In August 2022, U.S. President Joe Biden signed the “Inflation Reduction Act” and the “CHIPS and Science Act,” providing over USD 400 billion in tax incentives, loans, and grants. However, according to a report from Financial Times, about 40% of the investment projects under these acts have been delayed or put on hold.

In the first year after these laws were implemented, companies announced investment projects totaling USD 220 billion. However, among these projects, around USD 84 billion of investment has now been delayed by anywhere from two months to several years, with some even being indefinitely postponed.

Notably, TSMC has delayed the mass production schedule for its second plant in Arizona by two years. The foundry giant’s local suppliers, such as Chang Chun Group, have also postponed a USD 300 million factory investment project by two years, while KPCT Advanced Chemicals has put its USD 200 million project on hold as well.

Other major investment projects that have been put on hold include LG Energy Solution’s USD 2.3 billion battery storage facility in Arizona, Italy’s Enel’s USD 1 billion solar panel plant in Oklahoma, and Albemarle’s USD 1.3 billion lithium refining plant in South Carolina.

Industry sources cited by the report reveal that the uncertainty of policies during the election year, coupled with deteriorating market conditions and slowing demand, has led the companies to alter their plans.

Specifically, the slow approval process for CHIPS Act funding and unclear rules for the Inflation Reduction Act have also hinted at delays in some investment projects.

Read more

• [News] GlobalWafers Receives USD 400 Million Subsidy from CHIPS Act to Establish New Plant in the US
• [News] TSMC Rumored to Appoint Higher-Level Executive to Accelerate Progress at U.S. Fab
  

(Photo credit: TSMC)

According to a report on the official website of the Shanghai Qingpu District’s Government on August 11th, the exterior construction and interior decoration of Huawei’s Xicen apartment project in Shanghai have been completed, and the project has entered its final stages.

The apartments are expected to be finished by the end of September this year. Once completed, the project will provide over 6,000 housing units for the influx of Huawei research talent moving to Qingpu (Shanghai). This further hints that Huawei’s largest global R&D center is getting closer to being fully operational.

The project, which started construction in December 2023, will provide ample accommodation for employees serving in the eight parks at Huawei’s Lianqiu Lake R&D Center. Once completed, it will house over 15,000 people.

Reportedly, the Huawei Lianqiu Lake R&D Center in Shanghai’s Qingpu District, was completed on July 9. It covers an area of 2,400 acres, with a total building area of 2.06 million square meters and an investment exceeding CNY 10 billion.

The center is mainly used for research, office space, and supporting facilities, including R&D offices, laboratories, conference halls, cafeterias, and data centers.

This research center, per a previous report from EE Times China, is designed with 40,000 offices and is expected to gradually attract about 35,000 Huawei R&D talents.

The focus will be on R&D, product design, and sales in areas such as 5G chips, wireless, and the Internet of Things (IoT). By the end of this year, it is anticipated that 10,000 personnel will have joined the new R&D center, primarily consisting of employees from other Huawei R&D centers and newly hired research and development talent.

Regarding Huawei’s substantial investment in building this research center, tech media outlet “Tom’s Hardware” highlighted on July 14th that amid the US-China semiconductor rivalry and various US sanctions against Huawei, the company must bolster its research and development efforts. Consolidating multiple research centers allows Huawei to streamline operations and facilitate easier collaboration among different departments.

The report states that this flagship project showcases Huawei’s investment commitment in future technologies. The new R&D Center is even said to be larger in scale than the combined size of Apple Park and Microsoft’s Redmond Campus headquarters in Seattle.

Read more

• [News] Huawei’s Largest Global R&D Center in Shanghai Unveiled, Invests Over USD 1.4 Billion
• [News] Patent War Begins – Huawei and MediaTek Go after Each Other for Patent Infringement

(Photo credit: Huawei)

Facing increased market demand and the ongoing recovery of the memory industry, a report from Korean media outlet ETNews has reported that Samsung has confirmed its investment plan for the 6th-Generation DRAM production line at the Pyeongtaek P4 plant, with the goal of starting mass production in June 2025.

Reportedly, the 6th-generation DRAM, known as ‘1c ,’ is a next-generation DRAM utilizing 10nm-class technology. Despite it is said to be a product that has not yet been commercialized in the global semiconductor industry, both Samsung Electronics and SK hynix are already preparing for mass production.

Samsung’s Pyeongtaek P4 is a comprehensive semiconductor production center, divided into four phases.

As per ETNews, Samsung plans to initiate 1c DRAM production by the end of this year. The company is said to be considering launching HBM4 using 1c DRAM in the second half of 2025.

Given that HBM consumes significantly more DRAM than traditional memory, it is speculated by the report that Samsung’s construction of the 1c DRAM production line at the Pyeongtaek P4 plant may also be in preparation for HBM4.

As per TrendForce’s latest report on the memory industry, it’s revealed that DRAM and NAND Flash revenues are expected to see significant increases of 75% and 77%, respectively, in 2024, driven by increased bit demand, an improved supply-demand structure, and the rise of high-value products like HBM.

Furthermore, TrendForce also reports that Samsung’s P4L facility will be the key site for expanding memory capacity starting in 2025, starting with NAND production. Equipment installation for DRAM is expected to begin in mid-2025, with mass production of 1c nanometer DRAM slated to commence in 2026.

Read more

• [News] Samsung Develops Custom HBM with Tech Giants, with Commercialization Expected in HBM4
• [News] Overview of Expansion Plans by HBM Giants

(Photo credit: Samsung)

According to a report by Nikkei, Japanese chip manufacturer Rapidus plans to establish a fully automated production line using robots and AI in northern Japan to produce 2nm chips for advanced AI applications, with mass production anticipated as early as 2027.

Reportedly, Rapidus claims that automated production will significantly accelerate production times, reducing chip delivery time to just one-third of that of its competitors. The company’s fab is expected to complete its external structure by October, with EUV lithography system set to arrive in December.

Compared to other companies already operating fabs, building a fully automated plant could give Rapidus a significant advantage. While the front-end of chip manufacturing are already highly automated, the back-end processes, such as packaging and testing, remain labor-intensive.

Rapidus CEO Atsuyoshi Koike stated that this approach will deliver higher performance and faster turnaround times for the same 2nm products compared to other competing chipmakers.

Per a report from Tom’s Hardware, Rapidus is currently two years behind TSMC and Samsung, both of which are expected to begin 2nm chip production in 2025. If Rapidus can deliver chips faster without compromising on price or quality, it may secure a place in the market.

Despite the optimistic outlook, Rapidus faces operational challenges. The company revealed that it will need JPY 2 trillion (approximately USD 14 billion) to begin operation in 2025, and at least JPY 5 trillion in total for the start of mass production.

Although Rapidus has received JPY 920 billion in subsidies from the Japanese government, private companies remain hesitant to invest due to the company’s lack of track record.

Atsuyoshi Koike added that, given the current situation, it is difficult for Rapidus to secure private financing. The company is discussing ways to make financing easier, such as implementing a government loan guarantee system.

Read more

• [News] Japanese Government Reportedly Plans to Offer Guaranteed Loans to Chip Startup Rapidus
• [News] Rapidus Partners RISC-V Player Esperanto, Targeting Low-Power AI Chip

(Photo credit: Rapidus)

China’s two major semiconductor foundries, Semiconductor Manufacturing International Corporation (SMIC) and Hua Hong Semiconductor, released their Q2 2024 financial results on August 8.

Both companies reported sharp declines in net profit. SMIC, the leading foundry, saw its Q2 revenue increase by 21.8% year-over-year to USD 1.901 billion, but its net profit fell by 59.1% to USD 165 million.

Moreover, SMIC’s financial report indicates that the company expects its revenue to increase by 13% to 15% quarter-over-quarter in the third quarter, with a gross margin between 18% and 20%.

SMIC stated that its second-quarter revenue and gross margin both exceeded expectations, driven by an increase in wafer sales. Its revenue grew by 9% quarter-over-quarter to USD 1.9 billion, and the gross margin rose by 0.2 percentage points to 13.9%.

The company shipped over 2.11 million 8-inch equivalent wafers, marking an 18% increase from the previous quarter. However, the average selling price per wafer declined by 8% due to changes in the product mix.

On the other hand, Hua Hong Semiconductor’s Q2 revenue decreased by 24.2% year-over-year to USD 478.524 million, primarily due to a decline in average selling prices, though this was in line with expectations. Net profit dropped by 91.5% to USD 6.673 million. The gross margin stood at 10.5%.

Hua Hong Semiconductor’s financial report projects that third-quarter revenue will be between USD 500 million and 520 million, with a gross margin of approximately 10% to 12%.

Hua Hong Semiconductor’s President, Junjun Tang, further noted that the global semiconductor market is experiencing a gradual recovery from its bottom. After several quarters of sustained weakness, there are signs of stabilization and recovery in certain areas, driven by sectors like consumer electronics. The company’s second-quarter capacity utilization improved further from the first quarter, nearing full production.

Read more

• [News] Huawei’s Mate 70 Will Reportedly Use a Kirin SoC Made with SMIC’s 7nm Node instead of 5nm
• [News] SMIC Reportedly to Manufacture 5nm Chips for Huawei Without EUV Machinery

(Photo credit: SMIC)