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    • Shinkawa

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    2023-12-07

    [News] Samsung Boosts 2.5D Packaging Equipment to Compete for TSMC’s CoWoS Orders

    Semiconductors

    Samsung, the Korean tech giant, has unveiled SAINT technology to counter TSMC's advanced CoWoS packaging, aiming to benefit from the surging AI market. Market reports reveal that Samsung is strategically procuring a substantial amount of 2.5D packaging equipment, indicating a keen awareness of the s...

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