seen.

(Cover image source: Pixabay)

  • Page 33
  • 35 page(s)
  • 175 result(s)

Get in touch with us