Intel announced today an expansion of its packaging and testing facility in Chengdu, China. In addition to packaging and testing for client products, the facility will now offer services for server chips and will establish a Customer Solutions Center aimed at boosting local supply chain efficiency, enhancing support for Chinese clients, and improving response times. Planning and construction for these enhancements are already underway.

Under Intel’s expansion plan for the Chengdu base, the added capacity will primarily focus on packaging and testing services for server chips to meet Chinese clients’ demands for high-efficiency, customized packaging solutions.

The soon-to-be-launched Intel Customer Solutions Center is designed as a one-stop platform to support enterprise digital transformation, offering industry clients tailored solutions based on Intel’s architecture and products.

According to Intel’s public information, the Chengdu packaging and testing base is one of the company’s largest globally. ESM China reports that the facility has become one of Intel’s three major wafer preprocessing sites worldwide, supplying half of Intel’s mobile device microprocessors.

Located in Chengdu’s High-Tech Comprehensive Bonded Zone, Intel’s packaging and testing facility began its journey in August 2003 when the company announced plans to build a semiconductor packaging and testing factory in the city’s High-Tech West Zone. Construction of the first phase started in February 2004, and by late 2005, the facility was operational, with products exported worldwide. The second phase broke ground in August 2005, and by October 2006, construction was completed, including the training center, while the microprocessor facility began production in 2007, packaging Intel’s most advanced multi-core microprocessors.

(Photo credit: Intel)